Radio-frequency localization techniques and associated systems, devices, and methods

Abstract

A device comprising: a substrate; a semiconductor die mounted on the substrate; a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency different than the first center frequency; and circuitry integrated with the semiconductor die and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna.

What is claimed is: 
     
       1. A device comprising:
 a substrate; 
 a semiconductor die mounted on the substrate; 
 a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals at least at a first center frequency; 
 a receive antenna fabricated on the substrate and configured to receive RF signals at least at a second center frequency that is different from the first center frequency; 
 a frequency selective surface (FSS) fabricated on the substrate and configured to reduce electromagnetic coupling between the transmit antenna and the receive antenna; and 
 circuitry integrated with the semiconductor die mounted on the substrate and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna, 
 wherein the transmit antenna is configured to transmit a first RF signal having the first center frequency to an electronic target device, 
 wherein the receive antenna is configured to receive a second RF signal having the second center frequency and transmitted by the electronic target device, and 
 wherein the circuitry is configured to generate, based on the first RF signal and the second RF signal, a third RF signal indicative of a distance between the device and the electronic target device. 
 
     
     
       2. The device of  claim 1 , wherein the semiconductor die is flip-chip bonded to the substrate. 
     
     
       3. The device of  claim 2 , wherein the device is a packaged device comprising:
 first level connections formed by flip-chip bonding the semiconductor die to the substrate; 
 second level connections configured to connect the packaged device to a printed circuit board; and 
 a protective encapsulation for at least the semiconductor die. 
 
     
     
       4. The device of  claim 3 , wherein the second level connections comprise a ball grid array formed on the bottom surface of the substrate. 
     
     
       5. The device of  claim 1 , wherein the substrate comprises a printed circuit board having at least one conductive layer, and wherein the transmit antenna and the receive antenna are fabricated on the substrate by patterning the at least one conductive layer. 
     
     
       6. The device of  claim 5 , wherein at least one of the transmit antenna and the receive antenna are isotropic. 
     
     
       7. The device of  claim 1 ,
 wherein the circuitry comprises a frequency mixer configured to generate the third RF signal using the first RF signal and the second RF signal. 
 
     
     
       8. The device of  claim 1 , wherein the circuitry comprises a frequency multiplier for transforming received RF signals having the second center frequency to RF signals having the first center frequency. 
     
     
       9. The device of  claim 1 , wherein the transmit antenna is configured to transmit microwave RF signals and the receive antenna is configured to receive microwave RF signals. 
     
     
       10. The device of  claim 1 , wherein the first center frequency is between 50 GHz and 70 GHz and the second center frequency is between 100 GHz and 140 GHz. 
     
     
       11. The device of  claim 1 , wherein the FSS comprises a periodic array. 
     
     
       12. The device of  claim 1 , wherein the FSS is configured to attenuate RF signals having the first center frequency and/or RF signals having the second center frequency. 
     
     
       13. A device comprising:
 a substrate; 
 a semiconductor die mounted on the substrate; 
 a transmit antenna fabricated on the substrate and configured to transmit radio-frequency (RF) signals circularly polarized in a first rotational direction; 
 a receive antenna fabricated on the substrate and configured to receive RF signals circularly polarized in a second rotational direction different from the first rotational direction; 
 a frequency selective surface (FSS) fabricated on the substrate and configured to reduce electromagnetic coupling between the transmit antenna and the receive antenna; and 
 circuitry integrated with the semiconductor die mounted on the substrate and configured to provide RF signals to the transmit antenna and to receive RF signals from the receive antenna 
 wherein the transmit antenna is configured to transmit a first RF signal circularly polarized in the first rotational direction to an electronic target device, 
 wherein the receive antenna is configured to receive a second RF signal circularly polarized in the second rotational direction and transmitted by the electronic target device, and 
 wherein the circuitry is configured to generate, based on the first RF signal and the second RF signal, a third RF signal indicative of a distance between the device and the electronic target device. 
 
     
     
       14. The device of  claim 13 , wherein the semiconductor die is flip-chip bonded to the substrate. 
     
     
       15. The device of  claim 14 , wherein the device is a packaged device comprising:
 first level connections formed by flip-chip bonding the semiconductor die to the substrate; 
 second level connections configured to connect the packaged device to a printed circuit board; and 
 a protective encapsulation for at least the semiconductor die. 
 
     
     
       16. The device of  claim 13 , wherein the second level connections comprise a ball grid array formed on the bottom surface of the substrate. 
     
     
       17. The device of  claim 13 , wherein the substrate comprises a printed circuit board having at least one conductive layer, and wherein the transmit antenna and the receive antenna are fabricated on the substrate by patterning the at least one conductive layer. 
     
     
       18. The device of  claim 17 , wherein at least one of the transmit antenna and the receive antenna are isotropic. 
     
     
       19. The device of  claim 17 , wherein at least one of the transmit antenna and the receive antenna are directional. 
     
     
       20. The device of  claim 13 ,
 wherein the circuitry comprises a frequency mixer configured to generate the third RF signal using the first RF signal and the second RF signal. 
 
     
     
       21. The device of  claim 13 , wherein the transmit antenna is configured to transmit microwave RF signals and the receive antenna is configured to receive microwave RF signals. 
     
     
       22. The device of  claim 13 , wherein the FSS comprises a periodic array. 
     
     
       23. A system, comprising:
 an interrogator device, comprising:
 a first substrate; 
 a first semiconductor die mounted on the first substrate; 
 a first transmit antenna fabricated on the first substrate and configured to transmit radio-frequency (RF) signals having a first center frequency to an electronic target device; 
 a first receive antenna fabricated on the first substrate and configured to receive, from the electronic target device, RF signals having a second center frequency that is different from the first center frequency; 
 a frequency selective surface (FSS) fabricated on the first substrate and configured to reduce electromagnetic coupling between the first transmit antenna and the first receive antenna; and 
 first circuitry integrated with the first semiconductor die mounted on the first substrate and configured to provide RF signals to the first transmit antenna and to receive RF signals from the first receive antenna; and 
 
 the electronic target device, comprising:
 a second substrate; 
 a second semiconductor die mounted on the second substrate; 
 a second receive antenna fabricated on the second substrate and configured to receive, from the interrogator device, RF signals having the first center frequency; 
 a second transmit antenna fabricated on the second substrate and configured to transmit, to the interrogator device, RF signals having the second center frequency; and 
 second circuitry integrated with the second semiconductor die mounted on the second substrate and configured to:
 generate, from RF signals provided from the second receive antenna and having the first center frequency, RF signals having the second center frequency, and 
 provide the generated RF signals having the second center frequency to the second transmit antenna. 
 
 
 
     
     
       24. The system of  claim 23 , wherein the FSS comprises a periodic array. 
     
     
       25. The system of  claim 23 , wherein the FSS is configured to attenuate RF signals having the first center frequency and/or RF signals having the second center frequency.