Antenna-in-package system and mobile terminal

Abstract

An antenna-in-package system and a mobile terminal are provided. The mobile terminal includes a main board. The antenna-in-package system includes a substrate, a metal antenna provided on a side of the substrate facing away from the main board, an integrated circuit chip provided on a side of the substrate close to the main board, and a circuit provided in the substrate and connecting the metal antenna to the integrated circuit chip. The circuit is connected to the main board. The metal antenna is a patch antenna simultaneously fed with power by two feeding points. The two feeding points are used to excite electromagnetic waves in different bands. The antenna-in-package system provided by the present disclosure achieves dual-band coverage of 28 GHz and 39 GHz, and a size is reduced to 18×5 mm, so that an occupied area is greatly reduced, and a gain reduction is small.

What is claimed is: 
     
       1. An antenna-in-package system, applied to a mobile terminal comprising a main board, the antenna-in-package system comprising:
 a substrate; 
 a metal antenna provided on a side of the substrate facing away from the main board; 
 an integrated circuit chip provided on a side of the substrate close to the main board; and 
 a circuit provided in the substrate and connected to the main board, the circuit connecting the metal antenna with the integrated circuit chip, 
 wherein the metal antenna is a patch antenna simultaneously fed with power by two feeding points, and the two feeding points are configured to excite electromagnetic waves in different bands; 
 the two feeding points comprise a first feeding point and a second feeding point, the first feeding point is configured to excite electromagnetic waves in a band of 28 GHz, and the second feeding point is configured to excite electromagnetic waves in a band of 39 GHz; 
 the antenna-in-package system is formed by being laminated by a LTCC process, and the size of the antenna-in-package system is 18×5 mm. 
 
     
     
       2. The antenna-in-package system as described in  claim 1 , wherein each of the two feeding points is connected to the circuit by a feeding probe. 
     
     
       3. A mobile terminal, comprising the antenna-in-package system as described in  claim 2 . 
     
     
       4. The antenna-in-package system as described in  claim 1 , wherein the antenna-in-package system is a millimeter wave phased array antenna system. 
     
     
       5. The antenna-in-package system as described in  claim 4 , wherein the metal antenna is arranged in a one-dimensional linear array and comprises a plurality of metal antenna units, and the plurality of metal antenna units is sequentially arranged at intervals. 
     
     
       6. A mobile terminal, comprising the antenna-in-package system as described in  claim 5 . 
     
     
       7. A mobile terminal, comprising the antenna-in-package system as described in  claim 4 . 
     
     
       8. The antenna-in-package system as described in  claim 1 , wherein the metal antenna is selected from a group consisting of a square patch antenna, a ring patch antenna, a circular patch antenna, and a cross-shaped patch antenna. 
     
     
       9. A mobile terminal, comprising the antenna-in-package system as described in  claim 8 . 
     
     
       10. The antenna-in-package system as described in  claim 1 , wherein the substrate is a multilayer high-frequency low-loss plate. 
     
     
       11. A mobile terminal, comprising the antenna-in-package system as described in  claim 10 . 
     
     
       12. A mobile terminal, comprising the antenna-in-package system as described in  claim 1 .