Semiconductor relay module

Abstract

In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.

The invention claimed is: 
     
       1. A semiconductor relay module comprising:
 a first semiconductor relay and a second semiconductor relay connected in series; 
 a third semiconductor relay disposed between a grounding point and a connection midpoint of the first semiconductor relay and the second semiconductor relay; 
 a package configured to house the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay, wherein the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay are arranged along a longitudinal direction of the package; and 
 a first input terminal, a second input terminal, and a third input terminal that are provided in the package and disposed so as to be partially exposed to an outside of the package, 
 wherein 
 each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay has a pair of input parts, and 
 inside the package, one of the pair of input parts of the first semiconductor relay is connected to the first input terminal, another of the pair of input parts of the first semiconductor relay is connected to the second input terminal, one of the pair of input parts of the second semiconductor relay is connected to the second input terminal, another of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of the pair of input parts of the third semiconductor relay is connected to the third input terminal, and another of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal. 
 
     
     
       2. The semiconductor relay module according to  claim 1 , further comprising
 a first output terminal, a second output terminal, and a third output terminal that are provided in the package and disposed so as to be partially exposed to the outside of the package, 
 wherein 
 each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay has a pair of output parts, and 
 inside the package, one of the pair of output parts of the first semiconductor relay is connected to a first output terminal, one of the pair of output parts of the second semiconductor relay is connected to the second output terminal, another of the pair of output parts of the first semiconductor relay and another of the pair of output parts of the second semiconductor relay are connected to each other, one of the pair of output parts of the third semiconductor relay is connected to the third output terminal, and another of the pair of output parts of the third semiconductor relay is connected to a connection midpoint between the other of the pair of output parts of the first semiconductor relay and the other of the pair of output parts of the second semiconductor relay. 
 
     
     
       3. The semiconductor relay module according to  claim 2 , wherein the second semiconductor relay is disposed between the first semiconductor relay and the third semiconductor relay. 
     
     
       4. The semiconductor relay module according to  claim 2 , wherein the third semiconductor relay is disposed between the first semiconductor relay and the second semiconductor relay. 
     
     
       5. The semiconductor relay module according to  claim 2 , wherein each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
     
     
       6. The semiconductor relay module according to  claim 2 , wherein
 each of the first semiconductor relay and the second semiconductor relay is a low on-resistance type semiconductor relay with an output on-resistance being greater than zero and less than or equal to 7Ω, and 
 the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
 
     
     
       7. The semiconductor relay module according to  claim 1 , wherein the second semiconductor relay is disposed between the first semiconductor relay and the third semiconductor relay. 
     
     
       8. The semiconductor relay module according to  claim 7 , wherein each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
     
     
       9. The semiconductor relay module according to  claim 7 , wherein
 each of the first semiconductor relay and the second semiconductor relay is a low on-resistance type semiconductor relay with an output on-resistance being greater than zero and less than or equal to 7Ω, and 
 the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
 
     
     
       10. The semiconductor relay module according to  claim 1 , wherein the third semiconductor relay is disposed between the first semiconductor relay and the second semiconductor relay. 
     
     
       11. The semiconductor relay module according to  claim 10 , wherein each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
     
     
       12. The semiconductor relay module according to  claim 10 , wherein
 each of the first semiconductor relay and the second semiconductor relay is a low on-resistance type semiconductor relay with an output on-resistance being greater than zero and less than or equal to 7Ω, and 
 the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
 
     
     
       13. The semiconductor relay module according to  claim 1 , wherein each of the first semiconductor relay, the second semiconductor relay, and the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF. 
     
     
       14. The semiconductor relay module according to  claim 1 , wherein
 each of the first semiconductor relay and the second semiconductor relay is a low on-resistance type semiconductor relay with an output on-resistance being greater than zero and less than or equal to 7Ω, and 
 the third semiconductor relay is a two-low-terminal capacitance type semiconductor relay with a capacitance between output terminals being greater than zero and less than or equal to 12 pF.