Method and system for cardboard pretreatment

Abstract

A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

What is claimed is: 
     
       1. A cardboard pretreatment system comprising:
 a creasing module for creating at least one crease on a cardboard, along at least one line; and a processing module for processing the cardboard along the at least one line; and 
 wherein, the processing module is a laser module configured to direct a laser beam toward the cardboard along the at least one line; and 
 wherein the creasing module is configured to create the at least one crease to reduce the thickness of the cardboard along said at least one line prior to exposure to the laser beam of the processing module. 
 
     
     
       2. The cardboard pretreatment system of  claim 1  wherein the processing module comprises at least one module selected from the group consisting of: a cutting module, a scoring module, a perforating module, a partially cutting module, and a marking module. 
     
     
       3. The cardboard pretreatment system of  claim 1 , further comprising a controller for controlling passage of an input cardboard through the creasing module where the at least one pre-process crease is applied to the cardboard, and through the processing module where a cut is applied using the laser beam along the at least one pre-process crease. 
     
     
       4. The cardboard pretreatment system of  claim 1 , wherein the creasing module is also configured to create at least one crease on the cardboard, along which no further processing is required. 
     
     
       5. The cardboard pretreatment system of  claim 1 , wherein the cardboard is corrugated cardboard and wherein the creasing module reduces a thickness of the cardboard along the at least one pre-processing crease. 
     
     
       6. The cardboard pretreatment system of  claim 5 , wherein the processing module is a laser module having a depth of focus and wherein the thickness of the cardboard is reduced to a value smaller than the depth of focus.