Copolyamides containing dimeric fatty acid as monomer

Abstract

The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

The invention claimed is: 
     
       1. A moulding consisting of a moulding compound comprising an amorphous or microcrystalline copolyamide (A) containing at least the following monomers:
 (a) at least one cycloaliphatic diamine; 
 (b) 1.7 to 4.0 mol % of at least one dimeric fatty acid; and 
 (c) 12 to 48.3 mol % of aromatic dicarboxylic acids selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, wherein the proportion of the isophthalic acid based on the sum total of all the monomers in the copolyamide (A) is 7 to 44 mol %, and 
 (d) 5 to 25.5 mol % of at least one aliphatic dicarboxylic acid; 
 where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %, 
 wherein the amorphous or microcrystalline copolyamide (A) has a relative viscosity in the range from 1.50 to 2.15, measured on a solution of 0.5 g of the copolyamide in 100 ml of m-cresol at 20° C., a glass transition temperature of at least 190° C., and a dielectric loss factor of not more than 8.3×10 −3 ; 
 wherein the moulding is produced via injection moulding. 
 
     
     
       2. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) contains at least the following monomers with the following molar proportions:
 40 to 50 mol % of cycloaliphatic diamine (a); 
 1.7 to 4.0 mol % of dimeric fatty acid (b); 
 14 to 44 mol % of aromatic dicarboxylic acid (c); and 
 5 to 25.5 mol % of aliphatic dicarboxylic acid (d); 
 where the proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. 
 
     
     
       3. The moulding according to  claim 1 , wherein
 the proportion of isophthalic acid based on the sum total of all the monomers in the copolyamide (A) is 11.5 to 27 mol %, and/or 
 the proportion of terephthalic acid based on the sum total of all the monomers in the copolyamide is 0 to 22 mol %. 
 
     
     
       4. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A)
 has a light transmittance measured according to ASTM D 1003-13 (2013) on a plaque of thickness 2 mm produced therefrom of at least 75%. 
 
     
     
       5. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) contains at least the following monomers:
 (a) at least one cycloaliphatic diamine component selected from the group consisting of bis(4-amino-3-methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-ethylcyclohexyl)methane, bis(4-amino-3,5-dimethylcyclohexyl)methane, norbornane-2,6-diamine or 2,6-bis(aminomethyl)norbornane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, isophoronediamine, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 2,2-(4,4′-diaminodicyclohexyl)propane, and mixtures thereof; 
 (b) at least one dimeric fatty acid selected from the group consisting of dimeric fatty acids having 36 or 44 carbon atoms and mixtures thereof; 
 (c) at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and mixtures thereof; and 
 (d) at least one aliphatic dicarboxylic acid selected from the group consisting of hexane-1,6-dioic acid, nonane-1,9-dioic acid, decane-1,10-dioic acid, undecane-1,11-dioic acid, dodecane-1,12-dioic acid, tridecane-1,13-dioic acid, tetradecane-1,14-dioic acid, octadecane-1,18-dioic acid, cyclohexane-1,3-dicarboxylic acid, cyclohexane-1,4-dicarboxylic acid, and mixtures thereof. 
 
     
     
       6. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) contains at least the following monomers:
 (a) at least one cycloaliphatic diamine component selected from the group consisting of bis((4-amino-3-methylcyclohexyl)methane, bis((4-aminocyclohexyl)methane, bis((4-amino-3,5-dimethylcyclohexyl)methane and mixtures thereof; 
 (b) at least one dimeric fatty acid having 36 carbon atoms; 
 (c) isophthalic acid and terephthalic acid; and 
 (d) at least one aliphatic dicarboxylic acid selected from the group consisting of dodecane-1,12-dioic acid, tetradecane-1,14-dioic acid, octadecane-1,18-dioic acid, and mixtures thereof. 
 
     
     
       7. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) contains at least one aliphatic dicarboxylic acid as further monomer (d). 
     
     
       8. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) is selected from the group consisting of TMDCI/TMDC12/TMDC36, TMDCI/TMDC14/TMDC36, TMDCI/TMDC9/TMDC36, TMDCI/TMDCCHD/TMDC36, TMDCI/TMDC11/TMDC36, TMDCI/TMDC13/TMDC36, TMDCI/TMDC18/TMDC36, TMDCI/TMDCT/TMDC12/TMDC36, TMDCI/TMDCT/TMDC14/TMDC36, TMDCI/TMDCT/TMDC18/TMDC36, TMDCI/TMDCT/TMDC9/TMDC36, TMDCI/TMDCT/TMDCCHD/TMDC36, TMDCI/TMDCT/TMDC12/TMDCCHD/TMDC36 and mixtures thereof,
 where TMDC is optionally wholly or partly replaced by MACM, and/or where the dimeric fatty acid having 36 carbon atoms is optionally wholly or partly replaced by a dimeric fatty acid having 44 carbon atoms. 
 
     
     
       9. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) is selected from the group consisting of TMDCI/TMDC12/TMDC36, TMDCI/TMDC14/TMDC36, TMDCI/TMDC18/TMDC36, TMDCI/TMDCT/TMDC12/TMDC36, TMDCI/TMDCT/TMDC14/TMDC36, TMDCI/TMDCT/TMDC18/TMDC36 and mixtures thereof,
 where TMDC is optionally wholly or partly replaced by MACM, and/or where the dimeric fatty acid having 36 carbon is optionally wholly or partly replaced by a dimeric fatty acid having 44 carbon atoms. 
 
     
     
       10. The moulding according to  claim 1 , wherein the amorphous or microcrystalline copolyamide (A) is selected from the group consisting of TMDCI/TMDC12/TMDC36, TMDCI/TMDC14/TMDC36, TMDCI/TMDCT/TMDC12/TMDC36, TMDCI/TMDCT/TMDC14/TMDC36 MACMI/MACM12/MACM36, MACMI/MACM14/MACM36, MACMI/MACMT/MACM12/MACM36, MACMI/MACMT/MACM14/MACM36 and mixtures thereof. 
     
     
       11. The moulding according to  claim 1 , wherein the moulding compound comprises
 at least one additive (B), and/or optionally 
 at least one further polymer (C) different from the copolyamide (A) and different from the additive (B). 
 
     
     
       12. The moulding according to  claim 1 , wherein the moulding compound has the following composition:
 70% to 100% by weight of copolyamide (A), 
 0% to 10% by weight of additive (B), and 
 0% to 20% by weight of polymer (C), 
 where components (A) to (C) add up to 100% by weight. 
 
     
     
       13. A moulding consisting of a moulding compound comprising an amorphous or microcrystalline copolyamide (A) containing at least the following monomers:
 (e) at least one cycloaliphatic diamine; 
 (f) 1.7 to 4.0 mol % of at least one dimeric fatty acid; 
 (g) 12 to 48.3 mol % of aromatic dicarboxylic acids selected from the group consisting of isophthalic acid, terephthalic acid, and naphthalenedicarboxylic acid, wherein the proportion of isophthalic acid based on the sum total of all the monomers in the copolyamide (A) is 7 to 44 mol %, and 
 (h) 5 to 25.5 mol % of at least one aliphatic dicarboxylic acid; 
 where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and 
 where the monomers (b), (c) and (d) add up to 50 mol % and the molar proportions of all of the monomers present in the copolyamide (A) add up to 100 mol %, 
 wherein the amorphous or microcrystalline copolyamide (A) has 
 a relative viscosity in the range from 1.50 to 2.15, measured on a solution of 0.5 g of polyamide in 100 ml of m-cresol at 20° C., 
 a glass transition temperature of at least 190° C.; and 
 a dielectric loss factor of not more than 8.3×10 −3 , 
 wherein the moulding is selected from the group consisting of dishware, dishes, pots, cups, beakers, plates, lids, sauce boats, flasks, covering trays, undertrays and serving trays. 
 
     
     
       14. A moulding consisting of a moulding compound comprising an amorphous or microcrystalline copolyamide (A) containing at least the following monomers:
 (i) at least one cycloaliphatic diamine; 
 (j) 1.7 to 4.0 mol % of at least one dimeric fatty acid; 
 (k) 12 to 48.3 mol % of aromatic dicarboxylic acids selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, wherein the proportion of isophthalic acid based on the sum total of all the monomers in the copolyamide (A) is 7 to 44 mol %, and 
 (l) 5 to 25.5 mol % of at least one aliphatic dicarboxylic acid; 
 where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %, 
 wherein the amorphous or microcrystalline copolyamide (A) has a relative viscosity in the range from 1.50 to 2.15, measured on a solution of 0.5 g of polyamide in 100 ml of m-cresol at 20° C., 
 a glass transition temperature of at least 190° C.; and a dielectric loss factor of not more than 8.3×10 −3 , wherein the moulding is produced via injection moulding and is selected from the group consisting of dishware, dishes, pots, cups, beakers, plates, lids, sauce boats, flasks, covering trays, undertrays and serving trays.