US11097375B2ActiveUtilityA1

Laser processing apparatus and laser processing method

74
Assignee: FUJIKURA LTDPriority: Mar 17, 2017Filed: Mar 16, 2018Granted: Aug 24, 2021
Est. expiryMar 17, 2037(~10.7 yrs left)· nominal 20-yr term from priority
B23K 26/082B23K 26/0626B23K 26/21B23K 26/064B23K 26/0648B23K 26/00B23K 26/0622B23K 26/22
74
PatentIndex Score
1
Cited by
15
References
8
Claims

Abstract

A laser processing apparatus 10 includes a continuous-wave laser oscillator 12 for generating a continuous-wave laser beam, a condenser lens 18 for concentrating a continuous-wave laser beam onto a workpiece, and a delay time setting means for calculating an energy value for each processing by a continuous-wave laser beam irradiation on the basis of processing data and accumulating the calculated energy value, and setting a predetermined delay time between the processings when the accumulated energy value exceeds a predetermined threshold.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A laser processing apparatus comprising:
 a continuous-wave laser oscillator configured to generate a continuous-wave laser beam; and 
 a condenser lens configured to concentrate the continuous-wave laser beam onto a workpiece, 
 the laser processing apparatus configured to irradiate the workpiece with the continuous-wave laser beam according to processing data to perform processings,
 the laser processing apparatus comprising a controller, the controller being configured to calculate an energy value for each processing by the continuous-wave laser beam irradiation based on the processing data and accumulate the calculated energy value, and set a predetermined delay time between the processings when the accumulated energy value exceeds a predetermined threshold, 
 
 wherein the controller is configured to set the predetermined delay time based on a calculated maximum temperature associated with the condenser lens, and a measured temperature drop rate associated with the condenser lens. 
 
     
     
       2. The laser processing apparatus according to  claim 1 , wherein the controller is configured to calculate the energy value for each processing by the continuous-wave laser beam irradiation from power output of the continuous-wave laser beam and processing time included in the processing data. 
     
     
       3. The laser processing apparatus according to  claim 1 , comprising a motor configured to rotate the condenser lens about an optical axis thereof instead of setting at least one delay time when a cycle time of an entire processing process including the delay time exceeds a permissible cycle time. 
     
     
       4. The laser processing apparatus according to  claim 2 , comprising a motor configured to rotate the condenser lens about an optical axis thereof instead of setting at least one delay time when a cycle time of an entire processing process including the delay time exceeds a permissible cycle time. 
     
     
       5. The laser processing apparatus according to  claim 1 , wherein the processing includes welding, and the laser processing apparatus comprises a scanner configured to scan the continuous-wave laser beam to form a welded portion larger than a spot diameter of the continuous-wave laser beam when the welding is performed. 
     
     
       6. The laser processing apparatus according to  claim 2 , wherein the processing includes welding, and the laser processing apparatus comprises a scanner configured to scan the continuous-wave laser beam to form a welded portion larger than a spot diameter of the continuous-wave laser beam when the welding is performed. 
     
     
       7. The laser processing apparatus according to  claim 3 , wherein the processing includes welding, and the laser processing apparatus comprises a scanner configured to scan the continuous-wave laser beam to form a welded portion larger than a spot diameter of the continuous-wave laser beam when the welding is performed. 
     
     
       8. The laser processing apparatus according to  claim 4 , wherein the processing includes welding, and the laser processing apparatus comprises scanner configured to scan the continuous-wave laser beam to form a welded portion larger than a spot diameter of the continuous-wave laser beam when the welding is performed.

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