US11189764B2ActiveUtilityA1

Light-emitting device and manufacturing method thereof

65
Assignee: NICHIA CORPPriority: Nov 22, 2018Filed: Nov 19, 2019Granted: Nov 30, 2021
Est. expiryNov 22, 2038(~12.4 yrs left)· nominal 20-yr term from priority
H10H 20/855H10H 20/854H10H 20/853H10H 20/841H10H 20/814H10H 20/8511H10H 20/835H10H 20/856H10H 20/857H01L 33/58H01L 33/56H01L 33/10H01L 33/54H01L 33/60H01L 33/46
65
PatentIndex Score
0
Cited by
13
References
23
Claims

Abstract

A light-emitting device includes: a base body comprising a resin member, a first lead, and a second lead, wherein the first lead and the second lead are supported by the resin member; a light-emitting element mounted on an upper surface of the base body; a resin frame located on the upper surface of the base body, surrounding the light-emitting element; and a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of an inner side surface of the resin frame, and the upper surface of the base body, wherein the first resin includes: a reflection material layer that contains a reflection material, and a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A light-emitting device comprising:
 a base body comprising a resin member, a first lead, and a second lead, wherein the first lead and the second lead are supported by the resin member; 
 a light-emitting element mounted on an upper surface of the base body, wherein the light-emitting element comprises an element-substrate, and a semiconductor layer located on the element-substrate; 
 a resin frame located on the upper surface of the base body, surrounding the light-emitting element; and 
 a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of an inner side surface of the resin frame, and the upper surface of the base body, wherein the first resin comprises:
 a reflective material layer that contains a reflective material, and 
 a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material; 
 
 wherein the reflective material is located in the reflective material layer to cover the upper surface of the base body; 
 wherein, in a cross-sectional view, an upper surface of the resin layer comprises a flat region and a sloped region, and, in the sloped region, a height of the upper surface of the resin layer, measured from the upper surface of the base body, gradually increases in an outward direction from the flat region as the upper surface of the resin layer approaches the inner side surface of the resin frame; and 
 wherein, in the cross-sectional view, a height of an upper surface of the first resin measured from the base body is less than a height of a bottom surface of the semiconductor layer measured from the base body. 
 
     
     
       2. The light-emitting device according to  claim 1 ,
 wherein an entire side surface of the resin layer facing toward the resin frame contacts to the resin frame. 
 
     
     
       3. The light-emitting device according to  claim 1 , further comprising:
 a second resin covering an upper surface of the light-emitting element and an upper surface of the first resin. 
 
     
     
       4. The light-emitting device according to  claim 3 ,
 wherein the second resin comprises a phosphor. 
 
     
     
       5. The light-emitting device according to  claim 1 ,
 wherein the light-emitting element is mounted on the first lead; and 
 wherein the resin frame is located to cover a connection portion of the first lead and the resin member. 
 
     
     
       6. The light-emitting device according to  claim 1 ,
 wherein the reflective material is titanium oxide. 
 
     
     
       7. The light-emitting device according to  claim 1 ,
 wherein the resin frame and the first resin contain a base resin of a same material. 
 
     
     
       8. The light-emitting device according to  claim 1 ,
 wherein, in the cross-sectional view, an inner side surface of the resin frame has a curved shape that bulges to a side facing toward the light-emitting element. 
 
     
     
       9. The light-emitting device according to  claim 8 ,
 wherein, in the cross-sectional view, the upper surface of the first resin covering the inner side surface of the resin frame has a height measured from the upper surface of the base body that is less than that of a position of an inner-most point of the resin frame. 
 
     
     
       10. The light-emitting device according to  claim 8 ,
 wherein a portion of the resin layer is located below an inner-most point of the resin frame. 
 
     
     
       11. A light-emitting device comprising:
 a base member; 
 a base body formed on an upper surface of the base member, the base body comprising a wiring layer; 
 a light-emitting element mounted on an upper surface of the base body, wherein the light-emitting element comprises an element-substrate, and a semiconductor layer located on the element-substrate; 
 a resin frame located on the upper surface of the base body; and 
 a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of inner side surface of the resin frame, and the upper surface of the base body, the first resin comprising:
 a reflective material layer that contains a reflective material, and 
 a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material; 
 
 wherein the reflective material is located in the reflective material layer to cover the upper surface of the base body; and 
 wherein the upper surface of the resin layer comprises a flat region and a sloped region, wherein a height of the upper surface of the resin layer, measured from the upper surface of the base body, gradually increases as the upper surface of the resin layer approaches the inner side surface of the resin frame; and 
 wherein, in the cross-sectional view, a height of an upper surface of the first resin measured from the base body is less than a height of a bottom surface of the semiconductor layer measured from the base body. 
 
     
     
       12. The light-emitting device according to  claim 11 ,
 wherein entire side surface of the resin layer facing toward the resin frame contacts to the resin frame. 
 
     
     
       13. The light-emitting device according to  claim 11 , further comprising:
 a second resin covering an upper surface of the light-emitting element and an upper surface of the first resin. 
 
     
     
       14. The light emitting device according to  claim 11 ,
 wherein the base member is formed of a ceramic material. 
 
     
     
       15. The light emitting device according to  claim 11 ,
 wherein the base member is formed of a metal material. 
 
     
     
       16. The light-emitting device according to  claim 1 ,
 wherein, in the cross-sectional view, the resin frame has a shape of a circle, a partial circle, an oval, a partial oval, or a rectangle. 
 
     
     
       17. The light-emitting device according to  claim 1 ,
 wherein, in the cross-sectional view, an inner side surface of the resin frame facing the light-emitting element has a convex shape. 
 
     
     
       18. The light-emitting device according to  claim 17 ,
 wherein, in the cross-sectional view, the reflective material layer extends under an innermost point of the inner side surface of the resin frame having the convex shape. 
 
     
     
       19. The light-emitting device according to  claim 18 ,
 wherein, in the cross-sectional view, the resin frame has a shape of a circle or a partial circle, and the innermost point of inner side surface of the resin frame is a point on the circle or the partial circle. 
 
     
     
       20. The light-emitting device according to  claim 1 ,
 wherein the reflective material layer and the resin layer have no interface therebetween. 
 
     
     
       21. The light-emitting device according to  claim 1 ,
 wherein, in the cross-sectional view, an entirety of the upper surface of the reflective material layer is flat. 
 
     
     
       22. The light-emitting device according to  claim 1 ,
 wherein, in the cross-sectional view, the upper surface of the resin layer comprises an additional sloped region, and, in the additional sloped region, a height of the upper surface of the resin layer, measured from the upper surface of the base body, gradually increases in an inward direction from the flat region as the upper surface of the resin layer approaches a lateral surface of the light-emitting element. 
 
     
     
       23. A light-emitting device comprising:
 a base body comprising a resin member, a first lead, and a second lead, wherein the first lead and the second lead are supported by the resin member; 
 a light-emitting element mounted on an upper surface of the base body; 
 a resin frame located on the upper surface of the base body, surrounding the light-emitting element, wherein, in the cross-sectional view, an inner side surface of the resin frame has a curved shape that bulges to a side facing toward the light-emitting element; and 
 a first resin located inside the resin frame to cover a part of side surfaces of the light-emitting element, a part of an inner side surface of the resin frame, and the upper surface of the base body, wherein the first resin comprises:
 a reflective material layer that contains a reflective material, and 
 a resin layer that is located on an upper surface of the reflective material layer and does not contain the reflective material; 
 
 wherein the reflective material is located in the reflective material layer to cover the upper surface of the base body; 
 wherein, in a cross-sectional view, an upper surface of the resin layer comprises a flat region and a sloped region, and, in the sloped region, a height of the upper surface of the resin layer, measured from the upper surface of the base body, gradually increases in an outward direction from the flat region as the upper surface of the resin layer approaches the inner side surface of the resin frame; and 
 wherein, in the cross-sectional view, a height of the upper surface of the first resin covering the inner side surface of the resin frame measured from the upper surface of the base body is less than a height of a position of an inner-most point of the resin frame measured from the upper surface of the base body.

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