US11248142B2ActiveUtilityPatentIndex 62
Encapsulating composition
Est. expiryDec 9, 2036(~10.4 yrs left)· nominal 20-yr term from priority
H10K 50/844C08G 65/18C08G 59/24C08G 59/223C08G 59/226C09D 11/101H10K 59/873C09D 163/00C08L 63/00C09D 11/30C08G 59/687H01L 51/0001H01L 51/52H01L 51/0035H01L 51/5253H10K 71/00H10K 85/111H10K 50/80
62
PatentIndex Score
0
Cited by
34
References
20
Claims
Abstract
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method and can provide a thin display.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. An encapsulating composition comprising:
a curable compound having a cyclic structure in its molecular structure and having at least two or more curable functional groups, and
a monofunctional curable compound in an amount of 65 parts by weight to 165 parts by weight relative to 100 parts by weight of the curable compound having a cyclic structure,
wherein the composition has a haze of 3% or less according to JIS K7105 standard test after curing, and
wherein the encapsulating composition is an ink composition.
2. The encapsulating composition according to claim 1 , further comprising a linear or branched aliphatic curable compound.
3. The encapsulating composition according to claim 2 , wherein the aliphatic curable compound has at least two or more curable functional groups.
4. The encapsulating composition according to claim 2 , wherein the aliphatic curable compound is comprised in an amount of 30 parts by weight to 200 parts by weight relative to 100 parts by weight of the curable compound having a cyclic structure.
5. The encapsulating composition according to claim 1 , further comprising a curable compound having an oxetane group.
6. The encapsulating composition according to claim 5 , wherein the curable compound having an oxetane group has at least two or more oxetane groups.
7. The encapsulating composition according to claim 5 , wherein the curable compound having an oxetane group is comprised in an amount of 50 parts by weight to 150 parts by weight relative to 100 parts by weight of the curable compound having a cyclic structure and the monofunctional curable compound.
8. The encapsulating composition according to claim 1 , wherein the curable functional group is one or more selected from a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, an amide group, an epoxide group, a sulfide group, an acetal group and a lactone group.
9. The encapsulating composition according to claim 1 , wherein the compound having a cyclic structure in its molecular structure has ring constituent atoms in the molecular structure in a range of 3 to 10.
10. The encapsulating composition according to claim 1 , further comprising a surfactant.
11. The encapsulating composition according to claim 10 , wherein the surfactant comprises a polar functional group.
12. The encapsulating composition according to claim 10 , wherein the surfactant comprises a fluorine-based compound.
13. The encapsulating composition according to claim 10 , wherein the surfactant is comprised in an amount of 0.01 parts by weight to 10 parts by weight relative to 100 parts by weight of the entire curable compound.
14. The encapsulating composition according to claim 1 , further comprising a photoinitiator.
15. The encapsulating composition according to claim 14 , wherein the photoinitiator is comprised in an amount of 1 to 15 parts by weight relative to 100 parts by weight of the entire curable compound.
16. The encapsulating composition according to claim 14 , further comprising a photosensitizer.
17. The encapsulating composition according to claim 16 , wherein the photosensitizer is comprised in a range of 28 parts by weight to 40 parts by weight relative to 100 parts by weight of the photoinitiator.
18. An organic electronic device, comprising:
a substrate;
an organic electronic element formed on the substrate; and
an organic layer sealing the entire surface of the organic electronic element,
wherein the organic layer comprises the encapsulating composition according to claim 1 .
19. A method for manufacturing an organic electronic device, comprising:
a step of forming an organic layer on a substrate in which an organic electronic element is formed on its upper part,
wherein the organic layer comprises the encapsulating composition of claim 1 , so that the encapsulating composition seals the entire surface of the organic electronic element.
20. The method for manufacturing an organic electronic device according to claim 19 , wherein the step of forming an organic layer comprises inkjet printing, gravure coating, spin coating, screen printing or reverse offset coating.Cited by (0)
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