Display panel having display area and component installation area, method of fabricating display panel having display area and component installation area, and display apparatus

Abstract

A method of fabricating a display panel having a display area and a component installation area substantially surrounded by the display area. The method includes forming one or more organic layers on a base substrate in both the display area and the component installation area; removing the one or more organic layers in at least a first region of the component installation area; forming an encapsulating material layer in at least the first region of the component installation area; and curing the encapsulating material layer.

What is claimed is: 
     
       1. A method of fabricating a display panel having a display area and a component installation area substantially surrounded by the display area, comprising:
 forming one or more organic layers on a base substrate in both the display area and the component installation area; 
 removing the one or more organic layers in at least a first region of the component installation area; 
 forming an encapsulating material layer in at least the first region of the component installation area; and 
 curing the encapsulating material layer; 
 wherein removing the one or more organic layers in at least a first region of the component installation area comprises sintering the one or more organic layers in the first region of the component installation area 
 wherein the method further comprises: 
 prior to sintering the one or more organic layers in the first region of the component installation area, forming an absorbent layer for absorbing a decomposed material during sintering in at least the first region, the absorbent layer formed on a side of the one or more organic layers away from the base substrate and formed in at least the first region; and 
 subsequent to sintering the one or more organic layers in the first region of the component installation area, further comprising removing the absorbent layer. 
 
     
     
       2. The method of  claim 1 , wherein the encapsulating material layer is formed in the first region of the component installation area and in a peripheral area surrounding the display area; and
 the encapsulating material layer is cured to form an encapsulating layer encapsulating the display area. 
 
     
     
       3. The method of  claim 1 , wherein curing the encapsulating material layer is performed by laser curing. 
     
     
       4. The method of  claim 1 , wherein the component installation area comprises the first region and a second region substantially surrounded by the first region; and
 the encapsulating material layer is absent in the second region. 
 
     
     
       5. The method of  claim 1 , wherein sintering the one or more organic layers in the first region of the component installation area is performed by laser sintering. 
     
     
       6. The method of  claim 1 , wherein the absorbent layer is formed by mechanically pasting a layer of absorbent material on a side of the one or more organic layers away from the base substrate in an inert atmosphere. 
     
     
       7. The method of  claim 1 , wherein removing the absorbent layer comprises:
 dislodging the absorbent layer by applying a flow of an insert gas toward one or more lateral sides of the absorbent layer; and 
 removing dislodged absorbent material of the absorbent layer by applying a vacuum suction on top of the absorbent layer. 
 
     
     
       8. The method of  claim 1 , wherein the absorbent layer comprises calcium oxide. 
     
     
       9. The method of  claim 1 , wherein the absorbent layer has a margin greater than 500 μm with respect to the first region. 
     
     
       10. The method of  claim 1 , wherein the absorbent layer has a thickness in a range of approximately 300 μm to approximately 500 μm. 
     
     
       11. The method of  claim 1 , wherein forming the encapsulating material layer in at least the first region of the component installation area comprises:
 forming the encapsulating material layer on an encapsulating substrate; and 
 assembling the encapsulating substrate with the base substrate from a side of the one or more organic layers away from the base substrate. 
 
     
     
       12. The method of  claim 11 , further comprising forming one or more spacers on a side of the one or more organic layers away from the base substrate.