Metal circuit on polymer composite substrate surface and method for manufacturing the same

Abstract

A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.

What is claimed is: 
     
       1. A metal circuit on a polymer composite substrate surface, comprising:
 a polymer composite layer; and 
 a metal circuit layer being formed from a metal piece molded by metal processing, and being integrated onto a surface of the polymer composite layer, wherein the metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove. 
 
     
     
       2. The metal circuit according to  claim 1 , wherein the polymer composite layer is one of an epoxy-based layer, a polyimide-based layer, and a polypropylene-based layer. 
     
     
       3. The metal circuit according to  claim 2 , wherein the polymer composite layer includes a filler, and the filler is selected from at least one of aluminum oxide, aluminum nitride, silicon nitride, silicon carbide, and boron nitride. 
     
     
       4. The metal circuit according to  claim 1 , wherein the metal circuit layer is formed by processing a stamped metal piece. 
     
     
       5. The metal circuit according to  claim 1 , wherein the metal circuit layer is formed by processing a forged metal piece. 
     
     
       6. The metal circuit according to  claim 1 , wherein a bulging height of the bulge is configured to be between 0.01 mm and 3 mm. 
     
     
       7. A method for manufacturing a metal circuit on a polymer composite substrate surface, the method comprising:
 (a) preforming a metal piece that has one or a plurality of circuit channels by metal processing; 
 (b) integrating the metal piece onto a surface of a polymer composite layer, so that the surface of the polymer composite layer is deformed and bulged to have one or a plurality of bulges at the one or plurality of circuit channels correspondingly; and 
 (c) removing a part of the metal piece, so that one or a plurality of circuit grooves is exposed to form a metal circuit layer having a patterned circuit, and the bulge is deformed and bulged at the corresponding circuit groove. 
 
     
     
       8. The method according to  claim 7 , wherein the metal piece is a stamped metal piece having the plurality of circuit channels, and is preformed by a stamping process. 
     
     
       9. The method according to  claim 7 , wherein the metal piece is a forged metal piece having the plurality of circuit channels, and is preformed by a forging process. 
     
     
       10. The method according to  claim 7 , wherein the part of the metal piece is removed by milling, planing or cutting.