Vacuum lamination system and vacuum lamination method

Abstract

A vacuum lamination system includes a film supply assembly, a film collection assembly, a lower lamination body, an upper lamination body, an air extractor, a moving assembly and a cutting assembly. The lower lamination body includes a first casing base and a lower heating assembly vertically movable and disposed in the first casing base. The lower heating assembly carries and moves the substrate so that the substrate is substantially flush with a top surface of the first casing base or retracted into the first casing base. The upper lamination body is vertically movable and disposed above the lower lamination body and includes an upper casing and an upper heating assembly disposed on the upper casing. The air extractor is connected to the lower lamination body. The moving assembly changes a height of a portion of the film. The cutting assembly cuts a portion of the film laminated onto the substrate.

What is claimed is: 
     
       1. A vacuum lamination system, adapted for fixing a film on a substrate, comprising
 a film supply assembly including a roller adapted for providing the film; 
 a film collection assembly including a roller adapted for recycling the film; 
 a lower lamination body located between the film supply assembly and the film collection assembly and comprising a first casing base and a lower heating assembly vertically movable and arranged in the first casing base, wherein the lower heating assembly comprises a lower heating layer and a lower wafer carrier tray and is adapted for carrying and moving the substrate so that the substrate is flush with a top surface of the first casing base and the substrate protrudes from the top surface of the first casing base or retracts into the first casing base; 
 an upper lamination body vertically movable and arranged above the lower lamination body and comprising an upper casing and an upper heating assembly arranged on the upper casing, wherein the upper heating assembly comprises an upper heat insulation layer and an upper heating layer; 
 an air extractor connected to the lower lamination body, wherein the lower lamination body further comprises a second casing base vertically movable and disposed under the first casing base, and an airtight flexible assembly being a vacuum bellow and arranged between the second casing base and the first casing base, wherein the lower heating assembly moves along with the second casing base; 
 a moving assembly, comprising a roller, movably disposed between the film supply assembly and the film collection assembly and adapted for changing a height of a portion of the film between the lower lamination body and the upper lamination body, and 
 a cutting assembly, with a cutter, movably disposed above the lower lamination body and adapted for cutting a portion of the film laminated onto the substrate. 
 
     
     
       2. The vacuum lamination system of  claim 1 , wherein the upper lamination body further comprises a flexible pad, a periphery of the flexible pad is fixed to the upper casing, the upper heating assembly is located between the upper casing and the flexible pad, the upper casing has an upper hole, and a space between the upper heating assembly and the flexible pad communicates with the upper hole. 
     
     
       3. The vacuum lamination system of  claim 1 , wherein the upper lamination body further comprises an upper driving assembly connected to the upper heating assembly to move the upper heating assembly relative to the upper casing. 
     
     
       4. The vacuum lamination system of  claim 3 , wherein the upper lamination body further comprises a flexible pad disposed on the upper heating assembly. 
     
     
       5. The vacuum lamination system of  claim 1 , wherein the upper heat insulation layer and the upper heating layer are arranged in sequence, and the upper heating layer is close to the lower lamination body. 
     
     
       6. The vacuum lamination system of  claim 1 , wherein the lower heating layer and the lower wafer carrier tray are arranged in sequence, and the lower wafer carrier tray is close to the upper lamination body. 
     
     
       7. A vacuum lamination method by using the vacuum lamination system of  claim 1 , comprising:
 disposing the film to be above the substrate, wherein a gap is formed between the film and the substrate; 
 extracting air between the film and the substrate; 
 bringing the substrate to be close to the film and heating and pressurizing the substrate and the film, so that the film is laminated onto the substrate; and 
 cutting a portion of the film that is laminated onto the substrate. 
 
     
     
       8. The vacuum lamination method of  claim 7 , wherein the step of disposing the film to be above the substrate further comprises:
 disposing the substrate on the lower heating assembly and lowering the lower heating assembly so that the substrate is lower than the top surface of the first casing base; and 
 disposing the film on the top surface of the first casing base. 
 
     
     
       9. The vacuum lamination method of  claim 8 , wherein the step of extracting the air between the film and the substrate further comprises:
 lowering the upper lamination body onto the first casing base of the lower lamination body to press against an upper surface of the film; and 
 extracting the air between the upper lamination body and the lower lamination body. 
 
     
     
       10. The vacuum lamination method of  claim 9 , wherein the step of bringing the substrate to be close to the film and heating and pressurizing the substrate and the film further comprises:
 lifting the lower heating assembly of the lower lamination body to bring the substrate close to a lower surface of the film, wherein a flexible pad of the upper lamination body and the lower heating assembly of the lower lamination body heat and pressurize the substrate and the film, so that the film is hot pressed onto the substrate. 
 
     
     
       11. The vacuum lamination method of  claim 9 , wherein after heating and pressurizing the substrate and the film and before cutting the film, the method further comprises:
 stopping pressurizing the substrate and the film; 
 destroying a negative pressure or vacuum state between the upper lamination body and the lower lamination body; and 
 lifting the upper lamination body and exposing the substrate and the portion of the film that is laminated onto the substrate.