Thermal conducting structure

Abstract

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh extends through the opening into the cavity to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

What is claimed is: 
     
       1. A thermal conducting structure, comprising:
 a vapor chamber, including a casing with at least one through hole formed on a side of the casing, a chamber defined inside the casing and communicated with the at least one through hole, and a capillary member covered onto an inner wall of the chamber; and 
 at least one heat pipe, including a tubular body and an opening formed on a side of the tubular body, and the tubular body being passed and coupled to the at least one through hole by an end of the opening, and a cavity being defined inside the tubular body, and a metal mesh being covered onto an inner wall of the tubular body; 
 wherein the at least one heat pipe is configured to be perpendicular to the vapor chamber, and the metal mesh includes a capillary body covered onto the inner wall of the tubular body, the capillary body has a capillary extension formed and bent at a position next to the at least one through hole and extended along the inner wall of the chamber, and the capillary extension is attached to the capillary member. 
 
     
     
       2. The thermal conducting structure of  claim 1 , wherein the inner wall of the tubular body is completely covered by the metal mesh. 
     
     
       3. The thermal conducting structure of  claim 1 , wherein the casing includes a first casing member and a second casing member, and the second casing member has a plurality of prop columns disposed on an inner bottom wall of the chamber, and the capillary member has a plurality of penetrating holes which are through holes, and the prop columns are passed through the penetrating holes and abutted against and in contact with the first casing member at an inner top wall in the chamber, any one of the first casing member and the second casing member has a peripheral fence portion to form an inner peripheral wall of the chamber, and the capillary member is covered completely onto the inner bottom wall, the inner peripheral wall and the inner top wall. 
     
     
       4. The thermal conducting structure of  claim 3 , wherein the capillary member further includes an outer peripheral wall completely covered onto the prop columns. 
     
     
       5. The thermal conducting structure of  claim 3 , wherein the at least one through hole is disposed on an outer wall of the first casing member, the tubular body is disposed vertically on the outer wall and perpendicular to the casing, and the tubular body is passed through the at least one through hole but not protruded beyond the inner top wall. 
     
     
       6. The thermal conducting structure of  claim 1 , wherein the capillary member is one selected from a group consisting of a metal mesh, a fiber, a sintered powder and a groove. 
     
     
       7. The thermal conducting structure of  claim 1 , wherein the metal mesh is made of one selected from a group consisting of copper, aluminum and stainless steel. 
     
     
       8. The thermal conducting structure of  claim 1 , wherein the at least one heat pipe and the at least one through hole come with plural quantities respectively, and the heat pipes are disposed on the same side of the vapor chamber. 
     
     
       9. The thermal conducting structure of  claim 1 , wherein the at least one heat pipe and the at least one through hole come with plural quantities respectively, and the heat pipes are disposed on different sides of the vapor chamber. 
     
     
       10. The thermal conducting structure of  claim 1 , wherein the at least one heat pipe is a round tube structure or a round flat tube structure.