Ceramic electronic device and manufacturing method of the same

Abstract

A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, external electrodes respectively provided on the first end face and the second end face, and a water repellent agent that is provided on at least one face of four faces of a rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other.

What is claimed is: 
     
       1. A ceramic electronic device comprising:
 a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face; 
 external electrodes respectively provided on the first end face and the second end face; and 
 a water repellent agent that is provided on at least one face of four faces of the rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other. 
 
     
     
       2. The ceramic electronic device as claimed in  claim 1 , wherein the water repellent agent has a width of 0.3 mm or more in the direction in which the external electrodes face with each other. 
     
     
       3. The ceramic electronic device as claimed in  claim 1 , wherein the external electrodes each include a conductive resin layer including a metal component. 
     
     
       4. The ceramic electronic device as claimed in  claim 1 , wherein the water repellent agent includes at least one of a silicon-based material and a fluorine-based material. 
     
     
       5. The ceramic electronic device as claimed in  claim 1 ,
 wherein the water repellent agent is provided on two faces of the multilayer chip next to each other, and 
 wherein the water repellent agent continuously extends on a corner between the two faces. 
 
     
     
       6. The ceramic electronic device as claimed in  claim 1 ,
 wherein the water repellent agent is provided on two faces of the multilayer chip next to each other, and 
 wherein the water repellent agent does not continuously extend on a corner between the two faces. 
 
     
     
       7. The ceramic electronic device as claimed in  claim 1 , wherein the water repellent agent is provided on the four faces of the multilayer chip. 
     
     
       8. The ceramic electronic device as claimed in  claim 1 , wherein the water repellent agent has two belts spaced from each other. 
     
     
       9. A manufacturing method of a ceramic electronic device comprising:
 preparing a ceramic electronic device having a multilayer chip, and external electrodes, the multilayer chip having a structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face, the external electrodes being respectively provided on the first end face and the second end face; and 
 forming an water repellent agent on at least one face of four faces of the rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, 
 wherein the water repellent agent is spaced from the first and second external electrodes, and extends in a direction intersecting with a direction in which the external electrodes face with each other. 
 
     
     
       10. The method as claimed in  claim 9 , wherein the water repellent agent is formed by contacting silicon rubber heated to 120 degrees C. or more to the four faces or contacting fluorine rubber heated to 150 degrees C. or more to the four faces. 
     
     
       11. A ceramic electronic device comprising:
 a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, a main component of the dielectric layers being ceramic, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being exposed to at least one of a first end face and a second end face of the multilayer chip, the first end face being opposite to the second end face; 
 external electrodes respectively provided on the first end face and the second end face; and 
 a material layer that is provided on at least one face of four faces of the rectangular parallelepiped shape of the multilayer chip other than the first and second end faces, is spaced from the first and second external electrodes, extends in a direction intersecting with a direction in which the external electrodes face with each other, and 
 a contact angle of the material layer with respect to water is 90 degrees or more. 
 
     
     
       12. The ceramic electronic device as claimed in  claim 11 , wherein the material layer has a width of 0.3 mm or more in the direction in which the external electrodes face with each other. 
     
     
       13. The ceramic electronic device as claimed in  claim 11 , wherein the external electrodes each include a conductive resin layer including a metal component. 
     
     
       14. The ceramic electronic device as claimed in  claim 11 , wherein the material layer includes at least one of a silicon-based material and a fluorine-based material. 
     
     
       15. The ceramic electronic device as claimed in  claim 11 ,
 wherein the material layer is provided on two faces of the multilayer chip next to each other, and 
 wherein the material layer continuously extends on a corner between the two faces. 
 
     
     
       16. The ceramic electronic device as claimed in  claim 11 ,
 wherein the material layer is provided on two faces of the multilayer chip next to each other, and 
 wherein the material layer does not continuously extend on a corner between the two faces. 
 
     
     
       17. The ceramic electronic device as claimed in  claim 11 , wherein the material layer is provided on the four faces of the multilayer chip. 
     
     
       18. The ceramic electronic device as claimed in  claim 11 , wherein the material layer has two belts spaced from each other.