Composite heat dissipating structure and electronic device using the same

Abstract

A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.

What is claimed is: 
     
       1. A composite heat dissipating structure, comprising:
 a heat sink comprising:
 a first housing comprising an upper housing and a lower housing, the upper housing and the lower housing being sealed to form a first cavity, the upper housing comprising an inner surface and an outer surface opposite to the inner surface, the inner surface facing the lower housing, and the outer surface being away from the lower housing; 
 a first heat dissipation liquid received in the first cavity; and 
 a gas received in the first cavity; and 
 
 a heat pipe disposed on the inner surface and comprising a first end and a second end opposite to the first end, the first end being one of an evaporating end and a condensation end of the heat pipe, the second end being the other one of the evaporating end and the condensation end, the first end contacting the gas received in the first cavity, and the second end contacting the first heat dissipation liquid received in the first cavity. 
 
     
     
       2. The composite heat dissipating structure of  claim 1 , wherein the heat pipe comprises a second housing connected to the upper housing, each of the second housing and the upper housing is made of a metal material, the lower housing is made of a non-metal material, and the second housing and the upper housing are integrally formed. 
     
     
       3. The composite heat dissipating structure of  claim 2 , wherein the heat pipe comprises a second heat dissipation liquid and a wick structure, the second housing defines a second cavity, and the second heat dissipation liquid and the wick structure are received in the second cavity. 
     
     
       4. The composite heat dissipating structure of  claim 1 , wherein the first housing is made of a metal material, a non-metal material, or a composite material of metal and non-metal. 
     
     
       5. An electronic device comprising:
 a composite heat dissipating structure comprising:
 a heat sink comprising: 
 a first housing comprising an upper housing and a lower housing, the upper housing and the lower housing being sealed to form a first cavity, the upper housing comprising an inner surface and an outer surface opposite to the inner surface, the inner surface facing the lower housing, and the outer surface being away from the lower housing; 
 a first heat dissipation liquid received in the first cavity; and 
 a gas received in the first cavity; and 
 a heat pipe disposed on the inner surface and comprising a first end and a second end opposite to the first end, the first end being one of an evaporating end and a condensation end of the heat pipe, the second end being the other one of the evaporating end and the condensation end, the first end contacting the gas received in the first cavity, and the second end contacting the first heat dissipation liquid received in the first cavity. 
 
 
     
     
       6. The electronic device of  claim 5 , wherein the heat pipe comprises a second housing connected to the upper housing, each of the second housing and the upper housing is made of a metal material, the lower housing is made of a non-metal material, and the second housing and the upper housing are integrally formed. 
     
     
       7. The electronic device of  claim 6 , wherein the heat pipe comprises a second heat dissipation liquid and a wick structure, the second housing defines a second cavity, and the second heat dissipation liquid and the wick structure are received in the second cavity. 
     
     
       8. The electronic device of  claim 5 , wherein the first housing is made of a metal material, a non-metal material, or a composite material of metal and non-metal.