Hermetically-sealed package and method of forming same

Abstract

Various embodiments of a sealed package and a method of forming such package are disclosed. The package includes a housing, a substrate hermetically sealed to the housing, and a light source disposed on a first major surface of the substrate. The package further includes a detector disposed on the first major surface of the substrate and having a detecting surface. The package also includes a masking layer disposed on at least one of the first major surface and a second major surface of the substrate, where the masking layer includes a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate. The masking layer further includes a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate.

What is claimed is: 
     
       1. A hermetically-sealed package, comprising:
 a housing comprising an inner surface and an outer surface; 
 a substrate hermetically sealed to the housing and comprising a first major surface and a second major surface; 
 a light source disposed on the first major surface of the substrate and comprising an emitting surface, wherein the light source is adapted to emit light through the first and second major surfaces of the substrate; 
 a detector disposed on the first major surface of the substrate and comprising a detecting surface, wherein the detector is adapted to detect at least a portion of the light emitted by the light source; and 
 a diffuse region disposed between the emission axis of the light source and the detection axis of the detector in a lateral direction parallel to the first major surface of the substrate. 
 
     
     
       2. The package of  claim 1 , wherein the diffuse region is disposed within the substrate. 
     
     
       3. The package of  claim 1 , wherein the diffuse region is disposed on the second major surface of the substrate. 
     
     
       4. A hermetically-sealed package, comprising:
 a housing comprising an inner surface and an outer surface; 
 a substrate hermetically sealed to the housing and comprising a first major surface and a second major surface; 
 a light source disposed on the first major surface of the substrate and comprising an emitting surface, wherein the light source is adapted to emit light through the first and second major surfaces of the substrate; 
 a detector disposed on the second major surface of the substrate and comprising a detecting surface, wherein the detector is adapted to detect at least a portion of the light emitted by the light source; 
 a conductor disposed on the first major surface of the substrate, wherein the conductor is electrically connected to the light source; and 
 a via disposed between the first major surface and the second major surface of the substrate, wherein the via is electrically connected to the detector and the conductor. 
 
     
     
       5. The package of  claim 4 , wherein the detector is hermetically sealed to the second major surface of the substrate over the via. 
     
     
       6. The package of  claim 4 , further comprising an encapsulant disposed over the detector. 
     
     
       7. The package of  claim 1 , further comprising a masking layer disposed on at least one of the first major surface and the second major surface of the substrate, wherein the masking layer comprises a first aperture aligned with an emission axis of the light source in a direction orthogonal to the first major surface of the substrate, wherein the masking layer further comprises a second aperture aligned with a detection axis of the detector in a direction orthogonal to the first major surface of the substrate. 
     
     
       8. The package of  claim 7 , wherein the masking layer is disposed on the first major surface, wherein the light source is disposed within the first aperture and the detector is disposed within the second aperture. 
     
     
       9. The package of  claim 8 , further comprising an insulating layer disposed such that masking layer is between the insulation layer and the first major surface of the substrate. 
     
     
       10. The package of  claim 7 , wherein the masking layer is disposed on the second major surface. 
     
     
       11. The package of  claim 7 , wherein the masking layer comprises a dielectric material. 
     
     
       12. The package of  claim 7 , wherein the masking layer comprises an electrically conductive material. 
     
     
       13. The package of  claim 7 , wherein the masking layer comprises a light absorbing material. 
     
     
       14. The package of  claim 13 , wherein the masking layer is adapted to absorb visible light. 
     
     
       15. The package of  claim 13 , wherein the masking layer is adapted to absorb near infrared light. 
     
     
       16. The package of  claim 7 , wherein the masking layer comprises columnar TiN. 
     
     
       17. The package of  claim 1 , further comprising an antenna disposed on the second major surface of the substrate. 
     
     
       18. The package of  claim 17 , wherein the antenna is disposed on a first portion of the second major surface of the substrate, wherein the light source is disposed such that the emission axis is aligned with a second portion of the second major surface of the substrate in a direction orthogonal to the first major surface of the substrate. 
     
     
       19. The package of  claim 17 , wherein the antenna comprises a first interstitial portion, wherein the detector is aligned with the first interstitial portion in a direction orthogonal to the first major surface of the substrate. 
     
     
       20. The package of  claim 1 , further comprising an array of diffuse regions disposed on or within the substrate.