Light emitting diode, display substrate and transfer method

Abstract

Provided are a light emitting diode, a display substrate and a transfer method. The transfer method includes: preparing a transfer substrate and the display substrate respectively, wherein the transfer substrate includes a plurality of light emitting diodes arranged in a matrix; aligning the transfer substrate with the display substrate, wherein first magnetic layers of the light emitting diodes on the transfer substrate correspond to second magnetic layers of the sub-pixels on the display substrate one by one; and driving the transfer substrate to approach the display substrate, so that the light emitting diodes on the transfer substrate are positioned to fall onto the sub-pixels of the display substrate by action of magnetic attraction forces generated by the first magnetic layers and the second magnetic layers.

What I claim is: 
     
       1. A light emitting diode, comprising an emitting structure layer, and a first electrode bonding pad, a second electrode bonding pad and a first magnetic layer which are disposed on the emitting structure layer, wherein the first electrode bonding pad and the second electrode bonding pad are configured to be bonded to a display substrate, and the first magnetic layer is configured to generate a magnetic attraction force to a second magnetic layer of the display substrate during a transfer process, to enable the light emitting diode to be positioned to fall onto a sub-pixel of the display substrate by action of the magnetic attraction force; and the first magnetic layer is disposed between the first electrode bonding pad and the second electrode bonding pad, on a remote side of the first electrode bonding pad away from the second electrode bonding pad and a remote side of the second electrode bonding pad away from the first electrode bonding pad, respectively. 
     
     
       2. The light emitting diode according to  claim 1 , wherein the first magnetic layer comprises a photosensitive material layer in which magnetic nano-particles are provided. 
     
     
       3. The light emitting diode according to  claim 2 , wherein a material of the photosensitive material layer comprises photoresist. 
     
     
       4. The light emitting diode according to  claim 2 , wherein a material of a magnetic nano-particle comprises any one or more of ferroferric oxide, nickel and cobalt. 
     
     
       5. The light emitting diode according to  claim 2 , wherein a shape of a magnetic nano-particle comprises a polygon. 
     
     
       6. The light emitting diode according to  claim 2 , wherein a diameter of a magnetic nano-particle is 10 nm to 20 nm. 
     
     
       7. The light emitting diode according to  claim 1 , wherein the first magnetic layer comprises a magnetic material layer formed by a ferromagnetic metal material, and the ferromagnetic metal material comprises any one or more of nickel, iron, cobalt, and alloy thereof. 
     
     
       8. The light emitting diode according to  claim 1 , wherein a magnetic polarity of the first magnetic layer is opposite to that of the second magnetic layer. 
     
     
       9. The light emitting diode according to  claim 1 , wherein the first electrode bonding pad is configured to be bonded to a first contact electrode of the display substrate, and the second electrode bonding pad is configured to be bonded to a second contact electrode of the display substrate. 
     
     
       10. A transfer method, for transferring a plurality of light emitting diodes according to  claim 1  onto a display substrate; wherein the display substrate comprises a plurality of sub-pixels arranged in a matrix, each sub-pixel comprises a driving circuit layer, and a first contact electrode, a second contact electrode and a second magnetic layer which are disposed on the driving circuit layer, the first contact electrode and the second contact electrode are configured to be bonded to a light emitting diode, the second magnetic layer is configured to generate a magnetic attraction force to the first magnetic layer of the light emitting diode during a transfer process, to enable the light emitting diode to be positioned to fall onto the sub-pixel of the display substrate by action of the magnetic attraction force; the second magnetic layer is disposed between the first contact electrode and the second contact electrode, on a remote side of the first contact electrode away from the second contact electrode and a remote side of the second contact electrode away from the first contact electrode; and the transfer method comprises:
 preparing a transfer substrate and the display substrate respectively, wherein the transfer substrate comprises a plurality of light emitting diodes arranged in a matrix; 
 aligning the transfer substrate with the display substrate, wherein first magnetic layers of the light emitting diodes on the transfer substrate correspond to second magnetic layers of the sub-pixels on the display substrate one by one; and 
 driving the transfer substrate to approach the display substrate, to enable the light emitting diodes on the transfer substrate to be positioned to fall onto the sub-pixels of the display substrate by action of magnetic attraction forces generated by the first magnetic layers and the second magnetic layers. 
 
     
     
       11. A display substrate, comprising a plurality of sub-pixels arranged in a matrix, wherein each sub-pixel comprises a driving circuit layer, and a first contact electrode, a second contact electrode and a second magnetic layer which are disposed on the driving circuit layer, the first contact electrode and the second contact electrode are configured to be bonded to a light emitting diode, the second magnetic layer is configured to generate a magnetic attraction force to a first magnetic layer of the light emitting diode during a transfer process, to enable the light emitting diode to be positioned to fall onto the sub-pixel of the display substrate by action of the magnetic attraction force; the second magnetic layer is disposed between the first contact electrode and the second contact electrode, on a remote side of the first contact electrode away from the second contact electrode and a remote side of the second contact electrode away from the first contact electrode. 
     
     
       12. The display substrate according to  claim 11 , wherein the second magnetic layer comprises a photosensitive material layer in which magnetic nano-particles are provided. 
     
     
       13. The display substrate according to  claim 12 , wherein a material of the photosensitive material layer comprises photoresist. 
     
     
       14. The display substrate according to  claim 12 , wherein a material of a magnetic nano-particle comprises any one or more of ferroferric oxide, nickel and cobalt. 
     
     
       15. The display substrate according to  claim 12 , wherein a shape of a magnetic nano-particle comprises a polygon. 
     
     
       16. The display substrate according to  claim 12 , wherein a diameter of a magnetic nano-particle is 10 nm to 20 nm. 
     
     
       17. The display substrate according to  claim 11 , wherein the second magnetic layer comprises a magnetic material layer formed by a ferromagnetic metal material, and the ferromagnetic metal material comprises any one or more of nickel, iron, cobalt, and alloy thereof. 
     
     
       18. The display substrate according to  claim 17 , wherein the first contact electrode, the second contact electrode, and the second magnetic layer are sequentially prepared in one device by electroplating. 
     
     
       19. The display substrate according to  claim 11 , wherein a magnetic polarity of the second magnetic layer is opposite to that of the first magnetic layer. 
     
     
       20. The display substrate according to  claim 11 , wherein the first contact electrode is configured to be bonded to a first electrode bonding pad of the light emitting diode, and the second contact electrode is configured to be bonded to a second electrode bonding pad of the light emitting diode.