Method of fabricating light emitting display panel using solvent vapor compensation reservoir

Abstract

A method of fabricating a light emitting display panel. The method includes providing a substrate having a display area and a peripheral area, the substrate including a pixel definition layer for defining a plurality of subpixel apertures for a light emitting layer in the display area; attaching a solvent vapor compensation reservoir to the peripheral area of the substrate, the solvent vapor compensation reservoir having one or more ink droplet receiving grooves configured to receive an ink droplet and a connection layer, the solvent vapor compensation reservoir removably attached to the peripheral area of the substrate through the connection layer; dispensing ink droplets into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; drying the ink droplets dispensed into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; and removing the solvent vapor compensation reservoir from the substrate.

What is claimed is: 
     
       1. A method of fabricating a light emitting display panel, comprising:
 providing a substrate having a display area and a peripheral area, the substrate comprising a pixel definition layer for defining a plurality of subpixel apertures for a light emitting layer in the display area; 
 attaching a solvent vapor compensation reservoir to the peripheral area of the substrate, the solvent vapor compensation reservoir comprising one or more ink droplet receiving grooves configured to receive an ink droplet and a connection layer, the solvent vapor compensation reservoir removably attached to the peripheral area of the substrate through the connection layer; 
 dispensing ink droplets into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; 
 drying the ink droplets dispensed into the plurality of subpixel apertures and the one or more ink droplet receiving grooves; and 
 removing the solvent vapor compensation reservoir from the substrate. 
 
     
     
       2. The method of  claim 1 , wherein the connection layer comprises an adhesive material layer. 
     
     
       3. The method of  claim 2 , wherein the adhesive material layer comprises one or a combination of a thermally removable adhesive, a magnetic particle-dispersed adhesive, and a gecko biomimetic adhesive. 
     
     
       4. The method of  claim 2 , prior to attaching the solvent vapor compensation reservoir to the peripheral area of the substrate, further comprising:
 providing a molding substrate having one or more grooves; 
 filling the one or more grooves with a molding material and curing the molding material filled in the one or more grooves, thereby forming a solvent vapor compensation reservoir having one or more ink droplet receiving grooves; 
 forming a connection layer on the solvent vapor compensation reservoir; 
 adhering the connection layer onto the peripheral area of the substrate; and 
 separating the solvent vapor compensation reservoir from the molding substrate, thereby attaching the solvent vapor compensation reservoir to the peripheral area of the substrate. 
 
     
     
       5. The method of  claim 2 , wherein the connection layer comprises an adhesive material layer including a thermally removable adhesive;
 wherein removing the solvent vapor compensation reservoir from the substrate comprises heating the adhesive material layer. 
 
     
     
       6. The method of  claim 2 , wherein the connection layer comprises an adhesive material layer including a magnetic particle-dispersed adhesive;
 wherein removing the solvent vapor compensation reservoir from the substrate comprises applying a magnetic field to the adhesive material layer. 
 
     
     
       7. The method of  claim 2 , wherein the connection layer comprises a gecko biomimetic adhesive;
 wherein removing the solvent vapor compensation reservoir from the substrate comprises applying a first force to the connection layer along a direction perpendicular to the substrate; and 
 applying a second force to the connection layer along a direction parallel to the substrate. 
 
     
     
       8. The method of  claim 1 , wherein a depth of each of one or more ink droplet receiving grooves equals to the depth of each of the plurality of subpixels apertures in the display area. 
     
     
       9. The method of  claim 1 , wherein a depth of each of one or more ink droplet receiving grooves is greater than the depth of each of the plurality of subpixels apertures in the display area. 
     
     
       10. The method of  claim 1 , wherein each of one or more ink droplet receiving grooves extends through the solvent vapor compensation reservoir; and
 the connection layer constitutes a bottom surface for each of the one or more ink droplet receiving grooves. 
 
     
     
       11. A light emitting display panel, fabricated by the method of  claim 1 .