Source electrode and connector lead with notched portions for a semiconductor package

Abstract

Provided is a semiconductor device including: a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and a first connector including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode.

What is claimed is: 
     
       1. A semiconductor device comprising:
 a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; 
 a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; and 
 a first connector including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode; 
 wherein the rectangular region has a seventh notch portion in the third corner portion, 
 wherein the first electrode has an eighth notch portion in the seventh corner portion, 
 wherein the first connector has a ninth notch portion in an eleventh corner portion provided on the seventh corner portion, and 
 wherein a second electrode electrically connected to the semiconductor element is further included on the semiconductor chip to be separated from the eighth notch portion and the ninth notch portion. 
 
     
     
       2. The semiconductor device according to  claim 1 ,
 wherein the rectangular region has a fourth notch portion in the fourth corner portion, 
 wherein the first electrode has a fifth notch portion in the eighth corner portion, and 
 wherein the first connector has a sixth notch portion in the twelfth corner portion. 
 
     
     
       3. The semiconductor device according to  claim 1 , further comprising a first bonding material being provided between the first electrode and the first connector, the first bonding material bonding the first electrode and the first connector, and the first bonding material having a tenth notch portion in a thirteenth corner portion on the fifth corner portion. 
     
     
       4. The semiconductor device according to  claim 1 , further comprising:
 a die pad being provided under the semiconductor chip; and 
 a second bonding material being provided between the die pad and the semiconductor chip and bonding the die pad and the semiconductor chip. 
 
     
     
       5. The semiconductor device according to  claim 1 , wherein shapes of the first notch portion, the second notch portion, and the third notch portion are L-shapes. 
     
     
       6. The semiconductor device according to  claim 1 , wherein shapes of the first notch portion, the second notch portion, and the third notch portion are corner-chamfered shapes. 
     
     
       7. The semiconductor device according to  claim 1 , wherein a size of the first notch portion is equal to a size of the second notch portion. 
     
     
       8. A semiconductor device comprising:
 a semiconductor chip having a rectangular region including a first corner portion having a first notch portion, a second corner portion being provided to diagonally face the first corner portion, a third corner portion, and a fourth corner portion being provided to diagonally face the third corner portion on a surface and having a semiconductor element formed in the rectangular region; 
 a first electrode including a fifth corner portion being provided on the first corner portion and having a second notch portion, a sixth corner portion being provided on the second corner portion, a seventh corner portion being provided on the third corner portion, and an eighth corner portion being provided on the fourth corner portion, the first electrode being provided on the semiconductor element, and the first electrode being electrically connected to the semiconductor element; 
 a first connector including a ninth corner portion being provided on the fifth corner portion and having a third notch portion and a twelfth corner portion being provided on the eighth corner portion, the first connector being provided on the first electrode, and the first connector being electrically connected to the first electrode; 
 a die pad being provided under the semiconductor chip; and 
 a second bonding material being provided between the die pad and the semiconductor chip and bonding the die pad and the semiconductor chip, 
 wherein the second bonding material provided between a portion of the semiconductor chip with the semiconductor element not provided and the die pad has a void. 
 
     
     
       9. The semiconductor device according to  claim 8 , wherein shapes of the first notch portion, the second notch portion, and the third notch portion are L-shapes. 
     
     
       10. The semiconductor device according to  claim 8 , wherein shapes of the first notch portion, the second notch portion, and the third notch portion are corner-chamfered shapes. 
     
     
       11. The semiconductor device according to  claim 8 , wherein a size of the first notch portion is equal to a size of the second notch portion.