Multi-layered ceramic electronic component
Abstract
A multilayer ceramic electronic component includes a ceramic body includes: a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and; and an auxiliary electrode spaced apart from the capacitance formation portion, and disposed to be in contact with one of the first and second external electrodes. The auxiliary electrode is spaced apart from first surface and the second surface of the ceramic body in a first direction.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A multilayer ceramic electronic component, comprising:
a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in the second direction, and fifth and sixth surfaces opposing each other in the third direction;
first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively; and
a first auxiliary electrode disposed in the cover portion and spaced apart from the capacitance formation portion, and disposed to be in contact with one of the first and second external electrodes,
wherein the first auxiliary electrode is spaced apart from the first surface and the second surface of the ceramic body.
2. The multilayer ceramic electronic component of claim 1 , wherein the first and second external electrodes extend to the third to sixth surfaces of the ceramic body.
3. The multilayer ceramic electronic component of claim 1 , wherein the first auxiliary electrode is exposed to one of the fifth and sixth surfaces of the ceramic body.
4. The multilayer ceramic electronic component of claim 1 , wherein a maximum value of an absolute value of an angle of the first auxiliary electrode with respect to the third direction is less than 45°.
5. The multilayer ceramic electronic component of claim 1 , further comprising a second auxiliary electrode spaced apart from the first surface and the second surface of the ceramic body,
wherein the first and second auxiliary electrodes are disposed on opposing sides of the capacitance formation portion, and
a sum of absolute values of angles of the first and second auxiliary electrodes with respect to the third direction is 90° or less.
6. The multilayer ceramic electronic component of claim 1 , wherein the first and second external electrodes comprise a first electrode layer connected to the first and second internal electrode layers, respectively, and a second electrode layer disposed on the first electrode layer, respectively, and
the first auxiliary electrode is disposed between an end of the first electrode layer and an inflection point of the ceramic body.
7. The multilayer ceramic electronic component of claim 1 , wherein the first auxiliary electrode is disposed between an end of the one of the first and second external electrodes and an inflection point of the ceramic body.
8. The multilayer ceramic electronic component of claim 1 , wherein a thickness of the first auxiliary electrode is in a range of 20% to 50% of a thickness of the cover portion.
9. The multilayer ceramic electronic component of claim 1 , wherein the first auxiliary electrode is disposed in the margin portion.
10. The multilayer ceramic electronic component of claim 1 , further comprising second to eighth auxiliary electrodes.
11. The multilayer ceramic electronic component of claim 10 , wherein six or more among the first to eighth auxiliary electrodes are exposed to the fifth and sixth surfaces of the ceramic body.
12. A multilayer ceramic electronic component, comprising:
a ceramic body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer and first and second internal electrodes stacked in the third direction with the dielectric layer interposed therebetween;
first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively; and
an auxiliary electrode exposed to one of the fifth and sixth surfaces and connected to one of the first and second external electrodes,
wherein a value of an absolute value of an angle of the auxiliary electrode with respect to the third direction is less than 45°.
13. The multilayer ceramic electronic component of claim 12 , wherein the one of the first and second external electrodes comprises a first electrode layer connected to one of the first and second internal electrode layers, and a second electrode layer disposed on the first electrode layer, and
the auxiliary electrode is in contact with the first electrode layer.
14. The multilayer ceramic electronic component of claim 13 , wherein the auxiliary electrode is in contact with the second electrode layer.
15. The multilayer ceramic electronic component of claim 12 , wherein the ceramic body includes a capacitance formation portion including the dielectric layer and the first and second internal electrodes, a margin portion disposed on both surfaces of the capacitance formation portion in the second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and
a thickness of the auxiliary electrode is in a range of 20% to 50% of a thickness of the cover portion.
16. The multilayer ceramic electronic component of claim 15 , wherein the auxiliary electrode is disposed in the margin portion.
17. The multilayer ceramic electronic component of claim 15 , wherein the auxiliary electrode is disposed in the cover portion.
18. A multilayer ceramic electronic component, comprising:
a ceramic body including a capacitance formation portion including a dielectric layer and first and second internal electrodes disposed to be stacked in a third direction with the dielectric layer interposed therebetween, a margin portion disposed on both surfaces of the capacitance formation portion in a second direction, and a cover portion disposed on both surfaces of the capacitance formation portion in the third direction, and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in the second direction, and fifth and sixth surfaces opposing each other in the third direction;
first and second external electrodes disposed on the first and second surfaces of the ceramic body, respectively; and
two or more auxiliary electrodes disposed in the cover portion or the margin portion, and disposed in contact with one of the first and second external electrodes,
wherein the first and second external electrodes comprise a first electrode layer connected to the first and second internal electrode layers, respectively, and a second electrode layer disposed on the first electrode layer, respectively, and
wherein at least one of the two or more auxiliary electrodes is spaced apart from the first surface and the second surface of the ceramic body.
19. The multilayer ceramic electronic component of claim 18 , wherein the first electrode layers include conductive metal and glass, and
the conductive metal is one or more selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof, and
the first electrode layers are disposed to be in contact with the auxiliary electrodes on the fifth surface and the sixth surface of the ceramic body, respectively.
20. The multilayer ceramic electronic component of claim 19 , wherein the second electrode layers include conductive metal and glass, and
the conductive metal is one or more selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof, and
the second electrode layers are disposed to be in contact with the auxiliary electrodes on the fifth surface and the sixth surface of the ceramic body, respectively.
21. The multilayer ceramic electronic component of claim 20 , wherein the first and second external electrodes extend to the third to sixth surfaces of the ceramic body.
22. The multilayer ceramic electronic component of claim 19 , wherein a ratio of the thickness of the auxiliary electrode to the thickness of the cover portion is more than 10% to 60% or less.
23. The multilayer ceramic electronic component of claim 18 , wherein the second electrode layers include conductive metal and glass, and
the conductive metal is one or more selected from a group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof, and
the second electrode layers are disposed to be in contact with the auxiliary electrodes on the fifth surface and the sixth surface of the ceramic body, respectively.
24. The multilayer ceramic electronic component of claim 18 , wherein a ratio of the thickness of the auxiliary electrode to the thickness of the cover portion is more than 10% to 60% or less.
25. The multilayer ceramic electronic component of claim 18 , wherein a thickness of the first auxiliary electrode is in a range of 20% to 50% of a thickness of the cover portion.
26. The multilayer ceramic electronic component of claim 18 , wherein a thickness of the first auxiliary electrode is in a range of 30% to 60% of a thickness of the cover portion.Cited by (0)
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