Display module and manufacturing method thereof

Abstract

A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

What is claimed is: 
     
       1. A display module comprising:
 a substrate; 
 a driving circuit layer formed on the substrate, the driving circuit layer comprising a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; 
 an adhesive layer formed on the driving circuit layer; 
 a plurality of light emitting diodes (LEDs), each of the plurality of LEDs formed on a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and 
 a black matrix layer formed on the adhesive layer, between the plurality of LEDs, 
 wherein the display module is configured to include a plurality of pixels that comprise a plurality of sub pixels, and 
 each of the plurality of electrode pads comprises a first area for bonding a first LED corresponding to a sub pixel among the plurality of sub pixels and a second area for bonding a second LED corresponding to the sub pixel based on the first LED being defective. 
 
     
     
       2. The display module of  claim 1 , wherein the black matrix layer is formed on the adhesive layer, between the plurality of LEDs, by:
 attaching a black matrix formation layer, attached to a film, onto a portion of the adhesive layer, formed between the plurality of LEDs, and onto the plurality of LEDs through a thermo-compression process, and 
 removing a first portion of black matrix formation layer, attached on the plurality of LEDs, together with the film from the plurality of LEDs such that a second portion of the black matrix formation layer remains between the plurality of LEDs as the black matrix layer. 
 
     
     
       3. The display module of  claim 2 , wherein the plurality of LEDs are electronically connected to the plurality of electrode pads through the thermo-compression process. 
     
     
       4. The display module of  claim 3 , wherein
 the adhesive layer comprises an anisotropic conductive film (ACF) comprising a conductive material, and 
 the plurality of LEDs are electronically connected to the plurality of electrode pads through the conductive material by the thermo-compression process. 
 
     
     
       5. The display module of  claim 3 , wherein
 the adhesive layer comprises a non-conductive film comprising a flux, 
 bumps are applied on an electrode of each of the plurality of LEDs or applied on the plurality of electrode pads, the bumps melted through the thermo-compression process, 
 the plurality of LEDs are electronically connected to the plurality of electrode pads through the bumps, while the bumps are in a molten form, and 
 the flux is configured to remove an oxide film generated when the bumps are melted. 
 
     
     
       6. The display module of  claim 2 , wherein an adhesive force between the adhesive layer and the black matrix formation layer is stronger than an adhesive force between the film and the black matrix formation layer. 
     
     
       7. The display module of  claim 1 , wherein the second LED is configured to emit a light of a same color as the first LED. 
     
     
       8. The display module of  claim 1 , wherein
 a size of each of the plurality of electrode pads is bigger than the size of the first LED, and 
 the first area and the second area are electronically connected. 
 
     
     
       9. The display module of  claim 1 , wherein each of the plurality of LEDs is a micro LED of a flip-chip structure wherein an electrode is formed in a lower part of the flip-chip structure.