US11393847B2ActiveUtilityA1
Semiconductor storage apparatus, product-sum calculation apparatus, and electronic equipment
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPPriority: Mar 30, 2018Filed: Feb 27, 2019Granted: Jul 19, 2022
Est. expiryMar 30, 2038(~11.7 yrs left)· nominal 20-yr term from priority
Inventors:Masanori Tsukamoto
H10D 30/0415H10D 30/701H10D 64/689H10D 30/673H10D 88/00G11C 11/2273G11C 11/223G11C 11/2275H01L 29/516H01L 27/1159H01L 29/78391H01L 29/42384H01L 29/6684H01L 27/11587H10B 51/10H10B 51/20H10B 51/30
51
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Cited by
15
References
14
Claims
Abstract
To provide a semiconductor storage apparatus, a product-sum calculation apparatus, and electronic equipment in which memory cells are highly integrated and highly densified. A semiconductor storage apparatus including: a first transistor including a first gate electrode via a ferroelectric film on an activation region including source or drain regions; and a second transistor including source or drain regions in an activation layer provided on the first gate electrode and a second gate electrode on the activation layer via an insulating film.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. A semiconductor storage apparatus, comprising:
a first transistor including:
a ferroelectric film on an activation region, wherein the activation region extends in a first direction on a semiconductor substrate;
a first source region or a first drain region in the activation region; and
a first gate electrode on the ferroelectric film, wherein the first gate electrode extends in a second direction orthogonal to the first direction; and
a second transistor including:
an activation layer on the first gate electrode;
a second source region or a second drain region in the activation layer;
an insulating film on the activation layer; and
a second gate electrode on the activation layer via the insulating film.
2. The semiconductor storage apparatus according to claim 1 , wherein the activation layer includes a semiconductor material.
3. The semiconductor storage apparatus according to claim 1 , wherein the second gate electrode extends in the first direction.
4. The semiconductor storage apparatus according to claim 1 , wherein
one of the first source region or the first drain region of the first transistor is electrically connected to a source line that extends in the second direction, and
another of the first source region or the first drain region of the first transistor is electrically connected to a second bit line that extends in the first direction.
5. The semiconductor storage apparatus according to claim 1 , wherein
one of the second source region or the second drain region of the second transistor is electrically connected to the first gate electrode, and
another of the second source region or the second drain region of the second transistor is electrically connected to a first bit line that extends in the second direction.
6. The semiconductor storage apparatus according to claim 1 , wherein
the first source region or the first drain region of the first transistor are in the activation region on both sides of the first gate electrode, and
the second source region or the second drain region of the second transistor are in the activation layer on both sides of the second gate electrode.
7. The semiconductor storage apparatus according to claim 1 , wherein the activation layer is on the first gate electrode and the semiconductor substrate along an outer shape of the first gate electrode and the semiconductor substrate.
8. The semiconductor storage apparatus according to claim 1 , wherein the second gate electrode is on the activation layer and the semiconductor substrate along an outer shape of the activation layer and the semiconductor substrate via the insulating film.
9. The semiconductor storage apparatus according to claim 1 , wherein
each of the first source region or the first drain region of the first transistor is a same conductivity type region, and
each of the second source region or the second drain region of the second transistor is a same conductivity type region.
10. The semiconductor storage apparatus according to claim 1 , wherein the second transistor is a thin film transistor.
11. The semiconductor storage apparatus according to claim 1 , wherein a plurality of sets of the first transistor and the second transistor is repeatedly stacked.
12. A product-sum calculation apparatus, comprising:
a first transistor including:
a ferroelectric film on an activation region, wherein the activation region extends in a first direction on a semiconductor substrate;
a first source region or a first drain region in the activation region; and
a first gate electrode on the ferroelectric film, wherein the first gate electrode extends in a second direction orthogonal to the first direction; and
a second transistor including:
an activation layer on the first gate electrode;
a second source region or a second drain region in the activation layer;
an insulating film on the activation layer; and
a second gate electrode on the activation layer via the insulating film.
13. An electronic equipment, comprising:
a semiconductor storage apparatus including:
a first transistor including:
a ferroelectric film on an activation region, wherein the activation region extends in a first direction on a semiconductor substrate;
a first source region or a first drain region in the activation region; and
a first gate electrode on the ferroelectric film, wherein the first gate electrode extends in a second direction orthogonal to the first direction; and
a second transistor including:
an activation layer on the first gate electrode;
a second source region or a second drain region in the activation layer;
an insulating film on the activation layer; and
a second gate electrode on the activation layer via the insulating film.
14. A semiconductor storage apparatus, comprising:
a first transistor including:
a ferroelectric film on an activation region, wherein the activation region extends in a first direction on a semiconductor substrate;
a first source region or a first drain region in the activation region; and
a first gate electrode on the ferroelectric film, wherein the first gate electrode extends in a second direction orthogonal to the first direction; and
a second transistor including:
an activation layer on the first gate electrode;
a second source region or a second drain region in the activation layer;
an insulating film on the activation layer; and
a second gate electrode on the activation layer via the insulating film, wherein the second gate electrode extends in the first direction.Cited by (0)
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