Method for etching a liquid crystal panel comprising installing a masking tape on entire surfaces of a first substrate and a second substrate

Abstract

Provided is a liquid crystal panel and a method for etching a liquid crystal panel, the liquid crystal panel including: a first substrate; a second substrate installed at a location facing the first substrate with a liquid crystal layer therebetween; a driving circuit unit connected to the second substrate; and a masking tape integrally surrounding the edges of the first substrate and the second substrate.

The invention claimed is: 
     
       1. A method of etching a liquid crystal panel, comprising:
 installing a masking tape on entire surfaces of a first substrate and a second substrate, wherein an area of the masking tape is greater than a sum of an area of the first substrate and an area of the second substrate; 
 installing an encapsulation member configured to surround an outer side of a driving circuit connected to the second substrate; 
 removing an inner side of the masking tape facing etched regions of the first substrate and the second substrate; 
 etching etched regions of the first substrate and the second substrate using an etching solution; 
 removing the encapsulation member; and 
 removing an edge of the masking tape; 
 wherein, in the installing of the masking tape, the masking tape is adhered and fixed to each of the first substrate and the second substrate and formed of a single film; 
 wherein the removing of the inner side of the masking tape includes cutting the inner side of the masking tape using a laser or a knife for removing a film and removing the masking tape which is cut from the first substrate and the second substrate; 
 wherein the removing of the edge of the masking tape includes cutting the masking tape protruding outward from the first substrate and the second substrate without removal of the masking tape in non-etched regions on the first substrate and the second substrate. 
 
     
     
       2. The method of  claim 1 , wherein in the installing of the masking tape, the masking tape is installed to surround an end portion of the driving circuit connected to the second substrate. 
     
     
       3. The method of  claim 1 , wherein in the removing of the inner side of the masking tape, a shape of the masking tape of which the inner side is removed is a shape of a rectangular band.