US11424149B2ActiveUtilityA1

Substrate transfer mechanism to reduce back-side substrate contact

84
Assignee: APPLIED MATERIALS INCPriority: Feb 12, 2018Filed: Jun 11, 2020Granted: Aug 23, 2022
Est. expiryFeb 12, 2038(~11.6 yrs left)· nominal 20-yr term from priority
Inventors:Masato IshiiRichard O. CollinsRichard GiljumAlexander Berger
H10P 72/7616H10P 72/7612H10P 72/7611H10P 72/7602H10P 72/3308H10P 72/3306H10P 72/0602H10P 72/0468H10P 72/0466H10P 72/0464H10P 72/0441H10P 72/0436H10P 72/0434H10P 72/0402H10P 72/50H10P 72/33H10P 72/18H10P 72/3411H10P 72/7608H10P 72/53H10P 72/3302H10P 72/3304H10P 72/0454H10P 72/0452H10P 72/3402H10P 72/0431H01L 21/67115H01L 21/67346H01L 21/68H01L 21/68742H01L 21/67196H01L 21/67201H01L 21/67126H01L 21/67109H01L 21/67017H01L 21/68707H01L 21/67248H01L 21/67748H01L 21/67751H01L 21/67207H01L 21/67739H01L 21/68757H01L 21/68735H01L 21/67778H10P 72/34
84
PatentIndex Score
1
Cited by
35
References
20
Claims

Abstract

A substrate processing system is disclosed which includes a processing chamber comprising a susceptor having a first surface and a second surface opposite to the first surface, a groove formed in the first surface adjacent to a perimeter thereof, and a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed from the second surface to the first surface, wherein the opening is recessed from the groove.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A processing chamber, comprising:
 a susceptor having a first surface and a second surface opposite to the first surface; 
 a groove formed in the first surface adjacent to a perimeter thereof, the groove including a reference surface, wherein the reference surface is recessed from a plane of the first surface; and 
 a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening formed between the second surface and the reference surface, wherein the opening includes an angled opening sidewall that is recessed to begin at a distance from the reference surface, and each of the plurality of carrier lift pins comprises:
 a convex portion configured to contact a concave portion of a substrate carrier, 
 
 wherein the plurality of carrier lift pins are movable between a raised position and a lowered position relative to the susceptor, wherein in the raised position the convex portion contacts the concave portion of the substrate carrier and in the lowered position the convex portion is spaced from the substrate carrier. 
 
     
     
       2. The processing chamber of  claim 1 , wherein the reference surface is configured to support the substrate carrier, and the reference surface is parallel with the first surface. 
     
     
       3. The processing chamber of  claim 1 , wherein the substrate support structure includes a plurality of first support arms and a plurality of second support arms. 
     
     
       4. The processing chamber of  claim 3 , wherein each of the first support arms contacts the second surface of the susceptor. 
     
     
       5. The processing chamber of  claim 3 , wherein each of the second support arms supports a lift pin of the plurality of carrier lift pins. 
     
     
       6. The processing chamber of  claim 3 , wherein each of the plurality of carrier lift pins is positioned to extend through a lift pin opening formed in one of the first support arms. 
     
     
       7. The processing chamber of  claim 2 , wherein each of the plurality of carrier lift pins includes a flared head, the flared head comprising:
 an angled head sidewall configured to fit with the angled opening sidewall; and 
 the convex portion. 
 
     
     
       8. A processing chamber, comprising:
 a susceptor having a body with a first surface and a second surface opposite to the first surface; 
 a groove formed in the first surface adjacent to a perimeter thereof, the groove including a recessed surface that is recessed from a plane of the first surface; and 
 a substrate support structure including a plurality of carrier lift pins, each of the plurality of carrier lift pins movably disposed in an opening positioned in the groove, the opening formed through the body and the opening including an angled opening sidewall that is recessed to begin at a distance from the recessed surface of the groove, and each of the plurality of carrier lift pins comprises:
 a convex portion configured to contact a concave portion of a substrate carrier, 
 
 wherein the plurality of carrier lift pins are movable between a raised position and a lowered position relative to the susceptor, wherein in the raised position the convex portion contacts the concave portion of the substrate carrier and in the lowered position the convex portion is spaced from the substrate carrier. 
 
     
     
       9. The processing chamber of  claim 8 , wherein the substrate support structure includes a plurality of first support arms and a plurality of second support arms. 
     
     
       10. The processing chamber of  claim 9 , wherein each of the first support arms contacts the second surface of the susceptor. 
     
     
       11. The processing chamber of  claim 9 , wherein each of the second support arms supports a carrier lift pin of the plurality of carrier lift pins. 
     
     
       12. The processing chamber of  claim 9 , wherein each of the plurality of carrier lift pins is positioned to extend through a lift pin opening formed in one of the first support arms. 
     
     
       13. The processing chamber of  claim 1 , wherein the lowered position is a suspended position where the plurality of carrier lift pins are suspended from the susceptor. 
     
     
       14. The processing chamber of  claim 1 , wherein the reference surface is configured to support the substrate carrier. 
     
     
       15. The processing chamber of  claim 7 , wherein the lowered position is a suspended position where the plurality of carrier lift pins are suspended from the susceptor. 
     
     
       16. The processing chamber of  claim 8 , wherein the recessed surface is configured to support the substrate carrier, and the recessed surface is parallel with the first surface. 
     
     
       17. The processing chamber of  claim 16 , wherein each of the plurality of carrier lift pins includes a flared head, the flared head comprising:
 an angled head sidewall configured to fit with the angled opening sidewall; and 
 the convex portion. 
 
     
     
       18. The processing chamber of  claim 17 , wherein the lowered position is a suspended position where the plurality of carrier lift pins are suspended from the susceptor. 
     
     
       19. The processing chamber of  claim 8 , wherein the lowered position is a suspended position where the plurality of carrier lift pins are suspended from the susceptor. 
     
     
       20. The processing chamber of  claim 8 , wherein the recessed surface is configured to support the substrate carrier.

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