LED lighting arrangement

Abstract

The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

What is claimed is: 
     
       1. A light-emitting diode (LED) lighting system comprising:
 a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; 
 a plurality of LED strings, each of the plurality of LED strings comprising a plurality of LEDs connected in series and arranged on the mounting surface in a two-dimensional array comprising at least two rows; and 
 at least one micro-via extending through the dielectric layer of the single-layer carrier and electrically coupling a cathode of a last one of the series-connected LEDs in each of the plurality of LED strings to the metal core of the single-layer carrier. 
 
     
     
       2. The system according to  claim 1 , wherein the plurality of LEDs are surface-mount wafer-level LEDs comprising anode and cathode contacts. 
     
     
       3. The system according to  claim 1 , wherein each of the plurality of LEDs has a rated current density of at least 500 mA/mm2. 
     
     
       4. The system according to  claim 1 , wherein each of the plurality of LEDs has a rated current density of at least 1500 mA/mm2. 
     
     
       5. The system according to  claim 1 , wherein each of the plurality of LEDs further comprises a side coat with a thickness less than or equal to 100 μm. 
     
     
       6. The system according to  claim 1 , wherein each of the plurality of LEDs further comprises a side coat with a thickness less than or equal to 20 μm. 
     
     
       7. The system according to  claim 1 , wherein each of the plurality of LEDs further comprises a reflective side coat. 
     
     
       8. The system according to  claim 1 , wherein adjacent LEDs of the plurality of LEDs are separated by a gap less than or equal to 200 μm. 
     
     
       9. The system of  claim 1 , wherein adjacent LEDs of the plurality of LEDs are separated by a gap less than or equal to 100 μm. 
     
     
       10. The system of  claim 1 , wherein adjacent LEDs of the plurality of LEDs are separated by a gap less than or equal to 50 μm. 
     
     
       11. The system of  claim 1 , further comprising a switch for each LED of the plurality of LEDs. 
     
     
       12. The system according to  claim 1 , wherein the single-layer carrier one of an insulated metal substrate and a metal core printed circuit board. 
     
     
       13. The system according to  claim 1 , wherein the micro-via is copper-lined. 
     
     
       14. The system according to  claim 1 , wherein the micro-via has a diameter between 50 μm and 200 μm. 
     
     
       15. The system according to  claim 1 , wherein the plurality of LED strings comprises at least four LED strings, wherein each of the plurality of LED strings comprises at least ten LEDs. 
     
     
       16. The system according to  claim 15 , wherein each of the plurality of LED strings comprises at least twelve LEDs. 
     
     
       17. A light-emitting diode (LED) lighting system comprising:
 a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; 
 a plurality of LED strings, each of the plurality of LED strings comprising a plurality of LEDs connected in series and arranged on the mounting surface in a two-dimensional array comprising at least two rows; 
 at least one micro-via extending through the dielectric layer of the single-layer carrier and electrically coupling a cathode of a last one of the series-connected LEDs in each of the plurality of LED strings to the metal core of the single-layer carrier; 
 a control interface; and 
 an imaging lens opposite the plurality of LEDs. 
 
     
     
       18. The system according to  claim 17 , wherein the plurality of strings of LEDs comprises four strings of twelve LEDs, the two-dimensional array is a 4×12 array, and each string is arranged in a 2×6 array configuration.