Light emitting structure

Abstract

A light emitting structure includes a substrate, at least one light emitting chip disposed on the substrate and, a side wall disposed on the substrate and surrounding the at least one light emitting chip, a cover disposed on the side wall, an anti-reflective coating disposed on the cover, and a protective layer disposed on outside of the cover, wherein the cover, the side wall and the substrate define an enclosed space for accommodating the at least one light emitting chip.

What is claimed is: 
     
       1. A light emitting structure, comprising:
 a substrate; 
 at least one light emitting chip disposed on the substrate; 
 a side wall disposed on the substrate and surrounding the at least one light emitting chip; 
 a cover disposed on the side wall, wherein the cover, the side wall and the substrate surrounds and defines an enclosed space for accommodating the at least one light emitting chip; 
 an anti-reflective coating disposed on the cover; and 
 a protective layer disposed on outside of the anti-reflective coating, 
 wherein the protective layer is a fluorine-based polymer having a hydroxyl group, and has a following structure:
   COOH—(CF 2 ═CFCF 2 CF 2 —O—CF═CF 2 ) m —COOH,
 
 
 where m is a positive integer from 18 to 1.5*10 5 . 
 
     
     
       2. The light emitting structure according to  claim 1 , wherein at least one adhesive is disposed at a junction of the side wall and the substrate and/or the cover, and the at least one adhesive is covered by the protective layer. 
     
     
       3. The light emitting structure according to  claim 2 , wherein the protective layer includes a body portion located on the cover and an extension portion extending towards the side wall covering the adhesive at the junction of the cover and the side wall or towards the substrate covering the adhesive at the junction of the side wall and the substrate. 
     
     
       4. The light emitting structure according to  claim 2 , wherein the cover has opposing first and second surfaces, the anti-reflective coating includes a first anti-reflective coating disposed on the first surface of the cover and a second anti-reflective coating disposed on the second surface of the cover. 
     
     
       5. The light emitting structure according to  claim 2 , wherein the side wall and the cover are integrally formed, a first adhesive is disposed at the junction of the side wall and the substrate, and the first adhesive is covered by the protective layer. 
     
     
       6. The light emitting structure according to  claim 2 , wherein the side wall and the substrate are integrally formed, a second adhesive is disposed at the junction of the side wall and the cover, and the second adhesive is covered by the protective layer. 
     
     
       7. The light emitting structure according to  claim 2 , wherein a first adhesive is disposed at the junction of the side wall and the cover, and a second adhesive is disposed at the junction of the side wall and the substrate, and the first adhesive and the second adhesive are covered by the protective layer. 
     
     
       8. The light emitting structure according to  claim 2 , further comprising a blocking structure disposed on the substrate to provide a predetermined distance between the side wall and the at least one light emitting chip. 
     
     
       9. The light emitting structure according to  claim 8 , wherein the blocking structure is sequentially stacked in a multilayer structure. 
     
     
       10. The light emitting structure according to  claim 8 , wherein the side wall has a metal multi-layer structure being formed by sequential stacking and deposition on the substrate. 
     
     
       11. The light emitting structure according to  claim 1 , wherein the at least one light emitting chip emitting light in a wavelength range from 200 nm to 400 nm. 
     
     
       12. The light emitting structure according to  claim 1 , wherein the side wall has a multi-layer structure formed by sequential stacking. 
     
     
       13. The light emitting structure according to  claim 1 , wherein the side wall is in stepped shape, vertical shape or inclined shape. 
     
     
       14. The light emitting structure according to  claim 1 , wherein the cover has opposing first and second surfaces, and the anti-reflective coating includes a first anti-reflective coating disposed on the first surface of the cover and a second anti-reflective coating disposed on the second surface of the cover. 
     
     
       15. The light emitting structure according to  claim 1 , wherein a thickness of the protective layer is between 30 nm and 120 nm, and meets the following relationship:
   the thickness of the protective layer ( T )=the emission wavelength (λ) of the light emitting chip/4.
 
 
     
     
       16. The light emitting structure according to  claim 1 , wherein a thickness of the anti-reflective coating is between 30 nm and 120 nm, and the material of the anti-reflective coating is selected from silicon dioxide with oxide. 
     
     
       17. The light emitting structure according to  claim 1 , wherein the refractive index of the cover is larger than the refractive indexes of the protective layer and the anti-reflective coating. 
     
     
       18. The light emitting structure according to  claim 1 , wherein the cover is planar lens, a dome lens, a hollow dome lens, or a hollow square lens. 
     
     
       19. A light emitting structure, comprising:
 a substrate; 
 at least one light emitting chip disposed on the substrate; 
 a side wall disposed on the substrate and surrounding the at least one light emitting chip; 
 a cover disposed on the side wall, wherein the cover, the side wall and the substrate surrounds and defines an enclosed space for accommodating the at least one light emitting chip; 
 an anti-reflective coating disposed on the cover; and 
 a protective layer disposed on outside of the anti-reflective coating; 
 wherein a thickness of the protective layer is between 30 nm and 120 nm, and meets the following relationship:
   the thickness of the protective layer ( T )=the emission wavelength (λ) of the light emitting chip/4.
 
 
 
     
     
       20. A light emitting structure, comprising:
 a substrate; 
 at least one light emitting chip disposed on the substrate; 
 a side wall disposed on the substrate and surrounding the at least one light emitting chip; 
 a cover disposed on the side wall, wherein the cover, the side wall and the substrate surrounds and defines an enclosed space for accommodating the at least one light emitting chip; 
 an anti-reflective coating disposed on the cover; and 
 a protective layer disposed on outside of the anti-reflective coating; 
 wherein the cover is a planar lens, a dome lens, a hollow dome lens, or a hollow square lens.