Method for manufacturing wiring board or wiring board material

Abstract

Provide are a method for manufacturing a wiring board or a wiring board material, and the wiring board obtained by the method, which allows columnar metal members to be inserted into the wiring board at once using a simple operation, enables alignment without requiring strict accuracy, can handle columnar metal members having different shapes, and imparts sufficiently high adhesive strength to the columnar metal members.The method includes the steps of: laminating a laminate material LM including the support sheet 10 having the columnar metal members 14 formed thereon, a wiring board WB or a wiring board material WB′ having a plurality of openings in portions corresponding to the columnar metal members 14, and a prepreg 16′ having a plurality of openings in portions corresponding to the columnar metal members 14 and containing a thermosetting resin such that the columnar metal members 14 are positioned in the respective openings; integrating the laminate material LM by heating and pressing to obtain a laminate LB including a thermosetting resin filled between an inner surface of each of the openings of the wiring board WB or the wiring board material WB′ and each of the columnar metal members 14; and peeling at least the support sheet 14 from the laminate LB.

What is claimed is: 
     
       1. A method for manufacturing a wiring board or a wiring board material, the method comprising the steps of:
 preparing a laminate material including a support sheet, a plurality of columnar metal members on the support sheet, and a wiring board or a wiring board material having a plurality of openings in portions corresponding to the columnar metal members such that the columnar metal members are positioned in the respective openings, and a resin film which adheres to a surface of the wiring board or the wiring board material and has a plurality of openings in portions corresponding to the columnar metal members; 
 obtaining a laminate including a thermosetting resin filled and cured between an inner surface of each of the openings of the wiring board or the wiring board material and each of the columnar metal members; and 
 peeling at least the support sheet and the resin film from the laminate. 
 
     
     
       2. The method for manufacturing a wiring board or a wiring board material according to  claim 1 , wherein a plated through hole is formed in each of the openings of the wiring board or the wiring board material.