Mechanically flexible cold plates for low power components

Abstract

An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

What is claimed is: 
     
       1. An apparatus comprising:
 a cold plate; 
 a thermally conductive sheet that is in thermal and mechanical contact with the cold plate via spring fingers of the sheet, which surround and slippably engage all sides of an outer edge of the cold plate; 
 an assembled circuit board, which has a topology that defines positions and dimensions of components mounted to the circuit board; 
 a high-power component mounted to the circuit board; and 
 a low-power component mounted to the circuit board; 
 wherein the cold plate makes thermal contact with the high-power component through a first separable thermal interface material; and 
 wherein the thermally conductive sheet is formed to match the topology of the circuit board, and makes thermal contact with the low-power component at a portion of the sheet that is distal from the cold plate. 
 
     
     
       2. The apparatus of  claim 1  further comprising:
 a second separable thermal interface material disposed in thermal and mechanical contact between the sheet and the low-power component. 
 
     
     
       3. The apparatus of  claim 1  wherein the high-power component protrudes from the circuit board to a first height and the low-power component protrudes from the circuit board to a second height that is different than the first height.