Transformer, electromagnetic device and manufacturing method of the transformer

Abstract

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

What is claimed is: 
     
       1. A transformer, comprising:
 a base plate comprising:
 a central part defining multiple inner via holes each running through the base plate; and 
 a peripheral part defining multiple outer via holes each running through the base plate; 
 wherein an annular accommodating groove is defined between the central part and the peripheral part; 
 
 a magnetic core received in the annular accommodating groove; 
 transmission wire layers disposed respectively on two Opposite sides of the base plate, wherein each of the transmission wire layers comprises multiple conductive wire patterns spaced apart and arranged along a circumferential direction of the annular accommodating groove, and each of the multiple conductive wire patterns bridges one of the inner via holes and a corresponding one of the outer via holes; and 
 multiple conductive parts respectively disposed in the inner via holes and the outer via holes and configured to connect the multiple conductive wire patterns of the two transmission wire layers in order to forma coil circuit capable of transmitting current around the magnetic core; 
 wherein the width of at least some of the multiple conductive wire patterns gradually increases along a wiring direction from the inner via holes to the outer via holes such that a distance between at least some of adjacent ones of the multiple conductive wire patterns keeps consistent within an area corresponding to the annular accommodating groove; and 
 the multiple inner via holes comprise multiple first inner via holes and multiple second inner via holes; and 
 a distance between each of the multiple first inner via holes and a center of the central part is smaller than a distance between each of the multiple second inner via holes and the center of the central part. 
 
     
     
       2. The transformer of  claim 1 , wherein
 the distance between the at least some of adjacent ones of the conductive wire patterns within the area corresponding to the annular accommodating groove is from 50 μm to 150 μm. 
 
     
     
       3. The transformer of  claim 1 , wherein
 the multiple first inner via holes comprise multiple first sub inner via holes and multiple second sub inner via holes; and 
 a distance between each of the multiple first sub inner via holes and the center of the central part is smaller than a distance between each of the multiple second sub inner via holes and the center of the central part. 
 
     
     
       4. The transformer of  claim 1 , wherein
 distances between each of the multiple first inner via holes and two adjacent ones of the multiple second inner via holes are identical. 
 
     
     
       5. The transformer of  claim 1 , wherein
 the multiple conductive wire patterns comprise multiple input lines and multiple coupling lines, and are divided into multiple input line groups and multiple coupling line groups; 
 each of the multiple input line groups comprises at least one of the multiple input lines, and each of the multiple coupling line groups comprises at least one of the multiple coupling lines; and 
 the multiple input line groups and the multiple coupling line groups are alternately arranged along the circumferential direction of the annular accommodating groove. 
 
     
     
       6. The transformer of  claim 5 , wherein
 each of the multiple input line groups comprises only one of the multiple input lines, and each of the multiple coupling line groups comprises only one of the multiple coupling lines such that the input lines and the coupling lines of the transformer are alternately arranged along the circumferential direction of the annular accommodating groove. 
 
     
     
       7. The transformer of  claim 5 , wherein a number of the input lines is equal to a number of the coupling lines. 
     
     
       8. The transformer of  claim 1 , wherein
 each of the transmission wire layers comprises an input line layer and a coupling line layer stacked together along an axial direction of the inner via holes; 
 the multiple conductive wire patterns comprise multiple input lines and multiple coupling lines, the multiple input lines are included in the input line layer, and the multiple coupling lines are included in the coupling line layer; and 
 a projection of the input lines on the base plate and a projection of the coupling lines on the base plate are alternately arranged along the circumferential direction of the annular accommodating groove. 
 
     
     
       9. The transformer of  claim 1 , wherein the thickness of each of the transmission wire layers is from 17 μm to 102 μm. 
     
     
       10. An electromagnetic device, comprising:
 a base plate defining a plurality of annular accommodating grooves, wherein the plurality of annular accommodating grooves divides the base plate into a peripheral part and a plurality of central parts, each of the plurality of central parts defines a plurality of inner via holes running through the base plate, and the peripheral part defines a plurality of outer via holes running through the base plate, 
 a plurality of magnetic cores each received in a respective one of the plurality of annular accommodating grooves; 
 transmission wire layers disposed respectively on two opposite sides of the base plate, wherein each of the transmission wire layers comprises a plurality sets of conductive wire patterns, the conductive wire patterns are spaced apart, and the conductive wire patterns of each of the plurality sets of conductive wire patterns are arranged along a circumferential direction of a corresponding one of the plurality of annular accommodating grooves, and each of the conductive wire patterns bridges one of the plurality of inner via holes and a corresponding one of the plurality of outer via holes; and 
 a plurality of conductive parts respectively disposed in the inner via holes and the outer via holes and configured to connect the conductive wire patterns of each of the plurality sets of conductive wire patterns in order to form a plurality of coil circuits capable of transmitting current, wherein each of the plurality of coil circuits is located around a corresponding one of the plurality of magnetic cores; 
 wherein the width of at least some of the conductive wire patterns gradually increases along a wiring direction from the inner via holes to the outer via holes such that a distance between at least some of adjacent ones of the conductive wire patterns keeps consistent within an area corresponding to the corresponding one of the plurality of annular accommodating grooves. 
 
     
     
       11. The electromagnetic device of  claim 10 , wherein
 the distance between at least some of adjacent ones of the multiple conductive wire patterns within the area corresponding to the corresponding one of the plurality of annular accommodating grooves is from 50 μm to 150 μm. 
 
     
     
       12. The electromagnetic device of  claim 10 , wherein
 the plurality of inner via holes comprises a plurality of first inner via holes and a plurality of second inner via holes surrounding the plurality of first inner via holes. 
 
     
     
       13. The electromagnetic device of  claim 12 , wherein
 distances between each of the plurality of first inner via holes and two adjacent ones of the plurality of second inner via holes are identical. 
 
     
     
       14. The electromagnetic device of  claim 10 , wherein
 each of the plurality sets of the conductive wire patterns comprises a plurality of input lines and a plurality of coupling lines, and is divided into a plurality of input line groups and a plurality of coupling line groups; 
 each of the plurality of input line groups comprises at least one of the plurality of input lines, and each of the plurality of coupling line groups comprises at least one of the plurality of coupling lines; and 
 the plurality of input line groups and the plurality of coupling line groups are alternately arranged along the circumferential direction of the corresponding one of the plurality of annular accommodating groove. 
 
     
     
       15. The electromagnetic device of  claim 14 , wherein
 each of the plurality of input line groups comprises only one of the plurality of input lines, and each of the plurality of coupling line groups comprises only one of the plurality of coupling lines, such that the plurality of input lines and the plurality of coupling lines are alternately arranged along the circumferential direction of the corresponding one of the plurality of annular accommodating groove. 
 
     
     
       16. The electromagnetic device of  claim 10 , further comprising:
 a bonding layer set on one side of the base plate, and configured to fix and electrically connect with an external electronic component; 
 wherein the bonding layer is arranged in a same layer as one of the transmission wire layers located at the same side of the base plate, the bonding layer is electrically connected with the one of the transmission wire layers. 
 
     
     
       17. The electromagnetic device of  claim 10 , further comprising:
 a composite layer comprising an adhesive layer set on one of the transmission wire layers and a conductive layer set on the adhesive layer; 
 the conductive layer is configured to electrically connect to an external electronic component, the adhesive layer is configured to fix the conductive layer on the one of the transmission wire layers and to insulate them; and 
 the composite layer defines a conductive hole passing through the adhesive layer and the conductive layer and reaching the one of the transmission wire layers, such that the one of the transmission wire layers is electrically connected with the external electronic component.