Photodiode package structure with shutters, forming method thereof, and wearable device having the same

Abstract

According to the disclosure, a photodiode package structure is provided. The photodiode package structure includes a substrate, a photodiode chip on the substrate, a plurality of shutters above the photodiode chip, and a seal member covering the substrate and the photodiode chip, in which the shutters are embedded in the seal member.

What is claimed is: 
     
       1. A photodiode package structure, comprising:
 a substrate; 
 a photodiode chip on the substrate; 
 a plurality of shutters above the photodiode chip; and 
 a seal member covering the substrate and the photodiode chip, wherein the shutters are embedded in the seal member, 
 wherein each of the shutters comprises a first end close to a top surface of the seal member and a second end away from the top surface of the seal member, the first end inclines toward the light source, and the second end inclines away the light source. 
 
     
     
       2. The photodiode package structure of  claim 1 , wherein the shutters comprise a top surface coplanar with a top surface of the seal member. 
     
     
       3. The photodiode package structure of  claim 1 , wherein the shutters comprise a non-transparent UV resin, a non-transparent plastic material, or a non-transparent metal. 
     
     
       4. The photodiode package structure of  claim 3 , wherein the non-transparent UV resin comprises acrylate resin or epoxy resin. 
     
     
       5. The photodiode package structure of  claim 1 , wherein an angle is defined between the shutters and a vertical direction of a top surface of the seal member, and the angle is 0° to 30°. 
     
     
       6. The photodiode package structure of  claim 1 , wherein a height of each of the shutters is in a range of 0.1 mm to 0.5 mm. 
     
     
       7. The photodiode package structure of  claim 1 , wherein a width of each of the shutters is in a range of 20 μm to 50 μm. 
     
     
       8. The photodiode package structure of  claim 1 , wherein a space between adjacent two of the shutters is in a range of 0.1 mm to 0.5 mm. 
     
     
       9. The photodiode package structure of  claim 1 , wherein a gap between the shutters and the photodiode chip is in a range of 0.1 mm to 0.5 mm. 
     
     
       10. A method of forming photodiode package structure, comprising:
 providing a substrate; 
 disposing a photodiode chip on the substrate; 
 forming a seal member covering the photodiode chip and the substrate, wherein the seal member comprises a plurality of trenches above the photodiode chip; 
 forming a non-transparent layer on the seal member and in the trenches; 
 curing the non-transparent layer; and 
 removing portions of the non-transparent layer on a top surface of the seal member, wherein remained portions of the non-transparent layer in the trenches form a plurality of shutters above the photodiode chip, 
 wherein each of the shutters comprises a first end close to a top surface of the seal member and a second end away from the top surface of the seal member, the first end inclines toward the light source, and the second end inclines away the light source. 
 
     
     
       11. The method of  claim 10 , wherein forming the seal member further comprises:
 forming a flat transparent sealing material covering the photodiode chip and the substrate; and 
 cutting the flat transparent sealing material to form the trenches above the photodiode chip. 
 
     
     
       12. The method of  claim 11 , wherein cutting the flat transparent sealing material comprises cutting the flat transparent sealing material with a blade. 
     
     
       13. The method of  claim 10 , wherein forming the seal member further comprises:
 placing the photodiode chip and the substrate in a mold; 
 injecting a transparent sealing material in the mold; and 
 removing the mold. 
 
     
     
       14. The method of  claim 13 , wherein the mold comprises a plurality of comb teeth corresponding to the trenches above the photodiode chip. 
     
     
       15. The method of  claim 10 , wherein forming the seal member comprises forming the trenches in the seal member with an angle between the trenches and a vertical direction of the top surface of the seal member, and the angle is 0° to 30°. 
     
     
       16. The method of  claim 10 , wherein curing the non-transparent layer comprises curing the non-transparent layer by a UV light source. 
     
     
       17. A wearable device, comprising:
 a carrier; 
 a light source on the carrier; and 
 a photodiode package structure adjacent to the light source on the carrier, wherein the photodiode package structure comprises a photodiode chip, a seal member covering the photodiode chip, and a plurality of shutters embedded in the seal member above the photodiode chip, 
 wherein each of the shutters comprises a first end close to a top surface of the seal member and a second end away from the top surface of the seal member, the first end inclines toward the light source, and the second end inclines away the light source. 
 
     
     
       18. The wearable device of  claim 17 , wherein an angle is defined between the shutters and a vertical direction of a top surface of the seal member, and the angle is 0° to 30°. 
     
     
       19. The wearable device of  claim 17 , wherein each of the shutters comprises a first end coplanar with a top surface of the seal member.