Circuit board with heat dissipation function and method for manufacturing the same

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

What is claimed is: 
     
       1. A method for manufacturing a circuit board, comprising:
 providing a first metal layer, the first metal layer comprising a main body and at least two first pillars protruding from the main body, a first slot defined among the main body and adjacent two of the first pillars; 
 forming a first adhesive layer in the first slot; 
 electroplating copper on each of the first pillars to form a first heat conducting portion, causing the first heat conducting portion to be in thermal conduction with the first pillar; 
 forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; 
 filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion, causing the second beat conducting portion to be in thermal conduction with the first heat conducting portion; 
 forming a first wiring layer on the first insulating layer, causing the first wiring layer to be in thermal conduction with the second heat conducting portion; 
 forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer, and the second blind hole corresponding to the first blind hole; 
 electroplating copper in the second blind hole to form a third heat conducting portion, causing the third heat conducting portion to be in thermal conduction with the first wiring layer; and 
 mounting an electronic component on the second insulating layer, causing the electronic component to be in thermal conduction with the third heat conducting portion, thereby obtaining the circuit board. 
 
     
     
       2. The method of  claim 1 , wherein after forming the third heat conducting portion, the method further comprises:
 forming a second wiring layer, a third insulating layer, and a third wiring layer on the second insulating layer in that order to obtain a circuit substrate; and 
 cutting the third wiring layer along a thickness direction of the circuit substrate to form a groove, the groove penetrating the third wiring layer, the third insulating layer, and the second wiring layer, wherein the third heat conducting portion is exposed from the groove, and the electronic component is disposed in the groove. 
 
     
     
       3. The method of  claim 2 , wherein the first metal layer further comprises at least two second pillars protruding from the main body, the second pillars and the first pillars are disposed on two opposite surfaces of the main body, a second slot is defined among the main body and adjacent two of the second pillars, and the method further comprises:
 forming a second adhesive layer in the second slot; 
 electroplating copper on each of the second pillars to form a first heat conducting member, causing the first heat conducting member to be in thermal conduction with the second pillar; 
 forming a fourth insulating layer on the second adhesive layer and the first heat conducting portion, and defining a first blind groove in the fourth insulating layer; 
 filling thermoelectric separation metal in the first blind groove to form a second heat conducting portion, causing the second heat conducting portion to be in thermal conduction with the first heat conducting portion; 
 forming a fourth wiring layer on the fourth insulating layer, causing the fourth wiring layer to be in thermal conduction with the second heat conducting portion; 
 forming a second metal layer on the fourth wiring layer, causing the second metal layer to be in thermal conduction with the fourth wiring layer; 
 defining a second blind groove in the second metal layer, the second blind groove aligned with the first blind groove; 
 electroplating copper on a sidewall of the second blind groove to form a third heat conducting portion, causing the third heat conducting portion to be in thermal conduction with the fourth wiring layer; and 
 forming a fifth wiring layer on the second metal layer, causing the fifth wiring layer to be in thermal conduction with the second metal layer and the third heat conducting portion. 
 
     
     
       4. The method of  claim 3 , wherein after defining the second blind groove in the second metal layer, the method further comprises:
 defining a third blind groove in the second metal layer, the third blind groove and the first blind groove staggered with each other; and 
 electroplating copper on a sidewall of the third blind groove to form a fourth heat conducting portion, causing the fourth heat conducting portion to be in thermal conduction with the fourth wiring layer and the fifth wiring layer. 
 
     
     
       5. The method of  claim 3 , wherein a first intermediate is obtained after forming the first insulating layer, and a second intermediate is obtained after forming the third insulating layer, the method further comprises:
 defining a through hole in the first intermediate body; 
 filling thermoelectric separation metal in the through hole to form a first heat conducting channel, causing the first heat conducting channel to be in thermal conduction with the first wiring layer and the fourth wiring layer; 
 defining an opening in the second intermediate body, the opening penetrating the third insulating layer, the second wiring layer, and the second insulating layer, and a bottom of the opening corresponding to the first wiring layer, the opening aligned with the through hole; 
 electroplating copper in the opening to form a second heat conducting channel, causing the second heat conducting channel to be in thermal conduction with the first wiring layer and the second wiring layer, wherein the second heat conducting channel is also in thermal conduction with the third wiring layer. 
 
     
     
       6. The method of  claim 3 , wherein the first pillars and the second pillars are aligned with each other in a thickness direction of the first metal layer. 
     
     
       7. The method of  claim 3 , wherein a surface of the first adhesive layer away from the main body is flush with a surface of the first pillars away from the main body; a surface of the second adhesive layer away from the main body is flush with a surface of the second pillars away from the main body. 
     
     
       8. The method of  claim 3 , wherein the second metal layer is made of thermoelectric separation metal. 
     
     
       9. The method of  claim 1 , wherein the electroplated copper is disposed on a sidewall and a bottom of the second blind hole, the method further comprises:
 filling thermoelectric separation metal in the second blind hole having the electroplated copper, wherein the electroplated copper and the thermoelectric separation metal in the second blind hole cooperatively form the third heat conducting portion. 
 
     
     
       10. The method of  claim 1 , wherein the thermoelectric separation metal is aluminum nitride or potassium nitride.