Display backplane and method of manufacturing the same, display device

Abstract

A display backplane includes a base, a plurality of driving electrodes disposed above the base, and a connection structure disposed on at least one of the plurality of driving electrodes. An orthographic projection of the connection structure on the base is within an orthographic projection of a corresponding driving electrode on the base; and the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode.

What is claimed is: 
     
       1. A display backplane having a plurality of sub-pixel regions, comprising:
 a base; 
 a plurality of driving electrodes disposed above the base, at least two of the plurality of driving electrodes being located in one of the plurality of sub-pixel regions; 
 a connection structure disposed on at least one of the plurality of driving electrodes, an orthographic projection of the connection structure on the base being within an orthographic projection of a corresponding driving electrode on the base; and 
 at least one driving transistor located in one of the plurality of sub-pixel regions and disposed on the base; 
 wherein the connection structure includes at least one conductive portion disposed at a first included angle with the corresponding driving electrode, 
 wherein the at least two driving electrodes are located on a side of a corresponding driving transistor facing away from the base, and 
 wherein one of every two driving electrodes in a same sub-pixel region is electrically connected to a corresponding driving transistor. 
 
     
     
       2. The display backplane according to  claim 1 , wherein the first included angle is within a range from 85° to 95° , inclusive. 
     
     
       3. The display backplane according to  claim 1 , wherein the connection structure further includes a bottom portion connected to the at least one conductive portion, and the bottom portion is directly in contact with the corresponding driving electrode. 
     
     
       4. The display backplane according to  claim 3 , wherein the at least one conductive portion and the bottom portion in a same connection structure are an integrated structure. 
     
     
       5. The display backplane according to  claim 3 , wherein the at least one conductive portion includes a plurality of conductive portions, and the plurality of conductive portions are arranged at intervals around a contour of the bottom portion. 
     
     
       6. The display backplane according to  claim 1 , wherein an orthographic projection of the at least one conductive portion on the base is in a closed shape. 
     
     
       7. The display backplane according to  claim 6 , wherein the at least one conductive portion has a tubular structure. 
     
     
       8. The display backplane according to  claim 1 , wherein the at least one conductive portion has a tubular structure with a side wall, the side wall includes at least one crack, and the at least one crack extends to a surface of an end wall on a side of the tubular structure away from the driving electrode. 
     
     
       9. The display backplane according to  claim 1 , wherein a hardness of the at least one conductive portion is greater than a hardness of the corresponding driving electrode. 
     
     
       10. The display backplane according to  claim 9 , wherein a material of the at least one conductive portion includes tungsten, titanium or molybdenum. 
     
     
       11. The display backplane according to  claim 1 , further comprising a conductive plating layer disposed on the at least one conductive portion in each connection structure. 
     
     
       12. A method of manufacturing a display backplane having a plurality of sub-pixel regions, comprising:
 providing a base; 
 forming a plurality of driving electrodes above the base, at least two of the plurality of driving electrodes being located in one of the plurality of sub-pixel regions; 
 forming a connection structure on at least one of the plurality of driving electrodes, an orthographic projection of the connection structure on the base being within an orthographic projection of a corresponding driving electrode on the base, and the connection structure including at least one conductive portion disposed at a first included angle with the corresponding driving electrode; and 
 forming at least one driving transistor located in one of the plurality of sub-pixel regions and disposed on the base, the at least two driving electrodes being located on a side of a corresponding driving transistor facing away from the base, and one of every two driving electrodes in a same sub-pixel region being electrically connected to a corresponding driving transistor. 
 
     
     
       13. The method of manufacturing the display backplane according to  claim 12 , wherein forming the connection structure on at least one of the plurality of driving electrodes, includes:
 forming a first target layer and a second target layer in a stack on a side of at least one of the plurality of driving electrodes facing away from the base, and a hardness of the second target layer being greater than a hardness of the first target layer; 
 forming at least one through hole penetrating through the second target layer and the first target layer, the at least one through hole being located in a region where the at least one of the plurality of driving electrodes is located, and the at least one through hole being in a one-to-one correspondence with the at least one driving electrode; 
 depositing a first metal film, and a portion of the first metal film in each through hole of the at least one through hole being electrically connected to a corresponding driving electrode; 
 patterning the first metal film to retain the portion of the first metal film in each through hole; and 
 removing the second target layer and the first target layer to form the connection structure. 
 
     
     
       14. The method of manufacturing the display backplane according to  claim 13 , wherein after the first metal film is deposited and before the first metal film is patterned, the method of manufacturing the display backplane further comprises:
 forming a photoresist on the portion of the first metal film in each through hole by a coating process; 
 patterning the first metal film, further includes: patterning the first metal film by chemical mechanical polishing; and 
 removing the second target layer and the first target layer to form the connection structure, further includes: 
 removing the second target layer, the first target layer and the photoresist to form the connection structure. 
 
     
     
       15. The method of manufacturing the display backplane according to  claim 13 , wherein after the first metal film is deposited and before the first metal film is patterned, the method of manufacturing the display backplane further comprises:
 forming a photoresist by a coating process, and the photoresist at least covering the portion of the first metal film in each through hole; and 
 patterning the photoresist to retain a portion of the photoresist in each through hole, wherein taking a surface of the base as a reference plane, a surface of the patterned photoresist facing away from the base is not lower than a surface of the first metal film facing away from the base, and a dimension of an orthographic projection of the portion of the patterned photoresist in each through hole on the base is same as or approximately same as an aperture of a corresponding through hole; and 
 removing the second target layer and the first target layer to form the connection structure, further includes: 
 removing the second target layer, the first target layer and the patterned photoresist to form the connection structure. 
 
     
     
       16. The method of manufacturing the display backplane according to  claim 13 , wherein
 a material of the first target layer is an organic insulating material; 
 or, a material of the second target layer is one of an inorganic insulating material and a metal material; 
 or, a material of the first target layer is an organic insulating material, and a material of the second target layer is one of an inorganic insulating material and a metal material. 
 
     
     
       17. A display device, comprising:
 the display backplane according to  claim 1 ; and 
 a micro light-emitting diode electrically connected to every two connection structures in the display backplane correspondingly.