US11602090B2ActiveUtilityA1

Shielding structure and manufacturing method thereof

53
Assignee: WISTRON NEWEB CORPPriority: Jul 22, 2021Filed: Aug 11, 2021Granted: Mar 7, 2023
Est. expiryJul 22, 2041(~15 yrs left)· nominal 20-yr term from priority
H05K 9/003H05K 9/0049H05K 9/0088H05K 9/0024H05K 9/0032
53
PatentIndex Score
0
Cited by
7
References
19
Claims

Abstract

A shielding structure and a manufacturing method thereof are provided. The shielding structure includes a metal housing, a plastic member, and a conductive trace. The metal housing has an inner surface and an internal space. The plastic member is disposed on the inner surface and in the internal space and has an accommodating space. The conductive trace is disposed on the plastic member and in the accommodating space, wherein the plastic member is between the conductive trace and the metal housing.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A shielding structure comprising:
 a metal housing, comprising an inner surface and an internal space; 
 a plastic member, disposed on the inner surface and in the internal space of the metal housing and comprising an accommodating space; and 
 a conductive trace, disposed on the plastic member and in the accommodating space; 
 wherein the plastic member is between the metal housing and the conductive trace; and 
 wherein the metal housing further comprises a fixed structure disposed in the internal space, the fixed structure is perpendicular to the inner surface and comprises at least one bending portion, and the plastic member envelopes the fixed structure. 
 
     
     
       2. The shielding structure according to  claim 1 , wherein the metal housing comprises a top side, a side wall, and an opening, the top side and the side wall form the internal space, one end of the side wall connects to the top side, and another end of the side wall forms the opening. 
     
     
       3. The shielding structure according to  claim 2 , further comprising:
 a metal top opening, disposed on the top side; and 
 a plastic top opening, corresponding to the metal top opening and disposed on the plastic member; 
 wherein, when a draft angle at an opening side wall of the plastic member is less than 30 degrees, a diameter of the plastic top opening is equal to or greater than two times a top thickness of the plastic member. 
 
     
     
       4. The shielding structure according to  claim 3 , wherein the fixed structure is connected to the metal top opening or to the another end of the side wall that forms the opening. 
     
     
       5. The shielding structure according to  claim 3 , wherein the metal housing further comprises a skirt structure perpendicular to the side wall and extending outward from the another end of the side wall that forms the opening. 
     
     
       6. The shielding structure according to  claim 3 , wherein the conductive trace comprises:
 a first contact portion, disposed on the plastic member near the opening, for contacting an electronic component or a printed circuit board; 
 a second contact portion, disposed on the plastic member near the top side, for contacting another electronic component; and 
 a connect portion, disposed between the first contact portion and the second contact portion, for connecting the first contact portion and the second contact portion. 
 
     
     
       7. The shielding structure according to  claim 6 , wherein the conductive trace further comprises a conductive portion, disposed on an underside of the plastic member, for connecting to the printed circuit board. 
     
     
       8. The shielding structure according to  claim 6 , further comprising a metal portion disposed on an upper side of the plastic member, wherein the conductive trace further comprises an external portion disposed on the upper side of the plastic member for contacting an external component, and a gap between the metal portion and the external portion is equal to or greater than 2 mm. 
     
     
       9. The shielding structure according to  claim 1 , wherein the plastic member comprises a connecting surface and an exposed surface, the connecting surface is attached to the inner surface, and the conductive trace is disposed on the exposed surface. 
     
     
       10. A method of manufacturing a shielding structure, comprising:
 providing a sheet metal plate; 
 stamping the sheet metal plate to form the metal housing of  claim 1 ; 
 injection molding a plastic material into the metal housing to form the plastic member of  claim 1 , wherein the plastic member comprises a connecting surface and an exposed surface, and the connecting surface is attached to an inner surface of the metal housing; 
 laser patterning the exposed surface of the plastic member; and 
 chemical plating the exposed surface of the plastic member to from the conductive trace of  claim 1 . 
 
     
     
       11. The method of manufacturing the shielding structure according to  claim 10 , further comprising:
 laser patterning an upper side of the plastic member; and 
 chemical plating the upper side of the plastic member to form a metal portion and an external portion. 
 
     
     
       12. The method of manufacturing the shielding structure according to  claim 11 , wherein the sheet metal plate is made of stainless steel, copper, copper-nickel alloy, or brass, the plastic material is composed of a high flow polyamide or a high flow liquid crystal polymer and fiber glass, wherein the content of the fiber glass is 15% to 50% of a total composition of the plastic material, a thickness of the metal housing is 0.1 mm to 0.4 mm, and a thickness of the plastic member is 0.15 mm to 1 mm. 
     
     
       13. The method of manufacturing the shielding structure according to  claim 10 , wherein the sheet metal plate is made of stainless steel, copper, copper-nickel alloy, or brass, the plastic material is composed of a high flow polyamide or a high flow liquid crystal polymer and fiber glass, wherein the fiber glass is present at about 15% to 50% of a total composition of the plastic material, a thickness of the metal housing is 0.1 mm to 0.4 mm, and a thickness of the plastic member is 0.15 mm to 1 mm. 
     
     
       14. A shielding structure comprising:
 a metal housing, comprising an inner surface and an internal space; 
 a plastic member, disposed on the inner surface and in the internal space of the metal housing and comprising an accommodating space; 
 a conductive trace, disposed on the plastic member and in the accommodating space, wherein the plastic member is between the metal housing and the conductive trace, the metal housing comprises a top side, a side wall, and an opening, the top side and the side wall form the internal space, one end of the side wall connects to the top side, and another end of the side wall forms the opening; 
 a metal top opening, disposed on the top side; and 
 a plastic top opening, corresponding to the metal top opening and disposed on the plastic member; 
 wherein, when a draft angle at an opening side wall of the plastic member is less than 30 degrees, a diameter of the plastic top opening is equal to or greater than two times a top thickness of the plastic member. 
 
     
     
       15. The shielding structure according to  claim 14 , wherein the fixed structure is connected to the metal top opening or to the another end of the side wall that forms the opening. 
     
     
       16. The shielding structure according to  claim 14 , wherein the metal housing further comprises a skirt structure perpendicular to the side wall and extending outward from the another end of the side wall that forms the opening. 
     
     
       17. The shielding structure according to  claim 14 , wherein the conductive trace comprises:
 a first contact portion, disposed on the plastic member near the opening, for contacting an electronic component or a printed circuit board; 
 a second contact portion, disposed on the plastic member near the top side, for contacting another electronic component; and 
 a connect portion, disposed between the first contact portion and the second contact portion, for connecting the first contact portion and the second contact portion. 
 
     
     
       18. The shielding structure according to  claim 17 , wherein the conductive trace further comprises a conductive portion, disposed on an underside of the plastic member, for connecting to the printed circuit board. 
     
     
       19. The shielding structure according to  claim 17 , further comprising a metal portion disposed on an upper side of the plastic member, wherein the conductive trace further comprises an external portion disposed on the upper side of the plastic member for contacting an external component, and a gap between the metal portion and the external portion is equal to or greater than 2 mm.

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