Electronic apparatus and electrical element

Abstract

An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.

What is claimed is: 
     
       1. An electronic apparatus comprising:
 a substrate including a main surface; 
 an electronic component mounted on the main surface of the substrate; and 
 an electrical element surface-mounted on the main surface of the substrate; wherein 
 the electrical element includes:
 a base material including a plurality of laminated electrical insulating materials; 
 a transmission line portion included at the base material; and 
 a first connection portion and a second connection portion included at the base material, and each of the first connection portion and the second connection portion being continuous with a corresponding one of a plurality of portions of the transmission line portion; 
 
 the base material includes a recessed portion in which a cavity is provided in at least one of the plurality of laminated electrical insulating materials such that a number of the plurality of laminated electrical insulating materials at other portions of the base material outside of the recessed portion is greater than a number of the plurality of laminated electrical insulating materials at the recessed portion; 
 each of the first connection portion and the second connection portion is provided at a corresponding one of the other portions; 
 each of the first connection portion and the second connection portion is connected to a circuit included at the substrate by an electrically conductive bonding material; 
 the electrical element is surface-mounted on the substrate such that the recessed portion faces the electronic component; and 
 in a direction perpendicular to the main surface of the substrate, a dimension of each of the other portions is greater than a dimension of the electronic component facing the recessed portion. 
 
     
     
       2. The electronic apparatus according to  claim 1 , wherein
 the base material is deformable and includes a first principal surface and a second principal surface that are flat or substantially flat surfaces; 
 the electrical element further includes an electrical-element-side bonding pattern located in a position different from positions of the first connection portion and the second connection portion and connected to a conductor included at the substrate; 
 the first connection portion, the second connection portion and the electrical-element-side bonding pattern are exposed on the first principal surface of the base material; 
 the substrate includes:
 a third connection portion; 
 a fourth connection portion; and 
 a substrate-side bonding pattern; 
 
 the first connection portion and the third connection portion are connected to each other through the electrically conductive bonding material; 
 the second connection portion and the fourth connection portion are connected to each other through the electrically conductive bonding material; and 
 the electrical-element-side bonding pattern and the substrate-side bonding pattern are connected to each other through the electrically conductive bonding material. 
 
     
     
       3. The electronic apparatus according to  claim 2 , wherein
 the base material further includes a bending portion bent in a surface direction of the base material in a plan view; and 
 the electrical-element-side bonding pattern includes a portion that is bent in the surface direction of the base material along the bending portion in the plan view. 
 
     
     
       4. The electronic apparatus according to  claim 2 , wherein the electrical-element-side bonding pattern is at least provided in a vicinity to the first connection portion of the transmission line portion or in a vicinity to the second connection portion of the transmission line portion. 
     
     
       5. The electronic apparatus according to  claim 4 , wherein the electrical-element-side bonding pattern is at least provided in a range from a boundary between the first connection portion and the transmission line portion to one-third of a length in an extending direction of the transmission line portion or in a range from a boundary between the second connection portion and the transmission line portion to one-third of the length in the extending direction of the transmission line portion. 
     
     
       6. The electronic apparatus according to  claim 2 , wherein the transmission line portion includes a plurality of signal conductor patterns. 
     
     
       7. The electronic apparatus according to  claim 6 , wherein the transmission line portion includes a strip line structure or a microstrip line structure provided by a ground conductor pattern and the plurality of signal conductor patterns. 
     
     
       8. The electronic apparatus according to  claim 7 , wherein the electrical-element-side bonding pattern is a conductor pattern electrically connected to the ground conductor pattern or a portion of the ground conductor pattern. 
     
     
       9. The electronic apparatus according to  claim 2 , wherein the electrical element further includes a double-sided adhesive tape, the double-sided adhesive tape is provided in a portion in which the electrical-element-side bonding pattern is absent. 
     
     
       10. The electronic apparatus according to  claim 1 , wherein the base material of the transmission line portion has a smaller width than the base material of the first connection portion and the second connection portion.