Printing pad, method of manufacturing window using the same, and method of manufacturing electronic device using the printing pad

Abstract

A method of manufacturing a window includes: providing an ink pattern to a printing pad; providing the printing pad and the ink pattern to a target substrate; and removing the printing pad from the target substrate, the ink pattern including: a first bezel line surrounding at least one hole; and a second bezel line surrounding the first bezel line, the printing pad including: a top surface; a bottom surface; and a side surface connecting the top surface and the bottom surface, the side surface including a first pattern portion, in which the first bezel line is formed, and a second pattern portion, in which the second bezel line is formed. The first pattern portion has an inclination angle equal to or greater than about 46 degrees and equal to or smaller than about 90 degrees based on the bottom surface of the printing pad.

What is claimed is: 
     
       1. A method of manufacturing a window, the method comprising the steps of:
 providing an ink pattern to a printing pad; 
 providing the printing pad and the ink pattern to a target substrate such that the ink pattern is transferred to the target substrate; and 
 removing the printing pad from the target substrate, the ink pattern comprising: 
 a first bezel line surrounding at least one hole; and 
 a second bezel line surrounding the first bezel line, the printing pad comprising: 
 a top surface; 
 a bottom surface; and 
 a side surface connecting the top surface and the bottom surface, the side surface comprising a first pattern portion, in which the first bezel line is formed, and a second pattern portion, in which the second bezel line is formed, 
 wherein the first pattern portion of the printing pad has an inclination angle equal to or greater than about 46 degrees and equal to or smaller than about 90 degrees based on the bottom surface of the printing pad. 
 
     
     
       2. The method of  claim 1 , wherein the step of providing of the printing pad and the ink pattern comprises the step of pressing the printing pad to the target substrate. 
     
     
       3. The method of  claim 1 , wherein the step of providing of the printing pad and the ink pattern comprises the step of moving the printing pad and the ink pattern to be in contact with the target substrate. 
     
     
       4. The method of  claim 1 , wherein the ink pattern comprises a light blocking material. 
     
     
       5. The method of  claim 1 , wherein the target substrate comprises a first bezel area, a transmission area, and a second bezel area surrounding the transmission area defined in the target substrate after the step of removing of the printing pad, wherein:
 each of the first and second bezel areas is a light blocking area, and 
 the transmission area is a light transmission area. 
 
     
     
       6. The method of  claim 1 , wherein the printing pad comprises at least one of silicone and rubber. 
     
     
       7. The method of  claim 1 , wherein the target substrate comprises a glass material. 
     
     
       8. The method of  claim 1 , wherein the target substrate has a thickness equal to or greater than about 20 μm and equal to or smaller than about 80 μm. 
     
     
       9. The method of  claim 1 , wherein the target substrate comprises a synthetic resin. 
     
     
       10. The method of  claim 1 , wherein the target substrate is flexible. 
     
     
       11. A method of manufacturing an electronic device, the method comprising the steps of:
 providing an ink pattern to a printing pad; 
 providing the printing pad and the ink pattern to a target substrate such that the ink pattern is transferred to the target substrate; 
 removing the printing pad from the target substrate; and 
 placing a display panel comprising a pixel under the target substrate, the ink pattern comprising: 
 a first bezel line surrounding at least one hole; and 
 a second bezel line surrounding the first bezel line, the printing pad comprising: 
 a top surface; 
 a bottom surface; and 
 a side surface connecting the top surface and the bottom surface, the side surface comprising a first pattern portion, in which the first bezel line is formed, and a second pattern portion, in which the second bezel line is formed, 
 wherein the first pattern portion of the printing pad has an inclination angle equal to or greater than about 46 degrees and equal to or smaller than about 90 degrees based on the bottom surface of the printing pad. 
 
     
     
       12. The method of  claim 11 , wherein the ink pattern comprises a light blocking material. 
     
     
       13. The method of  claim 11 , wherein:
 the display panel further comprises a plurality of signal lines, and 
 the plurality of signal lines do not overlap the hole. 
 
     
     
       14. The method of  claim 11 , wherein the pixel does not overlap the hole. 
     
     
       15. The method of  claim 11 , further comprising the step of placing at least one electronic optical module under the display panel after the step of placing of the display panel, wherein the electronic optical module overlaps the hole. 
     
     
       16. The method of  claim 15 , wherein the electronic optical module is a camera module.