Method and apparatus for mitigating adverse effects of bonding wire of external optical modulators

Abstract

An optical transceiver including a submount, a Mach-Zehnder Modulator (MZM), bonding wires, and a low pass filter type matching network is provided. The MZM includes an input port and an output port and disposed on the submount. The bonding wires are coupled to the submount and the MZM. The low pass filter type matching network is coupled to the bonding wires and is configured to absorb inductance of the bonding wires at a high frequency.

What is claimed as: 
     
       1. A method of absorbing inductance comprising:
 using a low pass filter (LPF) type matching network configured to absorb inductance of bonding wires at a high frequency between an external optical modulator and a submount in a packaging of the external optical modulator. 
 
     
     
       2. The method of  claim 1 , wherein the LPF type matching network comprises a first matching network coupled to an input of the external optical modulator and a second matching network coupled to an output of the external optical modulator. 
     
     
       3. The method of  claim 1 , wherein the external optical modulator comprises a Mach Zehnder Modulator (MZM). 
     
     
       4. The method of  claim 1 , wherein the high frequency comprises a frequency greater than 10 GHz. 
     
     
       5. The method of  claim 1 , wherein the LPF type matching network comprises a 3 rd  order Butterworth filter. 
     
     
       6. The method of  claim 1 , wherein the high frequency comprises a frequency comprises a frequency greater than 10 GHz. 
     
     
       7. The method of  claim 1 , wherein the LPF type matching network comprises a first matching network coupled to the output port of the MZM and wherein the first matching network includes a resistor, an inductor, and a capacitor and is configured to absorb inductance of the bonding wires. 
     
     
       8. The method of  claim 7 , wherein the LPF type matching network comprises a second matching network coupled to the input port of the MZM and the second matching network includes an inductor, and a capacitor and is configured to absorb inductance of the bonding wires. 
     
     
       9. The method of  claim 1 , wherein the LPF type matching network comprises a first matching network coupled to the output port of the MZM and a second matching network coupled to the input port of the MZM, and wherein the first matching network and the second matching network respectively comprises an inductor and a capacitor and is configured to absorb inductance of the bonding wires.