Evaluating an inspection algorithm for inspecting a semiconductor specimen

Abstract

A method, a non-transitory computer readable medium, and a system for evaluating an inspection algorithm for inspecting a semiconductor specimen.

I claim: 
     
       1. A method for evaluating a new inspection algorithm for detecting defects on semiconductor wafers by an inspection system, the method comprising:
 receiving, by an evaluation unit of the inspection system, the new inspection algorithm; the new inspection algorithm developed by an inspection algorithm developer; 
 storing, by a memory of the evaluation unit, images from multiple semiconductor wafers inspected by the inspection system using a current inspection algorithm different from the new inspection algorithm; 
 evaluating, by a processor of the evaluation unit and within a sandbox testing environment of the inspection system that is isolated from a production environment of the inspection system, the new inspection algorithm to provide evaluation results; wherein the evaluating comprises applying the new inspection algorithm on the images from the multiple semiconductor wafers, and the evaluation results comprise detection of suspected defects within the images; and 
 sending, from the evaluation unit to the inspection algorithm developer, at least an indication regarding the evaluation results, wherein the indication regarding the evaluation results includes a performance of the new inspection algorithm compared to the current inspection algorithm; 
 wherein the storing, the evaluating, and the sending are executed without exposing, to the inspection algorithm developer, the images from the multiple semiconductor wafers. 
 
     
     
       2. The method according to  claim 1  wherein the images are conveyed to the evaluation unit over one or more local communication paths. 
     
     
       3. The method according to  claim 1 , further comprising receiving, by the evaluation unit, review results of a review process that was applied on at least some of the multiple semiconductor wafers; and wherein the evaluating of the inspection algorithm is based, at least in part, on the review results. 
     
     
       4. The method according to  claim 1  wherein the storing, the evaluating, and the sending are executed without interrupting an inspection process executed in the production environment of the inspection system. 
     
     
       5. A non-transitory computer readable medium for evaluating a new inspection algorithm for detecting defects on semiconductor wafers by an inspection system, the non-transitory computer readable medium stores instructions comprising:
 receiving, by an evaluation unit of the inspection system, the new inspection algorithm; the new inspection algorithm developed by an inspection algorithm developer; 
 storing, by a memory of the evaluation unit, images from multiple semiconductor wafers inspected by the inspection system using a current inspection algorithm different from the new inspection algorithm; 
 evaluating, by a processor of the evaluation unit and within a sandbox testing environment of the inspection system that is isolated from a production environment of the inspection system, the new inspection algorithm to provide evaluation results; wherein the evaluating comprises applying the inspection algorithm on the images from multiple semiconductor wafers, and the evaluation results comprise detection of suspected defects within the images; and 
 sending, from the evaluation unit to the inspection algorithm developer, at least an indication regarding the evaluation results, wherein the indication regarding the evaluation results includes a performance of the new inspection algorithm compared to the current inspection algorithm; 
 wherein the storing, the evaluating, and the sending are executed without exposing, to the inspection algorithm developer, the images from the multiple semiconductor wafers. 
 
     
     
       6. An inspection system for evaluating a new inspection algorithm for detecting defects on semiconductor wafers, the inspection system comprising an evaluation unit, wherein the evaluation unit comprises a memory unit and a processor that are configured to perform steps comprising:
 receive the new inspection algorithm; the new inspection algorithm developed by an inspection algorithm developer; 
 store by the memory unit images from multiple semiconductor wafers inspected by the inspection system using a current inspection algorithm different from the new inspection algorithm; 
 evaluate by the processor of the evaluation unit and within a sandbox testing environment of the inspection system that is isolated from a production environment of the inspection system, the new inspection algorithm to provide evaluation results wherein the evaluating comprises applying the new inspection algorithm on the images from the multiple semiconductor wafers, and the evaluation results comprise detection of suspected defects within the images; and 
 generate an indication regarding the evaluation results to be sent to the inspection algorithm developer without exposing, to the inspection algorithm developer, the images from the multiple semiconductor wafers, wherein the indication regarding the evaluation results includes a performance of the new inspection algorithm compared to the current inspection algorithm.