LED package and method for manufacturing same

Abstract

Provided is an LED package and a method for manufacturing the same wherein, if its sealing resin containing phosphor particles each having a coating layer is cut or ground, age deterioration of the phosphor particles in the cut or ground surface is prevented. The method includes: mounting LED elements on a substrate; filling a first resin on the substrate to seal the LED elements, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED elements; cutting or grinding the first resin; and forming a protective layer with a second resin on a cut surface of the first resin exposed as a result of the cutting or on a ground surface of the first resin, the second resin not containing the wavelength conversion particles.

The invention claimed is: 
     
       1. A method for manufacturing an LED package, comprising the steps of:
 mounting LED elements on a substrate; 
 filling a first resin on the substrate to seal the LED elements, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED elements; 
 cutting the substrate and the first resin, and dividing the LED elements; and 
 forming a dampproof coating with a second resin on a cut surface of the first resin exposed as a result of the cutting, the second resin not containing the wavelength conversion particles. 
 
     
     
       2. The method according to  claim 1 , wherein the dampproof coating is formed on only the cut surface by spraying or vapor deposition in the forming step. 
     
     
       3. The method according to  claim 1 , wherein the second resin have a water absorption of 1% or less. 
     
     
       4. The method according to  claim 1 , wherein
 the cut surface is a side surface of the first resin, and 
 the second resin is applied to the side surface of the first resin in the forming step. 
 
     
     
       5. The method according to  claim 1 , further comprising
 grinding an upper surface of the first resin, and 
 forming a protective layer on the upper surface of the first resin in the forming the dampproof coating. 
 
     
     
       6. The method according to  claim 1 , wherein
 the LED elements are blue LED elements emitting blue light, and 
 the phosphor particles are particles of KSF phosphor absorbing part of the blue light to emit red light. 
 
     
     
       7. The method according to  claim 1 , wherein the second resin is a transparent or translucent resin.