Dual band transponder and textile label with dual band transponder

Abstract

A dual band transponder comprises a carrier substrate having at least one planar substrate layer. An ultra-high frequency loop antenna is mounted on a first surface of one of the planar substrate layers of the carrier substrate. A high frequency loop antenna is mounted on two opposite surfaces of one of the planar substrate layers of the carrier substrate. The ultra-high frequency loop antenna encloses the high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely. A textile label includes a textile label substrate and a corresponding dual band transponder mounted onto the textile label substrate.

The invention claimed is: 
     
       1. A dual band transponder, comprising:
 a carrier substrate having at least one planar substrate layer; 
 an ultra-high frequency loop antenna mounted on a top surface or a bottom surface opposite the top surface of the at least one planar substrate layers of the carrier substrate; 
 a single high frequency loop antenna having a first part mounted on the top surface and having a second part mounted on the bottom surface opposite the top surface of the at least one planar substrate layers of the carrier substrate, the ultra-high frequency loop antenna enclosing the single high frequency loop antenna in a plane parallel to the at least one planar substrate layer. 
 
     
     
       2. The dual band transponder of  claim 1 , wherein the carrier substrate includes at least two planar substrate layers, and wherein the ultra-high frequency loop antenna is mounted on a top surface or a bottom surface of a first one of the at least two planar substrate layers of the carrier substrate and the single high frequency loop antenna is mounted on a top surface and a bottom surface opposite the top surface of a second one of the at least two planar substrate layers of the carrier substrate. 
     
     
       3. The dual band transponder of  claim 2 , further comprising:
 first interlayer connection elements leading through the second one of the at least two planar substrate layers of the carrier substrate and electrically conductively connecting the second part of the single high frequency loop antenna on the bottom surface of the second one of the at least two planar substrate layers of the carrier substrate to the first part of the single high frequency loop antenna on the top surface of the second one of the at least two planar substrate layers of the carrier substrate. 
 
     
     
       4. The dual band transponder of  claim 2 , further comprising:
 second interlayer connection elements leading through the first one of the at least two planar substrate layers of the carrier substrate. 
 
     
     
       5. The dual band transponder of  claim 2 , further comprising:
 a dual band transponder chip coupled to the ultra-high frequency loop antenna and the single high frequency loop antenna. 
 
     
     
       6. The dual band transponder of  claim 2 , further comprising:
 an ultra-high frequency transponder chip coupled to the ultra-high frequency loop antenna; and 
 a high frequency transponder chip coupled to the single high frequency loop antenna. 
 
     
     
       7. The dual band transponder of  claim 5 , wherein the dual band transponder further comprises second interlayer connection elements leading through the first one of the at least two planar substrate layers of the carrier substrate, the dual band transponder chip being coupled to the ultra-high frequency loop antenna by means of the second interlayer connection elements. 
     
     
       8. The dual band transponder of  claim 7 , wherein the second interlayer connection elements are further leading through the second one of the at least two planar substrate layers of the carrier substrate. 
     
     
       9. The dual band transponder of  claim 5 , further comprising: an adhesive layer applied between the first one of the at least two planar substrate layers of the carrier substrate and the second one of the at least two planar substrate layers of the carrier substrate, the dual band transponder chip or alternatively the ultra-high frequency transponder chip and the high frequency transponder chip being arranged in the adhesive layer. 
     
     
       10. The dual band transponder of  claim 1 , wherein the carrier substrate comprises exactly one planar substrate layer and wherein the ultra-high frequency loop antenna is mounted on the top surface or the bottom surface of the exactly one planar substrate layer and the single high frequency loop antenna is mounted on the top surface and the bottom surface of the exactly one planar substrate layer. 
     
     
       11. The dual band transponder of  claim 10 , wherein interlayer connection elements are leading through the exactly one planar substrate layer coupling the ultra-high frequency loop antenna and the single high frequency loop antenna to a dual band transponder chip. 
     
     
       12. The dual band transponder of  claim 10 , wherein interlayer connection elements are leading through the exactly one planar substrate layer, the ultra-high frequency loop antenna being coupled to a ultra-high frequency transponder chip, and the single high frequency loop antenna being coupled to a high frequency transponder chip. 
     
     
       13. The dual band transponder of  claim 1 , wherein the ultra-high frequency loop antenna and the single high frequency loop antenna are attuned to each other so that the operability of the ultra-high frequency loop antenna would be diminished if not for the presence of the single high frequency loop antenna. 
     
     
       14. The dual band transponder of  claim 13 , wherein the ultra-high frequency loop antenna alone is tuned to a center frequency of about 800 MHz and the single high frequency loop antenna is arranged in such a way that the ultra-high frequency loop antenna is detuned to a center frequency of about 900 MHz. 
     
     
       15. The dual band transponder of  claim 1 , wherein the surface area of the area of the dual band transponder in the plane of the planar substrate layers of the carrier substrate is less than 170 mm 2 . 
     
     
       16. A textile label, comprising:
 a textile label substrate; and 
 a dual band transponder mounted to the textile label substrate, the dual band transponder comprising: 
 a carrier substrate having at least one planar substrate layer; 
 an ultra-high frequency loop antenna mounted on a top surface or a bottom surface of the at least one planar substrate layers of the carrier substrate; 
 a single high frequency loop antenna having a first part mounted on a top surface and having a second part mounted on a bottom surface opposite the top surface of the at least one planar substrate layers of the carrier substrate, the ultrahigh frequency loop antenna enclosing the single high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely. 
 
     
     
       17. The textile label of  claim 16 , further comprising:
 a dipole antenna knitted or woven into the textile label substrate. 
 
     
     
       18. The textile label of  claim 17 , wherein the ultra-high frequency loop antenna couples inductively to the dipole antenna. 
     
     
       19. The textile label of  claim 16 , wherein the dual band transponder is coated with a textile transfer adhesive and adhered to the textile label substrate via the textile transfer adhesive in a wash-proof manner. 
     
     
       20. The textile label of  claim 16 , wherein the carrier substrate of the dual band transponder comprises at least one of the materials from the group of polyethylene terephthalate, polyimide, FR4 and polyether ether ketone. 
     
     
       21. The textile label of  claim 16 , wherein the distance between the ultra-high frequency loop antenna and the single high frequency loop antenna is at least 0.8 mm. 
     
     
       22. A method for manufacturing a textile label, the method comprising:
 mounting an ultra-high frequency loop antenna on a top surface or a bottom surface of a carrier substrate having at least one planar substrate layer; 
 mounting a first part of a single high frequency loop antenna on a top surface of the carrier substrate and mounting a second part of the high frequency loop antenna on a bottom surface opposite to the top surface of the carrier substrate so that the ultra-high frequency loop antenna encloses the single high frequency loop antenna in a plane parallel to the at least one planar substrate layer entirely; 
 coupling an ultra-high frequency transponder chip to the ultra-high frequency loop antenna; 
 coupling a high frequency transponder chip to the single high frequency loop antenna; 
 knitting or weaving a dipole antenna in a textile label substrate; and 
 mounting the carrier substrate with the ultra-high frequency loop antenna, the single high frequency loop antenna, the ultra-high frequency transponder chip and the high frequency transponder chip onto the textile label substrate. 
 
     
     
       23. The method of  claim 22 , further comprising:
 programming of an identification code for the ultra-high frequency transponder chip in a memory of the high frequency transponder chip; and 
 programming of an identification code for the high frequency transponder chip in a memory of the ultra-high frequency transponder chip. 
 
     
     
       24. The dual band transponder of  claim 6 , wherein the dual band transponder further comprises second interlayer connection elements leading through the first one of the at least two planar substrate layers of the carrier substrate, the ultra-high frequency transponder chip being coupled to the ultra-high frequency loop antenna by means of the second interlayer connection elements. 
     
     
       25. The dual band transponder of  claim 24 , wherein the second interlayer connection elements are further leading through the second one of the at least two planar substrate layers of the carrier substrate.