US11667813B2ActiveUtilityA1
Structural adhesives
Est. expiryApr 9, 2028(~1.7 yrs left)· nominal 20-yr term from priority
Inventors:Michael Czaplicki
C09J 2400/163C08L 2666/22C09J 5/06C09J 11/08C08G 59/186C09J 163/00C08L 2207/53C08L 2666/02C08G 2650/56C08L 71/00C09J 171/00C08K 2201/011C08L 2205/035C09J 11/04C08L 2205/025
95
PatentIndex Score
1
Cited by
452
References
20
Claims
Abstract
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
Claims
exact text as granted — not AI-modifiedThe invention claimed is:
1. An adhesive formulation comprising:
i) an adduct of an epoxy resin and an elastomer, wherein the adhesive formulation contains from about 7% to about 20% by weight of the adduct based on the adhesive formulation;
ii) a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product;
iii) a core/shell polymer, wherein the adhesive formulation contains from 5% to 30% by weight of the core/shell polymer; and
iv) one or more additional epoxy resins; and
wherein the adhesive formulation includes between about 55% by weight and about 70% by weight total epoxy resin, wherein the total epoxy resin is the liquid epoxy resin of the phenoxy epoxy hybrid resin and the one or more additional epoxy resins; and
wherein the adhesive formulation contains between 3% and 10% by weight of the phenoxy resin.
2. The adhesive formulation according to claim 1 , wherein the adhesive formulation contains from about 7% to about 15% by weight of the adduct based on the adhesive formulation.
3. The adhesive formulation according to claim 1 , wherein the adduct includes about 1:5 to about 5:1 parts of epoxy to elastomer.
4. The adhesive formulation according to claim 1 , wherein the elastomer in the adduct is selected from natural rubber, styrene-butadiene rubber, polyisoprene, polyisobutylene, polybutadiene, isoprene-butadiene copolymer, neoprene, nitrile rubber, butyl rubber, polysulfide elastomer, acrylic elastomer, acrylonitrile elastomers, silicone rubber, polysiloxanes, polyester rubber, diisocyanate-linked condensation elastomer, EPDM (ethylene-propylene diene rubbers), chlorosulphonated polyethylene, fluorinated hydrocarbons, and any combination thereof.
5. The adhesive formulation according to claim 1 , wherein the adduct of the epoxy resin and the elastomer is derived from a butadiene acrylonitrile rubber.
6. The adhesive formulation according claim 1 , wherein the phenoxy resin is of the formula
where n is from 30 to 100.
7. The adhesive formulation according to claim 1 , wherein the core/shell polymer has a ductile core and a rigid shell which is compatible with the other components of the adhesive formulation.
8. The adhesive formulation according to claim 1 , wherein the core/shell polymer includes a first polymeric material and a second polymeric material, wherein the first polymeric material and the second polymeric material include elastomers, polymers, thermoplastics, copolymers, and combinations thereof.
9. The adhesive formulation according to claim 8 , wherein the first polymeric material and second polymeric material are selected from styrenics, acrylonitriles, acrylates, acetates, polyamides, polyethylenes, and any combination thereof.
10. The adhesive formulation according to claim 1 , wherein the core/shell polymer is a graft copolymer in which styrene, acrylonitrile, or methyl methacrylate, are grafted onto a core made from polymers of soft or elastomeric compounds.
11. The adhesive formulation according to claim 10 , wherein the core includes other copolymerizable containing compounds, selected from styrene, vinyl acetate, methyl methacrylate, butadiene, and isoprene.
12. The adhesive formulation according to claim 10 , wherein the core includes a cross linking monomer having two or more nonconjugated double bonds.
13. The adhesive formulation according to claim 10 , wherein a shell portion of the core/shell polymer is polymerized from alkyl acrylates and/or methacrylates.
14. The adhesive formulation according to claim 1 , comprising from about 0.001% to about 10% by weight of a curing agent.
15. The adhesive formulation according to claim 14 , wherein the curing agent is selected from aliphatic or aromatic amines or their respective adducts, amidoamines, polyamides, cycloaliphatic amines, anhydrides, polycarboxylic polyesters, isocyanates, phenol-based resins, and mixtures thereof.
16. The adhesive formulation according to claim 14 , wherein the adhesive formulation comprises an accelerator for the curing agent.
17. The adhesive formulation according to claim 1 , wherein the adhesive formulation contains between 7% and 15% by weight of the liquid epoxy resin of the phenoxy epoxy hybrid resin.
18. The adhesive formulation according to claim 1 , wherein the adhesive formulation comprises a blowing agent.
19. The adhesive formulation according to claim 1 , wherein the adhesive formulation comprises a filler.
20. The adhesive formulation according to claim 1 , wherein the adhesive formulation comprises one or more liquid polysulfides.Cited by (0)
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