Resin composition, cured product, laminate, and electronic member

Abstract

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

What is claimed is: 
     
       1. A resin composition containing an epoxy compound A having a structure of the general formula (1) below and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a curing agent: 
       
         
           
           
               
               
           
         
         wherein, in the formula (1), each Ar independently represents a structure having an aromatic ring being unsubstituted or having a substituent, 
         each of R 1  and R 2  independently represents a hydrogen atom or an alkyl group having 1 or 2 carbon atoms, 
         each of R 3  to R 8  independently represents a hydroxyl group, a glycidyl ether group and/or a 2-methylglycidyl ether group, wherein at least one of R 3  to R 8  is a glycidyl ether group or a 2-methylglycidyl ether group, 
         each of R 9  to R 12  independently represents a hydrogen atom or a methyl group, 
         n is an integer of 11 to 16, and 
         m, p 1 , p 2 , and q are an average of the number of repeating units, and m is 0.5 to 25, 
         each of p 1  and p 2  is independently 0 to 5, and 
         q represents 0.5 to 5,
 wherein the individual repeating units present in the repeating units of the structure are the same or different. 
 
       
     
     
       2. The resin composition according to  claim 1 , wherein the weight ratio of the epoxy compound A and the epoxy compound B is 97:3 to 3:97. 
     
     
       3. The resin composition according to  claim 1 , wherein, in the formula (1), R 3  and R 4  are a glycidyl ether group. 
     
     
       4. The resin composition according to  claim 1 , wherein, in the formula (1), each Ar is independently any one of the structures represented by the following formula (2): 
       
         
           
           
               
               
           
         
         
           
           
               
               
           
         
         wherein, in the formula (2), the aromatic ring is substituted or unsubstituted, and * represents a bonding site. 
       
     
     
       5. The resin composition according to  claim 1 , wherein, in the formula (1), Ar is substituted by a glycidyl ether group and/or a 2-methylglycidyl ether group. 
     
     
       6. The resin composition according to  claim 1 , which is a bonding agent. 
     
     
       7. A cured product which is obtained by curing the resin composition according to  claim 1 . 
     
     
       8. The cured product according to  claim 7 , wherein the cured product containing resin particles having an average particle diameter of 10 nm to 100 μm, and a matrix resin,
 wherein the resin particles are a cured product of the epoxy compound A having the structure of the general formula (1) above and having the epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of the epoxy compound B having the epoxy equivalent in the range of from 100 to 300 g/eq. 
 
     
     
       9. The cured product according to  claim 7 , wherein the cured product containing resin particles having an average particle diameter of 10 nm to 100 μm, and a matrix resin,
 wherein the resin particles are a cured product of the epoxy compound B having the epoxy equivalent in the range of from 100 to 300 g/eq, and the matrix resin is a cured product of the epoxy compound A having the structure of the general formula (1) above and having the epoxy equivalent in the range of from 500 to 10,000 g/eq. 
 
     
     
       10. A laminate obtained by laminating a substrate, the cured product according to  claim 7 , and a second substrate in this order, wherein the substrate is a metal or a metal oxide, and the second substrate is a plastic layer. 
     
     
       11. A laminate having a substrate and the cured product according to  claim 7 . 
     
     
       12. The laminate according to  claim 11 , wherein the substrate is a metal or a metal oxide. 
     
     
       13. An electronic member comprising the laminate according to  claim 11 . 
     
     
       14. A cured product which is obtained by curing a resin composition, wherein the resin composition contains an epoxy compound A having a structure of the general formula (1) below and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a curing accelerator: 
       
         
           
           
               
               
           
         
         wherein, in the formula (1), each Ar independently represents a structure having an aromatic ring being unsubstituted or having a substituent, 
         each of R 1  and R 2  independently represents a hydrogen atom or an alkyl group having 1 or 2 carbon atoms, 
         each of R 3  to R 8  independently represents a hydroxyl group, a glycidyl ether group and/or a 2-methylglycidyl ether group, wherein at least one of R 3  to R 8  is a glycidyl ether group or a 2-methylglycidyl ether group, 
         each of R 9  to R 12  independently represents a hydrogen atom or a methyl group, 
         n is an integer of 11 to 16, and 
         m, p 1 , p 2 , and q are an average of the number of repeating units, and m is 0.5 to 25, 
         each of p 1  and p 2  is independently 0 to 5, and 
         q represents 0.5 to 5,
 wherein the individual repeating units present in the repeating units of the structure are the same or different.