Conductive particle and testing socket comprising the same

Abstract

An embodiment of the present invention provides a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle comprises a plurality of protrusions formed at equal intervals along a circumference.

What is claimed is: 
     
       1. A conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, the conductive particle comprising:
 a center; and 
 first to fourth protrusions each having a square shape protruding in a radial direction from a side surface of the center, 
 wherein the conductive particle has a predetermined thickness t and a predetermined diameter d, and 
 wherein the first to the fourth protrusions are arranged at equal intervals along a circumferential direction of a circumference having the predetermined diameter d with respect to the center. 
 
     
     
       2. The conductive particle of  claim 1 , wherein an end of one or more of the first to the fourth protrusions is formed to be curved. 
     
     
       3. The conductive particle of  claim 1 , wherein the predetermined thickness t is 90% or less of the predetermined diameter d. 
     
     
       4. The conductive particle of  claim 3 , wherein the predetermined thickness t is greater than or equal to 10% and less than or equal to 90% of the predetermined diameter d. 
     
     
       5. The conductive particle of  claim 4 , wherein the predetermined thickness t is greater than or equal to 30% and less than or equal to 70% of the predetermined diameter d. 
     
     
       6. The conductive particle of  claim 4 , wherein the predetermined thickness t is greater than or equal to 10 μm and less than or equal to 50 μm. 
     
     
       7. A testing socket comprising the conductive particle of  claim 1 , comprising:
 a conductive portion electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board; and 
 an insulating portion enclosing the surrounding of the conductive portion to support the conductive portion to be separated from each other, 
 wherein the conductive particle is arranged in the conductive portion to be in contact with each other, and 
 wherein the conductive portion comprises an intermediate layer in which the conductive particle is arranged in the thickness direction of the conductive portion. 
 
     
     
       8. The testing socket of  claim 7 , wherein the intermediate layer is arranged in the thickness direction of the conductive portion such that the center of the conductive particles is in agreement. 
     
     
       9. The testing socket of  claim 7 , wherein the intermediate layer is arranged in the thickness direction of the conductive portion such that the center of the conductive particles is in disagreement. 
     
     
       10. A testing socket comprising the conductive particle of  claim 1 , comprising:
 a conductive portion electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board; and 
 an insulating portion enclosing the surrounding of the conductive portion to support the conductive portion to be separated from each other, 
 wherein the conductive particle is arranged in the conductive portion to be in contact with each other, and 
 wherein in a top layer of the conductive portion, the conductive particles in the horizontal direction are coupled to each other, or the conductive particles in the horizontal direction are coupled to the conductive particles in the vertical direction. 
 
     
     
       11. The testing socket of  claim 10 , wherein the conductive portion comprises an intermediate layer which has the conductive particle and is arranged in the thickness direction of the conductive portion. 
     
     
       12. The testing socket of  claim 10 , wherein the conductive particle is arranged within the conductive portion by a magnetic field. 
     
     
       13. A conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, the conductive particle comprising:
 a center; and 
 first to third protrusions each having a square shape protruding in a radial direction from a side surface of the center, 
 wherein the conductive particle has a predetermined thickness t and a predetermined diameter d, and 
 wherein the first to the third protrusions are arranged at equal intervals along a circumferential direction of a circumference having the predetermined diameter d with respect to the center. 
 
     
     
       14. The conductive particle of  claim 13 , wherein an edge of one or more of the first to the third protrusions is formed to be curved.