Dual conductor laminated substrate

Abstract

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

What is claimed is: 
     
       1. A method for manufacturing a dual conductor laminated substrate, comprising:
 providing a first laminate including a first insulating layer and a first conductive layer; 
 defining a first trace pattern including one or more traces in the first laminate; 
 providing a second laminate including a second insulating layer and a second conductive layer; 
 defining a second trace pattern including one or more traces in the second laminate; 
 defining one or more access holes in the second insulating layer, the one or more access holes being in level with surfaces of the second insulating layer; 
 at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and 
 aligning and attaching the first laminate to the second laminate to create a laminated substrate. 
 
     
     
       2. The method of  claim 1 , further comprising:
 aligning and attaching a third insulating layer to the second conductive layer; 
 defining access holes in the first insulating layer; and 
 defining access holes in the third insulating layer. 
 
     
     
       3. The method of  claim 1 , further comprising at least one of:
 heating the laminated substrate to cause the conductive material to flow; and 
 curing the conductive material. 
 
     
     
       4. A method for manufacturing a dual conductor laminated substrate, comprising:
 providing a first laminate including a first insulating layer and a first conductive layer; 
 defining a first trace pattern including one or more traces in the first laminate; 
 providing a second laminate including a second insulating layer and a second conductive laver; 
 defining a second trace pattern including one or more traces in the second laminate; 
 defining access holes in the second insulating layer; 
 at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and 
 aligning and attaching the first laminate to the second laminate to create a laminated substrate; 
 wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer; and 
 wherein the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer. 
 
     
     
       5. The method of  claim 1 , wherein at least one of:
 the first trace pattern is dry milled in the first conductive layer; and 
 the second trace pattern is dry milled in the second conductive layer. 
 
     
     
       6. The method of  claim 2 , wherein at least one of:
 the access holes in the first insulating layer are dry milled; and 
 the access holes in the second insulating layer are dry milled. 
 
     
     
       7. The method of  claim 2 , wherein at least one of:
 the access holes in the first insulating layer are fly cut; and 
 the access holes in the second insulating layer are fly cut. 
 
     
     
       8. The method of  claim 2 , wherein at least one of:
 the access holes in the first insulating layer are laser ablated; and 
 the access holes in the second insulating layer are laser ablated. 
 
     
     
       9. The method of  claim 1 , wherein the first conductive layer and the second conductive layer comprise a material selected from a group consisting of copper and aluminum. 
     
     
       10. The method of  claim 1 , wherein the first insulating layer comprises a material selected from a group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI). 
     
     
       11. The method of  claim 1 , wherein the conductive material is selected from a group consisting of solder, conductive ink and conductive adhesive. 
     
     
       12. A method for manufacturing a dual conductor laminated substrate, comprising:
 providing a first laminate including a first insulating layer and a first conductive layer; 
 defining a first trace pattern including one or more traces in the first laminate; 
 attaching a second insulating layer including one or more access holes to the first laminate, the one or more access holes being in level with surfaces of the second insulating layer, wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer; 
 at least one of depositing and stenciling conductive material in the one or more access holes of the second insulating layer, the conductive material being in level with lower surface of the second insulating layer and lower portions of the one or more traces in the first laminate that are adiacent to the overhanging portions; 
 providing a second laminate including a second conductive layer and a third insulating layer; 
 defining a second trace pattern including one or more traces in the second laminate; and 
 aligning and attaching the second laminate to the second insulating layer. 
 
     
     
       13. The method of  claim 12 , further comprising at least one of:
 defining access holes in the first insulating layer; and 
 defining access holes in the third insulating layer. 
 
     
     
       14. The method of  claim 12 , further comprising at least one of:
 heating the conductive material to cause the conductive material to flow; and 
 curing the conductive material. 
 
     
     
       15. A method for manufacturing a dual conductor laminated substrate, comprising:
 providing a first laminate including a first insulating layer and a first conductive layer; 
 defining a first trace pattern including one or more traces in the first laminate; 
 attaching a second insulating layer including one or more access holes to the first laminate; 
 at least one of depositing and stenciling conductive material in the one or more access holes of the second insulating layer; 
 providing a second laminate including a second conductive layer and a third insulating laver; 
 defining a second trace pattern including one or more traces in the second laminate; and 
 aligning and attaching the second laminate to the second insulating layer; 
 wherein the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer; 
 wherein the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer; and 
 wherein the conductive material is in level with lower surface of the second insulating layer and lower portions of the one or more traces in the first laminate that are adjacent to the overhanging portions. 
 
     
     
       16. The method of  claim 12 , wherein at least one of:
 the first trace pattern is dry milled in the first laminate; and 
 the second trace pattern is dry milled in the second laminate. 
 
     
     
       17. The method of  claim 12 , further comprising defining access holes in the first insulating layer, wherein at least one of:
 the access holes in the first insulating layer are dry milled; and 
 the access holes in the second insulating layer are dry milled. 
 
     
     
       18. The method of  claim 12 , further comprising defining access holes in the first insulating layer, wherein at least one of:
 the access holes in the first insulating layer are fly cut; and 
 the access holes in the second insulating layer are fly cut. 
 
     
     
       19. The method of  claim 12 , further comprising defining access holes in the first insulating layer, wherein at least one of:
 the access holes in the first insulating layer are laser ablated; and 
 the access holes in the second insulating layer are laser ablated. 
 
     
     
       20. The method of  claim 12 , wherein the first conductive layer and the second conductive layer comprise a material selected from a group consisting of copper and aluminum. 
     
     
       21. The method of  claim 12 , wherein the first insulating layer and the second insulating layer comprise a material selected from a group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyimide (PI). 
     
     
       22. The method of  claim 12 , wherein the conductive material is selected from a group consisting of solder, conductive ink and conductive adhesive. 
     
     
       23. The method of  claim 12 , wherein:
 the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer; and 
 the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer. 
 
     
     
       24. The method of  claim 1 , wherein:
 the first trace pattern defines overhanging portions relative to at least one of the access holes in the second insulating layer; and 
 the conductive material is arranged in the at least one of the access holes between opposite ends of adjacent overhanging portions in the second insulating layer.