Electronic component and electronic component device

Abstract

An element body includes a principal surface arranged to constitute a mounting surface and a first side surface adjacent to the principal surface. An external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the first side surface. The first electrode portion includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second electrode portion includes a first region and a second region. The first region includes a sintered metal layer and a plating layer formed on the sintered metal layer. The second region includes a sintered metal layer, a conductive resin layer formed on the sintered metal layer, and a plating layer formed on the conductive resin layer. The second region is located closer to the principal surface than the first region.

The invention claimed is: 
     
       1. An electronic component comprising:
 an element body of a rectangular parallelepiped shape including a first principal surface arranged to constitute a mounting surface, a second principal surface opposing the first principal surface, and an end surface coupling the first and second principal surfaces; and 
 an external electrode including a sintered metal layer on the end surface and a conductive resin layer on the sintered metal layer, wherein 
 the conductive resin layer is located on the first principal surface over an edge of the sintered metal layer, 
 the sintered metal layer includes a first region exposed from the conductive resin layer and a second region covered with the conductive resin layer, when the sintered metal layer and the conductive resin layer are viewed from a direction orthogonal to the end surface, and 
 the first region is located closer to the second principal surface than the second region. 
 
     
     
       2. The electronic component according to  claim 1 ,
 wherein the conductive resin layer is in contact with the first principal surface. 
 
     
     
       3. The electronic component according to  claim 1 , wherein
 the element body includes a side surface adjacent to the first principal surface, the second principal surface, and the end surface, and 
 the conductive resin layer is located on the side surface. 
 
     
     
       4. The electronic component according to  claim 3 , wherein
 the sintered metal layer includes a third region exposed from the conductive resin layer and a fourth region covered with the conductive resin layer, when the sintered metal layer and the conductive resin layer are viewed from a direction orthogonal to the side surface, and 
 the third region is located closer to the second principal surface than the fourth region. 
 
     
     
       5. The electronic component according to  claim 3 , wherein
 the element body includes a ridge portion between the first principal surface and the side surface, and 
 the conductive resin layer is located on the ridge portion. 
 
     
     
       6. The electronic component according to  claim 1 ,
 wherein the second principal surface is exposed from the conductive resin layer.