Universal XYZ-axis leak sensor

Abstract

A liquid cooling subsystem and method of manufacturing a liquid cooling subsystem in an information handling system that includes a base plate, a heat exchanger mounted on the base plate, and an inlet coolant tube and outlet coolant tube operatively connected to the heat exchanger. The liquid cooling subsystem includes a liquid leak sensor disposed on the base plate that includes a main body and secondary body that each contain a plurality of sensing areas. The liquid cooling subsystem also includes electronic components for connecting and electrically detecting fluid on the plurality of sensing areas disposed on the main body. The liquid cooling subsystem also includes an opening in the main body that accommodates the heat exchanger and a split feature in the main body. The secondary body is connected to the main body along a foldable edge on an opposite side of the split feature.

What is claimed is: 
     
       1. A liquid cooling subsystem in an information handling system, comprising:
 a base plate; 
 a heat exchanger mounted on the base plate; 
 an inlet coolant tube and outlet coolant tube operatively connected to the heat exchanger; 
 a liquid leak sensor disposed on the base plate, the liquid leak sensor further comprising:
 a main body and secondary body, wherein the main body and secondary body each contain a plurality of sensing areas; 
 electronic components for connecting and electrically detecting fluid on the plurality of sensing areas disposed on the main body; 
 an opening in the main body, wherein the heat exchanger is disposed in the opening of the main body; and 
 a split feature in the main body; 
 wherein the secondary body is connected to the main body along a foldable edge on an opposite side of the split feature. 
 
 
     
     
       2. The liquid cooling subsystem of  claim 1 ,
 wherein a surface of the secondary body is substantially perpendicular to a surface of the main body when the secondary body is in a folded position. 
 
     
     
       3. The liquid cooling subsystem of  claim 1 , further comprising:
 a cover encasing the heat exchanger and liquid leak sensor, wherein the secondary body of the liquid leak sensor is parallel to at least one surface of the cover. 
 
     
     
       4. The liquid cooling subsystem of  claim 3 , wherein the cover comprises an inside surface that facilitates a flow of fluid towards the secondary body of the liquid leak sensor. 
     
     
       5. The liquid cooling subsystem of  claim 1 ,
 wherein the liquid leak sensor is a flexible printed circuit board (PCB). 
 
     
     
       6. The liquid cooling subsystem of  claim 1 ,
 wherein each of the plurality of sensing areas detects fluid using a transmitted waveform across the plurality of sensing areas and digital signal processing across the plurality of sensing areas. 
 
     
     
       7. The liquid cooling subsystem of  claim 1 ,
 wherein each of the plurality of sensing areas comprises a plurality of traces for detecting fluid. 
 
     
     
       8. A method of manufacturing a liquid cooling subsystem in an information handling system, the method comprising:
 obtaining a heat exchanger mounted on a base plate, wherein an inlet coolant tube and outlet coolant tube are operatively connected to the heat exchanger; 
 disposing a liquid leak sensor on the base plate using a split feature, the liquid leak sensor comprising:
 a main body and secondary body, wherein the main body and secondary body each contain a plurality of sensing areas, 
 
 wherein the liquid leak sensor comprises an opening in the main body, and the heat exchanger is disposed in the opening of the main body. 
 
     
     
       9. The method of  claim 8 , further comprising:
 disposing electronic components on the main body for connecting and electrically detecting fluid on the plurality of sensing areas. 
 
     
     
       10. The method of  claim 8 , further comprising:
 folding the secondary body to be substantially perpendicular to a surface of the main body. 
 
     
     
       11. The method of  claim 8 , further comprising:
 disposing a cover that encases the heat exchanger and liquid leak sensor, wherein the secondary body of the liquid leak sensor is parallel to at least one surface of the cover. 
 
     
     
       12. The method of  claim 11 , wherein the secondary body of the liquid leak sensor is fixed to at least one surface of the cover. 
     
     
       13. The method of  claim 8 , further comprising:
 transmitting a waveform across each of the plurality of sensing areas; and 
 digital signal processing the transmitted waveforms across the plurality of sensing areas to detect fluid on at least one sensing area. 
 
     
     
       14. The method of  claim 8 , wherein each of the plurality of sensing areas comprises a plurality of traces for detecting fluid. 
     
     
       15. A liquid leak sensor comprising:
 a main body and secondary body, wherein the main body and secondary body each contain a plurality of sensing areas; 
 electronic components for connecting and electrically detecting fluid on the plurality of sensing areas disposed on the main body; 
 an opening in the main body, wherein a heat exchanger is disposed in the opening of the main body; and 
 a split feature in the main body, 
 wherein the secondary body is connected to the main body along a foldable edge of the main body. 
 
     
     
       16. The liquid leak sensor of  claim 15 , wherein the secondary body is connected to the main body along a foldable edge on an opposite side of the split feature. 
     
     
       17. The liquid leak sensor of  claim 15 ,
 wherein a surface of the secondary body is substantially perpendicular to a surface of the main body when the secondary body is in a folded position. 
 
     
     
       18. The liquid leak sensor of  claim 15 ,
 wherein the liquid leak sensor is a flexible printed circuit board (PCB). 
 
     
     
       19. The liquid leak sensor of  claim 15 ,
 wherein each of the plurality of sensing areas detects fluid using a transmitted waveform across the plurality of sensing areas and digital signal processing across the plurality of sensing areas. 
 
     
     
       20. The liquid leak sensor of  claim 15 , wherein each of the plurality of sensing areas comprises a plurality of traces for detecting fluid.