Chemical mechanical polishing pad and chemical mechanical polishing apparatus including the same

Abstract

A chemical mechanical polishing (CMP) apparatus and a CMP pad, the apparatus including a rotating plate; a CMP pad on an upper surface of the rotating plate; a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and a slurry supply configured to supply slurry to the CMP pad, wherein the CMP pad includes a pad body having a circular plate shape; a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and a connection groove connecting the plurality of circular grooves, the connection groove having a linear shape.

What is claimed is: 
     
       1. A chemical mechanical polishing (CMP) apparatus, comprising:
 a rotating plate; 
 a CMP pad on an upper surface of the rotating plate; 
 a rotating body facing the rotating plate and bringing a wafer into contact with the CMP pad to press the wafer; and 
 a slurry supply configured to supply slurry to the CMP pad, 
 wherein the CMP pad includes: 
 a pad body having a circular plate shape; 
 a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; 
 a plurality of connection grooves connecting the plurality of circular grooves, the plurality of connection grooves each having a linear shape, 
 the plurality of circular grooves includes:
 a first circular groove in a central portion of the pad body, 
 a second circular groove having a greater diameter than that of the first circular groove, 
 a third circular groove outside of the second circular groove, 
 a fourth circular groove having a greater diameter than that of the third circular groove, and 
 a fifth circular groove at an edge of the pad body, 
 
 the plurality of connection grooves includes:
 a first connection groove connecting the first circular groove and the second circular groove, 
 a second connection groove connecting the second circular groove and the third circular groove, 
 a third connection groove connecting the third circular groove and the fourth circular groove, and 
 a fourth connection groove connecting the fourth circular groove and the fifth circular groove, 
 
 at least one of the first to fourth connection grooves is a radial connection groove extending along a line radial to at least one of the first to fourth circular grooves, 
 at least one other one of the first to fourth connection grooves is a tangential connection groove extending along a line tangential to at least one of the first to fourth circular grooves, 
 the at least one radial connection groove is spaced apart from the at least one tangential connection groove in a radial direction by one of the circular grooves, and 
 the first to fourth connection grooves alternate between being tangential connection grooves and radial connection grooves such that each tangential connection groove is radially adjacent to one of the radial connection grooves. 
 
     
     
       2. The CMP apparatus as claimed in  claim 1 , wherein the plurality of circular grooves are concentric. 
     
     
       3. The CMP apparatus as claimed in  claim 1 , wherein:
 the first connection groove is a radial connection groove extending along a line radial to the first circular groove, 
 the second connection groove is a tangential connection groove extending along a line tangential to the second circular groove, 
 the third connection groove is a radial connection groove extending along a line radial to the third circular groove, and 
 the fourth connection groove is a tangential connection groove extending along a line tangential to the fourth circular groove and is connected to the fifth circular groove. 
 
     
     
       4. A chemical mechanical polishing (CMP) pad, comprising:
 a pad body having a circular plate shape; 
 a plurality of circular grooves on a bottom surface of the pad body, the plurality of circular grooves having a circular shape; and 
 a plurality of connection grooves connecting the plurality of circular grooves, the plurality of connection grooves each having a linear shape, 
 wherein: 
 the plurality of circular grooves includes:
 a first circular groove in a central portion of the pad body, 
 a second circular groove having a greater diameter than that of the first circular groove, 
 a third circular groove outside of the second circular groove, 
 a fourth circular groove having a greater diameter than that of the third circular groove, and 
 a fifth circular groove at an edge of the pad body, 
 
 the plurality of connection grooves includes:
 a first connection groove connecting the first circular groove and the second circular groove, 
 a second connection groove connecting the second circular groove and the third circular groove, 
 a third connection groove connecting the third circular groove and the fourth circular groove, and 
 a fourth connection groove connecting the fourth circular groove and the fifth circular groove, 
 
 at least one of the first to fourth connection grooves is a radial connection groove extending along a line radial to at least one of the first to fourth circular grooves, 
 at least one other one of the first to fourth connection grooves is a tangential connection groove extending along a line tangential to at least one of the first to fourth circular grooves, 
 the at least one radial connection groove is spaced apart from the at least one tangential connection groove in a radial direction by one of the circular grooves, and 
 the first to fourth connection grooves alternate between being tangential connection grooves and radial connection grooves such that each tangential connection groove is radially adjacent to one of the radial connection grooves. 
 
     
     
       5. The CMP pad as claimed in  claim 4 , wherein the plurality of circular grooves are concentric. 
     
     
       6. The CMP pad as claimed in  claim 4 , wherein:
 the first connection groove is a radial connection groove extending along a line radial to the first circular groove, 
 the second connection groove is a tangential connection groove extending along a line tangential to the second circular groove, 
 the third connection groove is a radial connection groove extending along a line radial to the third circular groove, and 
 the fourth connection groove is a tangential connection groove extending along a line tangential to the fourth circular groove and is connected to the fifth circular groove.