Circuit board and display device including the same

Abstract

An apparatus includes a first circuit board, a driving chip, and a second circuit board. The driving chip is coupled to the first circuit board, and the second circuit board is spaced apart from and electrically connected to the driving chip. At least part of the second circuit board is spaced apart from a first surface of the first circuit board.

What is claimed is: 
     
       1. An apparatus, comprising:
 a first circuit board including first signal lines and second signal lines; 
 a driving chip coupled to the first circuit board; and 
 a second circuit board spaced apart from and electrically connected to the driving chip, wherein the second circuit board is a flexible circuit board and wherein at least part of the second circuit board is spaced apart from a first surface of the first circuit board in a bridge structure, each of the first signal lines has different sub-lines that are spaced apart from one another and located on different insulation layers, a portion of a second insulation layer having a smaller size than a first insulation layer to expose a portion of the first insulation layer, the exposed portion of the first insulation layer including a pad area. 
 
     
     
       2. The apparatus of  claim 1 , wherein at least part of the second circuit board which is spaced apart from the first surface of the first circuit board has a greater area than another part of the second circuit board that is coupled to the first circuit board. 
     
     
       3. The apparatus of  claim 1 , wherein the second circuit board comprises:
 a first part coupled to the first surface of the first circuit board; 
 a second part spaced apart from the first part and coupled to the first surface of the first circuit board; and 
 a third part between the first and second parts and separated from the first surface of the first circuit board by a space, the second signal lines passing through the space between the first surface of the first circuit board and the third part of the second circuit board. 
 
     
     
       4. The apparatus of  claim 3 , wherein the second signal lines are electrically insulated from the driving chip and are arranged on the first surface of the first circuit board, wherein at least part of the second signal lines overlap the third part. 
     
     
       5. The apparatus of  claim 1 , wherein the first signal lines are electrically connected to the driving chip and the pad area. 
     
     
       6. The apparatus of  claim 5 , wherein each of the first signal lines comprise:
 a first sensing line electrically connected to the pad area through the second circuit board; and 
 a second sensing line configured to receive a different electrical signal from the first sensing line and coupled to the pad area. 
 
     
     
       7. The apparatus of  claim 6 , wherein each of the first sensing lines comprise:
 a first sub-line configured to electrically connect the driving chip and the second circuit board, the first sub-line arranged on the first surface of the first circuit board; and 
 a second sub-line configured to electrically connect the second circuit board and the pad area, wherein the first sub-line and the second sub-line are arranged on different layers. 
 
     
     
       8. The apparatus of  claim 7 , wherein the second sub-line is arranged on a different layer from the driving chip and on a same layer as the pad area. 
     
     
       9. The apparatus of  claim 6 , wherein the second sensing line is arranged on a different layer from the driving chip and on a same layer as the pad area. 
     
     
       10. The apparatus of  claim 6 , wherein the first circuit board comprises:
 the first insulation layer; and 
 the second insulation layer arranged on the first insulation layer and comprising the driving chip and the second circuit board arranged thereon, wherein the first surface of the first circuit board corresponds to a first surface of the second insulation layer. 
 
     
     
       11. The apparatus of  claim 10 , wherein each of the first sensing lines comprise:
 a first sub-line configured to electrically connect one end of the second circuit board and the driving chip, the first sub-line arranged on the second insulation layer; and 
 a second sub-line configured to electrically connect another end of the second circuit board and the pad area, the second sub-line arranged on the first insulation layer. 
 
     
     
       12. The apparatus of  claim 5 , wherein the second signal lines are electrically insulated from each of the driving chip and the first signal lines, and wherein the second signal lines are arranged on the first surface of the first circuit board and are configured to be electrically connected to the pad area and wherein at least part of each of the second signal lines overlap a portion of the second circuit board. 
     
     
       13. The apparatus of  claim 1 , further comprising:
 the pad area electrically connected to the second circuit board; 
 wherein the first signal lines include a sensing line configured to electrically connect the driving chip and the pad area through the second circuit board. 
 
     
     
       14. The apparatus of  claim 13 , wherein each of the first sensing lines comprise:
 a first sub-line configured to electrically connect the driving chip and one end of the second circuit board, the first sub-line arranged on the first surface of the first circuit board; 
 a second sub-line arranged on a same layer as the first sub-line and electrically connected to another end of the second circuit board; and 
 a third sub-line configured to electrically connect the second sub-line and the pad area. 
 
     
     
       15. The apparatus of  claim 14 , wherein the third sub-line is arranged on a different layer from the second sub-line and on a same layer as the pad area. 
     
     
       16. The apparatus of  claim 1 , further comprising:
 an adhesive layer between the second circuit board and the first surface of the first circuit board. 
 
     
     
       17. A display device, comprising:
 a substrate; 
 a display element layer on the substrate; 
 an input sensing layer arranged on the display element layer and comprising a sensing electrode; and 
 a board arrangement coupled to one end of the substrate and comprising: 
 a first circuit board coupled to the one end of the substrate; 
 a driving chip coupled to the first circuit board and electrically connected to the sensing electrode; and 
 a second circuit board electrically connected to the driving chip and comprising an adhesion part arranged on a first surface of the first circuit board and a spaced part spaced apart from the first surface of the first circuit board, and wherein the display device further comprises: 
 a signal line electrically connected to the driving chip; and 
 a pad area configured to electrically connect the signal line and the sensing electrode, wherein the signal line comprises: 
 a first sub-line electrically connected to the second circuit board through a first contact hole in the first part; and 
 a second sub-line connected to the second circuit board through a second contact hole in the second part, and wherein the first sub-line and the second sub-line are arranged on different layers. 
 
     
     
       18. The display device of  claim 17 , wherein the spaced part has a greater area than the adhesion part. 
     
     
       19. The display device of  claim 17 , wherein:
 the adhesion part comprises a first part spaced apart from a second part, 
 the spaced part is between the first part and the second part, and 
 a space is between the spaced part and the first surface of the first circuit board. 
 
     
     
       20. An apparatus, comprising:
 a first circuit board including first signal lines and second signal lines; 
 a chip coupled to the first circuit board; and 
 a second circuit board electrically connected to the chip, 
 wherein the second circuit board includes a first area coupled to a first location of the first circuit board and a second area coupled to a second location of the first circuit board, the first location and the second location on a same surface of the first circuit board, and wherein the second circuit board includes a third area between the first area and the second area, the third area spaced from the same surface of the first circuit board and including one or more first signal lines, and wherein the first circuit board includes one or more second signal lines overlapping the one or more first signal lines of the second circuit board, and wherein each of the first signal lines has different sub-lines that are spaced apart from one another and are located on different insulation layers, a portion of a second insulation layer having a smaller size than a first insulation layer to expose a portion of the first insulation layer, the exposed portion of the first insulation layer including a pad area. 
 
     
     
       21. The apparatus of  claim 20 , wherein:
 the one or more first signal lines are configured to carry corresponding signals to the chip through a first pad area or are configured to carry corresponding signals from the chip to a second pad area, the first and second pad areas on the second circuit board.