Curved imaging sensor package with architected substrate

Abstract

An imaging sensor package includes: an imaging sensor; and an architected substrate coupled to a bottom surface of the imaging sensor. The architected substrate has local stiffness variations along an in-plane direction of the architected substrate, and the imaging sensor and the architected substrate are curved.

What is claimed is: 
     
       1. An imaging sensor package comprising:
 an imaging sensor comprising a detector, the detector comprising a plurality of light sensing elements; and 
 an architected substrate coupled to a bottom surface of the imaging sensor, the architected substrate having openings extending entirely therethrough from a surface contacting the bottom surface of the imaging sensor to an opposite surface thereof to form local stiffness variations along an in-plane direction of the architected substrate, 
 wherein the imaging sensor and the architected substrate are curved, and 
 wherein the openings in the architected substrate overlap with the light sensing element in a stacking direction from the architected substrate to the imaging sensor. 
 
     
     
       2. The imaging sensor package of  claim 1 , wherein the imaging sensor further comprises a readout integrated circuit and an antireflective coating, and
 wherein the detector is arranged between the readout integrated circuit and the antireflective coating. 
 
     
     
       3. The imaging sensor package of  claim 2 , wherein the imaging sensor and the architected substrate are spherically curved. 
     
     
       4. The imaging sensor package of  claim 3 , wherein the architected substrate has thickness variations along the in-plane direction thereof. 
     
     
       5. The imaging sensor package of  claim 4 , wherein the architected substrate has a plurality of discontinuous portions. 
     
     
       6. An imaging sensor package comprising:
 an imaging sensor; and 
 an architected substrate coupled to a bottom surface of the imaging sensor, the architected substrate having local stiffness variations along an in-plane direction of the architected substrate, 
 wherein the imaging sensor and the architected substrate are curved, and 
 wherein the architected substrate comprises a plurality of sandwich panels with a core between the sandwich panels. 
 
     
     
       7. The imaging sensor package of  claim 6 , wherein the core comprises a plurality of core members extending between the sandwich panels. 
     
     
       8. The imaging sensor package of  claim 7 , wherein the core members are arranged in a prismatic, lattice, or stochastic form. 
     
     
       9. The imaging sensor package of  claim 7 , wherein an outermost one of the sandwich panels has openings therein. 
     
     
       10. The imaging sensor package of  claim 9 , wherein an innermost one of the sandwich panels is continuous along the bottom surface of the imaging sensor. 
     
     
       11. A curved imaging sensor package comprising:
 a curved imaging sensor comprising a detector and a readout integrated circuit below the detector, the detector comprising a plurality of light detecting elements spaced from each other; and 
 a curved architected substrate coupled to a surface of the readout integrated circuit opposite to the detector, the architected substrate having local stiffness variations along an in-plane direction of the architected substrate, 
 wherein the imaging sensor is wrinkled, and 
 wherein a wavelength of the wrinkles is less than a pitch of the light detecting elements. 
 
     
     
       12. The curved image sensor package of  claim 11 , wherein the wavelength of the wrinkles is less than a size of the light detecting elements. 
     
     
       13. The curved image sensor package of  claim 11 , wherein an amplitude of the wrinkles is less than twice the pitch of the light detecting elements. 
     
     
       14. The curved image sensor package of  claim 11 , wherein the architected substrate comprises a plurality of different materials. 
     
     
       15. The curved image sensor package of  claim 14 , wherein the different materials are stacked on each other in layers. 
     
     
       16. The curved image sensor package of  claim 14 , wherein the different materials are adjacent to each other in the in-plane direction. 
     
     
       17. The curved image sensor package of  claim 14 , wherein the materials are mixed together at a portion of the architected substrate. 
     
     
       18. The curved image sensor package of  claim 14 , wherein the materials comprise aluminum, copper, nickel, iron, invar, steel, titanium, molybdenum, tungsten, and/or bismuth. 
     
     
       19. The curved image sensor package of  claim 11 , wherein the imaging sensor has a diagonal length of at least 55 mm. 
     
     
       20. A method of manufacturing an imaging sensor package, the method comprising:
 forming an architected substrate to have openings extending entirely therethrough from a surface contacting a bottom surface of an imaging sensor to an opposite surface thereof to form local stiffness variations along an in-plane direction of the architected substrate; 
 coupling the architected substrate to the bottom surface of the imaging sensor; and 
 curving the imaging sensor with the architected substrate coupled thereto, 
 wherein the imaging sensor comprises a detector, the detector comprising a plurality of light sensing elements, and 
 wherein the openings in the architected substrate overlap with the light sensing element in a stacking direction from the architected substrate to the imaging sensor.