Circuit structure

Abstract

Provided is a circuit structure having a novel structure with which the dissipation of heat from a heat generating component can be more reliably promoted with a short heat transfer path. A circuit structure includes: a heat generating component; bus bars connected to connection portions of the heat generating component; an insulating base member configured to hold the heat generating component and the bus bars; and a coolant flow path provided inside the base member and through which a coolant flows, the bus bars being in thermal contact with the coolant flow path.

The invention claimed is: 
     
       1. A circuit structure comprising:
 a heat generating component; 
 a bus bar connected to a connection portion of the heat generating component; 
 an insulating base member configured to hold the heat generating component and the bus bar; and 
 a coolant flow path provided inside the base member and through which a coolant flows, 
 wherein the bus bar is in thermal contact with the coolant flow path, 
 the base member includes a passage wall portion constituting the coolant flow path, and the bus bar is brought into thermal contact with the coolant flow path due to a portion of the bus bar being embedded or press-fitted into the passage wall portion, and 
 the passage wall portion includes a groove through which the coolant flows and a protruding portion that protrudes into the groove, the protruding portion includes a slit-shaped bus bar housing groove that is open in the upper surface thereof that does not face the groove, and the bus bar is press-fitted into the bus bar housing groove. 
 
     
     
       2. The circuit structure according to  claim 1 ,
 wherein the base member includes a lower case including a lower passage wall portion and an upper case including an upper passage wall portion that is linked in a liquid-tight manner to the lower passage wall portion, and the coolant flow path is formed by including the lower passage wall portion and the upper passage wall portion linked to each other in a liquid-tight manner. 
 
     
     
       3. The circuit structure according to  claim 2 ,
 wherein the upper passage wall portion includes a lid portion configured to cover the lower passage wall portion. 
 
     
     
       4. The circuit structure according to  claim 2 ,
 wherein at least one of the lower passage wall portion and the upper passage wall portion is configured to include a sealing rubber housing groove for housing a piece of sealing rubber, and due to the sealing rubber being compressed and brought into close contact with the sealing rubber housing groove, the lower passage wall portion and the upper passage wall portion are linked in a liquid-tight manner. 
 
     
     
       5. The circuit structure according to  claim 1 ,
 wherein a coolant input/output portion is provided protruding from the base member, one end portion of the coolant input/output portion being connected to the coolant flow path, and the other end portion being connected to an external coolant supply path.