Antenna-on-package integrated circuit device

Abstract

An integrated circuit package is provided. In some examples, the integrated circuit package is an antenna-on-package package that includes an integrated circuit die and an antenna substrate coupled to the integrated circuit die. The antenna substrate includes a conductor layer and a first dielectric layer disposed between the conductor layer and the integrated circuit die. The conductor layer includes antennas electrically coupled to the integrated circuit die. The integrated circuit package further includes an I/O substrate coupled to the integrated circuit die opposite the antenna substrate. In some such examples, the I/O substrate includes interconnect connectors and a second dielectric layer disposed between the interconnect connectors and the integrated circuit die. In some such examples, the integrated circuit package includes interconnect connectors extending between the antenna substrate and the I/O substrate.

What is claimed is: 
     
       1. An integrated circuit package comprising:
 an antenna substrate including a first dielectric layer, and a plurality of conductor layers including a first conductor layer, a transmitter antenna formed by the first conductor layer, a receiver antenna formed by the first conductor layer, a second conductor layer disposed on a first side of the first dielectric layer and a third conductor layer disposed on a second side of the first dielectric layer, the second side being opposite the first side; 
 an electromagnetic bandgap structure formed in part by the first, second and third conductor layers, a portion of the electromagnetic bandgap structure that is formed by the first conductor layer being disposed between the transmitter antenna and the receiver antenna; 
 an I/O substrate including a second dielectric layer and a second set of package connectors disposed on the second dielectric layer; 
 a first set of package connectors that physically and electrically couple the antenna substrate to the I/O substrate; and 
 an integrated circuit die disposed alongside the first set of package connectors; 
 wherein the integrated circuit die and the first set of package connectors are positioned between the antenna substrate and the I/O substrate; 
 wherein the integrated circuit die includes a bond pad positioned on a first side of the integrated circuit die, and the bond pad is coupled to the second side of the first dielectric layer; 
 wherein the bond pad is electrically connected to the first conductor layer; 
 wherein the antenna substrate is coupled to the first side of the integrated circuit die; 
 wherein the first dielectric layer positioned between the integrated circuit die and the first conductor layer that forms the transmitter antenna and the receiver antenna; and 
 wherein the second dielectric layer is positioned between the second set of the package connectors and the integrated circuit die. 
 
     
     
       2. The integrated circuit package of  claim 1 , wherein the first conductor layer includes transmitter antennas including the transmitter antenna and receiver antennas including the receiver antenna arranged in a multi-input multi-output array. 
     
     
       3. The integrated circuit package of  claim 2 , wherein the transmitter antennas are arranged in a first multi-dimensional array and the receiver antennas are arranged in a second multi-dimensional array. 
     
     
       4. The integrated circuit package of  claim 2 , wherein the first conductor layer is coupled to the second conductor layer by a first via, and the second conductor layer is coupled to the third conductor layer by a second via. 
     
     
       5. The integrated circuit package of  claim 1 , wherein at least one of the transmitter antenna and the receiver antenna has:
 a center portion; 
 a first side portion partially separated from the center portion by a first recess; and 
 a second side portion partially separated from the center portion by a second recess. 
 
     
     
       6. The integrated circuit package of  claim 1 , wherein the first set of package connectors includes at least one of: a ball grid array connector, a land grid array connector, a pin grid array connector, or a surface-mount lead. 
     
     
       7. The integrated circuit package of  claim 6 , wherein the second set of package connectors includes at least one of: a ball grid array connector, a land grid array connector, a pin grid array connector, or a surface-mount lead. 
     
     
       8. The integrated circuit package of  claim 1  further comprising a mold compound disposed between the antenna substrate and the I/O substrate,
 wherein the mold compound is disposed between the first set of package connectors and the integrated circuit die. 
 
     
     
       9. The integrated circuit package of  claim 8 , wherein the mold compound further extends between the integrated circuit die and the I/O substrate. 
     
     
       10. The integrated circuit package of  claim 2 ,
 wherein the transmitter antenna is a first transmitter antenna of the transmitter antennas and is offset from a second transmitter antenna of the transmitter antennas in a first direction, and 
 wherein the first transmitter antenna is offset from a third transmitter antenna of the transmitter antennas in a second direction perpendicular to the first direction. 
 
     
     
       11. The integrated circuit package of  claim 2 ,
 wherein the receiver antenna is a first receiver antenna of the receiver antennas and is offset from a second receiver antenna of the receiver antennas in a first direction, and 
 wherein the first receiver antenna is offset from a third receiver antenna of the receiver antennas in a second direction perpendicular to the first direction. 
 
     
     
       12. The integrated circuit package of  claim 1 , wherein the bond pad of the integrated circuit die is physically coupled to the antenna substrate.