Sensor arrangement having a temperature sensor element and method for its production

Abstract

A sensor arrangement includes a temperature sensor element, a connection device electrically connecting the sensor arrangement to an external device, a plurality of electrical lines electrically connecting the temperature sensor element to the connection device, a carrier holding the temperature sensor element and the electrical lines, and an encasing enclosing the temperature sensor element. The carrier has a measuring portion. The electrical lines are arranged directly on the carrier or on a separate line carrier arranged on the carrier. The electrical lines have a cross-sectional area equal to or less than 0.08 mm 2 .

What is claimed is: 
     
       1. A sensor arrangement, comprising:
 a temperature sensor element; 
 a connection device electrically connecting the sensor arrangement to an external device; 
 a plurality of electrical lines electrically connecting the temperature sensor element to the connection device; 
 a carrier holding the temperature sensor element and the electrical lines, the carrier having a measuring portion, the electrical lines are arranged directly on the carrier or on a separate line carrier arranged on the carrier, the electrical lines have a cross-sectional area equal to or less than 0.08 mm 2 ; and 
 an encasing enclosing the temperature sensor element. 
 
     
     
       2. The sensor arrangement of  claim 1 , wherein the electrical lines are formed as a circuit spatially integrated on at least one of the carrier, the separate line carrier, and an at least partially flexible printed circuit board. 
     
     
       3. The sensor arrangement of  claim 1 , wherein the electrical lines are formed as a leadframe mounted on the carrier. 
     
     
       4. The sensor arrangement of  claim 1 , further comprising a plurality of contact surfaces connecting the electrical lines to the temperature sensor element and/or to the connection device. 
     
     
       5. The sensor arrangement of  claim 1 , wherein the carrier is formed of a plastic material. 
     
     
       6. The sensor arrangement of  claim 5 , wherein the plastic material has a thermal conductivity of 5*10-6 m 2 /s or less, relative to 20° C., at least in the measuring portion. 
     
     
       7. The sensor arrangement of  claim 6 , wherein a thermal conductivity of the encasing is at least half an order of magnitude higher than the thermal conductivity of the plastic material. 
     
     
       8. The sensor arrangement of  claim 1 , wherein the carrier is formed in a plurality of parts. 
     
     
       9. The sensor arrangement of  claim 1 , wherein the carrier has the measuring portion at a first end and a connection portion at a second end spaced apart from the first end. 
     
     
       10. The sensor arrangement of  claim 1 , further comprising a pressure sensor. 
     
     
       11. The sensor arrangement of  claim 10 , further comprising a board having a plurality of electronic components using the temperature sensor element, the board is part of the pressure sensor. 
     
     
       12. The sensor arrangement of  claim 10 , wherein the carrier extends through a pressure channel of the pressure sensor and does not close the pressure channel. 
     
     
       13. The sensor arrangement of  claim 12 , wherein the temperature sensor element is located outside a pressure port of the pressure sensor. 
     
     
       14. A measuring arrangement with a wall limiting a volume or a volume flow of a medium, comprising:
 a sensor arrangement including a temperature sensor element, a connection device electrically connecting the sensor arrangement to an external device, a plurality of electrical lines electrically connecting the temperature sensor element to the connection device, a carrier holding the temperature sensor element and the electrical lines, the carrier having a measuring portion and a measuring head, and an encasing enclosing the temperature sensor element, the measuring head protrudes through the wall into the volume, the temperature sensor element has a t90 response time for a liquid medium or for a gaseous medium exhibiting currents in a range from greater than 10 seconds to approximately 100 seconds, and in the case of a liquid medium exhibiting currents in a range from one to 10 seconds. 
 
     
     
       15. A method for producing a sensor arrangement, comprising:
 providing a temperature sensor element, a carrier, and a connection device electrically connecting the sensor arrangement to an external device; 
 assembling the temperature sensor element on the carrier; 
 forming a plurality of electrical lines on the carrier, the electrical lines electrically connecting the temperature sensor element to the connection device, the electrical lines have a cross-sectional area equal to or less than 0.08 mm 2  and at least in portions follow a shape of the carrier; and 
 encasing the temperature sensor element with a thermally conductive material. 
 
     
     
       16. The method of  claim 15 , wherein the electrical lines are formed directly on the carrier or on a separate line carrier mounted on the carrier. 
     
     
       17. The method of  claim 16 , wherein the electrical lines are formed by at least one of:
 additive and subtractive laser direct structuring of the carrier for the production of line structures directly on the carrier; 
 two-component injection molding with the formation of the carrier as a pre-molded part and subsequently forming the electrical lines on the pre-molded part; 
 hot stamping the electrical lines on the carrier or on the separate line carrier; 
 back injection molding the carrier or the separate line carrier with the electrical lines; 
 forming the electrical lines on an at least partially flexible circuit board; and 
 production of a leadframe. 
 
     
     
       18. The method of  claim 16 , wherein the carrier has a plurality of contact surfaces contacting the electrical lines directly or by the separate line carrier.